A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding (Unbekannt)
- Neue Suche nach: Kim, B.-H.
- Neue Suche nach: Kim, B.-H.
- Neue Suche nach: Kim, J.-B.
- Neue Suche nach: Kim, J.-H.
In:
IEEE transactions on industrial electronics
;
56
, 4
; 1079-1085
;
2009
-
ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:A Highly Manufacturable Large Area Array MEMS Probe Card Using Electroplating and Flipchip Bonding
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Beteiligte:
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Erschienen in:IEEE transactions on industrial electronics ; 56, 4 ; 1079-1085
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Verlag:
- Neue Suche nach: IEEE
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Erscheinungsort:New York, NY
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Erscheinungsdatum:2009
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ISSN:
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ZDBID:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Unbekannt
- Neue Suche nach: 770/5670
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 56, Ausgabe 4
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