Mechanical stress and deformation of SMT components during temperature cycling and PCB bending (Englisch)
- Neue Suche nach: Kühl, Reiner W.
- Neue Suche nach: Kühl, Reiner W.
In:
Soldering & surface mount technology
;
11
, 2
; 35-41
;
1999
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Mechanical stress and deformation of SMT components during temperature cycling and PCB bending
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Beteiligte:Kühl, Reiner W. ( Autor:in )
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Erschienen in:Soldering & surface mount technology ; 11, 2 ; 35-41
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Verlag:
- Neue Suche nach: MCB University Press
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Erscheinungsort:Bradford
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Erscheinungsdatum:1999
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ISSN:
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ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 53.53 / 52.82
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 275/5240
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 11, Ausgabe 2
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