Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab (Englisch)
Nationallizenz
- Neue Suche nach: E Skup
- Neue Suche nach: M Trimpl
- Neue Suche nach: R Yarema
- Neue Suche nach: J C Yun
- Neue Suche nach: E Skup
- Neue Suche nach: M Trimpl
- Neue Suche nach: R Yarema
- Neue Suche nach: J C Yun
In:
Journal of Instrumentation
;
4
, 11
;
T11001
;
2009
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at Fermilab
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Beteiligte:
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Erschienen in:Journal of Instrumentation ; 4, 11 ; T11001
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Verlag:
- Neue Suche nach: Institute of Physics
-
Erscheinungsdatum:01.11.2009
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis – Band 4, Ausgabe 11
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-
Demonstration of fine pitch FCOB (Flip Chip on Board) assembly based on solder bumps at FermilabE Skup / M Trimpl / R Yarema / J C Yun et al. | 2009