Interfacial study of polyimide-copper system using silane-modified polyvinylimidazoles as adhesion promoters (Unbekannt)
- Neue Suche nach: Jang, J.
- Neue Suche nach: Jang, J.
- Neue Suche nach: Earmme, T.
In:
Polymer
;
42
, 7
; 2871-2876
;
2001
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Interfacial study of polyimide-copper system using silane-modified polyvinylimidazoles as adhesion promoters
-
Beteiligte:Jang, J. ( Autor:in ) / Earmme, T.
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Erschienen in:Polymer ; 42, 7 ; 2871-2876
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Verlag:
- Neue Suche nach: Elsevier Science
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Erscheinungsort:Oxford
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Erscheinungsdatum:2001
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ISSN:
-
ZDBID:
-
Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Unbekannt
- Neue Suche nach: 275/3675
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 42, Ausgabe 7
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