Novel Copper Electroless Plating Process on Ceramic Substrate Using Copper Oxide Particles (Englisch)
- Neue Suche nach: Yanagimoto, H.
- Neue Suche nach: Yanagimoto, H.
- Neue Suche nach: Akamatsu, K.
- Neue Suche nach: Deki, S.
- Neue Suche nach: Gotoh, K.
In:
Electrochemical and solid-state letters
;
5
, 9
; 87
;
2002
-
ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Novel Copper Electroless Plating Process on Ceramic Substrate Using Copper Oxide Particles
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Beteiligte:
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Erschienen in:Electrochemical and solid-state letters ; 5, 9 ; 87
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Verlag:
- Neue Suche nach: Soc.
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Erscheinungsort:Pennington, NJ
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Erscheinungsdatum:2002
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Anmerkungen:(c) British Library
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ISSN:
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ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 35.14 / 35.90 / 35.90 / 35.14
- Weitere Informationen zu Basisklassifikation
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Klassifikation:
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Datenquelle:
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