Ablation and cutting of planar silicon devices using femtosecond laser pulses (Englisch)
- Neue Suche nach: Bärsch, N.
- Neue Suche nach: Bärsch, N.
- Neue Suche nach: Körber, K.
- Neue Suche nach: Ostendorf, A.
- Neue Suche nach: Tönshoff, K.H.
In:
Applied physics / A
;
77
, 2
; 237-242
;
2003
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Ablation and cutting of planar silicon devices using femtosecond laser pulses
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Beteiligte:
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Erschienen in:Applied physics / A ; 77, 2 ; 237-242
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Verlag:
- Neue Suche nach: Springer
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Erscheinungsort:Berlin
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Erscheinungsdatum:2003
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ISSN:
-
ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 51.00 / 33.60 / 53.09
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 020/3475/3485
-
Schlagwörter:
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Klassifikation:
BKL: 51.00 Werkstoffkunde: Allgemeines / 33.60 Kondensierte Materie: Allgemeines / 53.09 Werkstoffe der Elektrotechnik Lokalklassifikation TIB: 020/3475/3485 -
Datenquelle:
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