2007 IEEE Conference on Electron Devices and Solid-State Circuits (Englisch)
In:
Journal of microelectromechanical systems
;
16
, 3
; 775
;
2007
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:2007 IEEE Conference on Electron Devices and Solid-State Circuits
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Erschienen in:Journal of microelectromechanical systems ; 16, 3 ; 775
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsort:New York, NY
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Erscheinungsdatum:2007
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ISSN:
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ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 50.94
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 770/5600
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 16, Ausgabe 3
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 491
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Dynamic Cell and Microparticle Control via Optoelectronic TweezersOhta, A.T. / Pei-Yu Chiou, / Han, T.H. / Liao, J.C. / Bhardwaj, U. / McCabe, E.R.B. / Fuqu Yu, / Ren Sun, / Wu, M.C. et al. | 2007
- 500
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Thermal and Optical Characterization of Silicon-Based Tunable Optical Thin-Film FiltersHohlfeld, D. / Zappe, H. et al. | 2007
- 511
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A Novel Coilless Scanning Mirror Using Eddy Current Lorentz Force and Magnetostatic ForceHsueh-An Yang, / Tsung-Lin Tang, / Sheng Ta Lee, / Weileun Fang, et al. | 2007
- 521
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A 1-D Photonic Band Gap Tunable Optical Filter in (110) SiliconLipson, A. / Yeatman, E.M. et al. | 2007
- 528
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High-Accuracy Digital-to-Analog Actuators Using Load Springs Compensating Fabrication ErrorsWon Han, / Won Chul Lee, / Young-Ho Cho, et al. | 2007
- 537
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Command-Shaping Techniques for Electrostatic MEMS Actuation: Analysis and SimulationKuo-Shen Chen, / Kuang-Shun Ou, et al. | 2007
- 550
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Novel Reliable RF Capacitive MEMS Switches With Photodefinable Metal–Oxide DielectricsGuoan Wang, / Romeo, M. / Henderson, C. / Papapolymerou, J. et al. | 2007
- 556
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A Polymer-Based Flexible Tactile Sensor for Both Normal and Shear Load Detections and Its Application for RoboticsEun-Soo Hwang, / Jung-hoon Seo, / Yong-Jun Kim, et al. | 2007
- 564
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LF55GN Photosensitive Flexopolymer: A New Material for Ultrathick and High-Aspect-Ratio MEMS FabricationSayah, A. / Parashar, V.K. / Gijs, M.A.M. et al. | 2007
- 571
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Laser Bonding of Glass to Silicon Using Polymer for Microsystems PackagingBardin, F. / Kloss, S. / Changhai Wang, / Moore, A.J. / Jourdain, A. / De Wolf, I. / Hand, D.P. et al. | 2007
- 581
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Optimal Conditions for Micromachining Si~1~-~xGe~x at 210 ^oCSedky, S. / Bayoumy, A. / Alaa, A. / Nagy, A. / Witvrouw, A. et al. | 2007
- 581
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Optimal Conditions for Micromachining $\hbox{Si}_{1 - { \rm x}}\hbox{Ge}_{\rm x}$ at 210 $^{\circ}\hbox{C}$Sedky, S. / Bayoumy, A. / Alaa, A. / Nagy, A. / Witvrouw, A. et al. | 2007
- 581
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Optimal Conditions for Micromachining Si1-xGex at 210 (degree)CSedky, S. et al. | 2007
- 581
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Optimal conditions for micromachining Si1-xGex at 210 deg CSedky, S. / Bayoumy, A. / Alaa, A. / Nagy, A. / Witvrouw, A. et al. | 2007
- 589
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Study of Hot Embossing Using Nickel and Ni–PTFE LIGA Mold InsertsYuhua Guo, / Gang Liu, / Ying Xiong, / Jun Wang, / Xinlong Huang, / Yangchao Tian, et al. | 2007
- 598
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Precision Hand Assembly of MEMS Subsystems Using DRIE-Patterned Deflection Spring Structures: An Example of an Out-of-Plane Substrate AssemblyVelasquez-Garcia, L.F. / Akinwande, A.I. / Martinez-Sanchez, M. et al. | 2007
- 613
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Development of Three-Dimensional Microstages Using Inclined Deep-Reactive Ion EtchingAndo, Y. / Ikehara, T. / Matsumoto, S. et al. | 2007
- 622
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Poisson's Ratio of Low-Temperature PECVD Silicon Nitride Thin FilmsWalmsley, B.A. / Yinong Liu, / Xiao Zhi Hu, / Bush, M.B. / Dell, J.M. / Faraone, L. et al. | 2007
- 628
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Computationally Efficient Approaches to Characterize the Dynamic Response of Microstructures Under Mechanical ShockYounis, M.I. / Jordy, D. / Pitarresi, J.M. et al. | 2007
- 639
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Accurate Assessment of Packaging Stress Effects on MEMS Sensors by Measurement and Sensor–Package Interaction SimulationsXin Zhang, / Seungbae Park, / Judy, M.W. et al. | 2007
- 650
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A MEMS-Based Evaluation of the Mechanical Properties of Metallic Thin FilmsReddy, A. / Kahn, H. / Heuer, A.H. et al. | 2007
- 659
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A Nondestructive Dynamic Characterization of a Microheater Through Digital Holographic MicroscopyCoppola, G. / Striano, V. / Ferraro, P. / De Nicola, S. / Finizio, A. / Pierattini, G. / Maccagnani, P. et al. | 2007
- 668
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Stroboscopic Imaging Interferometer for MEMS Performance MeasurementConway, J.A. / Osborn, J.V. / Fowler, J.D. et al. | 2007
- 675
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Bulk-Micromachined Test Structure for Fast and Reliable Determination of the Lateral Thermal Conductivity of Thin FilmsLa Spina, L. / van Herwaarden, A.W. / Schellevis, H. / Wien, W.H.A. / Nenadovic, N. / Nanver, L.K. et al. | 2007
- 684
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Snap-Through and Pull-In Instabilities of an Arch-Shaped Beam Under an Electrostatic LoadingYin Zhang, / Yisong Wang, / Zhihong Li, / Yubo Huang, / Dachao Li, et al. | 2007
- 694
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Recommendations for the Use of an Atomic Force Microscope as an In-Fab Stiction MonitorThoreson, E.J. / Martin, J. / Burnham, N.A. et al. | 2007
- 700
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Microrelays With Bidirectional Electrothermal Electromagnetic Actuators and Liquid Metal Wetted ContactsCao, A. / Yuen, P. / Liwei Lin, et al. | 2007
- 709
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A Multiaxis Force Sensor for the Study of Insect BiomechanicsBartsch, M.S. / Federle, W. / Full, R.J. / Kenny, T.W. et al. | 2007
- 719
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A Low-Power-Consumption Out-of-Plane Electrothermal ActuatorGirbau, D. / Llamas, M.A. / Casals-Terre, J. / Simo-Selvas, X. / Pradell, L. / Lazaro, A. et al. | 2007
- 728
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Binary Mixtures of n-Alkanes for Tunable Thermohydraulic MicroactuatorsLehto, M. / Schweitz, J.-A. / Thomell, G. et al. | 2007
- 734
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Bubble Dynamics for Explosive Microthermal Dual BubblesI-Da Yang, / Fangang Tseng, / Ru-Ji Yu, / Ching-Chang Chieng, et al. | 2007
- 746
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Versatile Method of Submicroparticle Pattern Formation Using Self-Assembly and Two-Step TransferOzaki, T. / Sugano, K. / Tsuchiya, T. / Tabata, O. et al. | 2007
- 753
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Microelectrostrictive Actuator With Large Out-of-Plane Deformation for Flow-Control ApplicationPimpin, A. / Suzuki, Y. / Kasagi, N. et al. | 2007
- 765
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A Low-Temperature Thermopneumatic Actuation Principle for Gas Bubble Microvalvesvan der Wijngaart, W. / Chugh, D. / Man, E. / Melin, J. / Stemme, G. et al. | 2007
- 775
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2007 IEEE Conference on Electron Devices and Solid-State Circuits| 2007
- 776
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International Semiconductor Conference| 2007
- 776
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International Semiconductor Conference 2007| 2007
- C1
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Table of contents| 2007
- C2
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Journal of Microelectromechanical Systems publication information| 2007
- C3
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Journal of Microelectromechanical Systems Information for authors| 2007