Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon (Englisch)
- Neue Suche nach: Wang, Liang
- Neue Suche nach: Wang, Liang
- Neue Suche nach: Liu, Qunfeng
- Neue Suche nach: Shen, Shengping
In:
Engineering fracture mechanics
;
146
; 56-66
;
2015
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ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Effects of void–crack interaction and void distribution on crack propagation in single crystal silicon
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Beteiligte:
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Erschienen in:Engineering fracture mechanics ; 146 ; 56-66
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Verlag:
- Neue Suche nach: Elsevier Science
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Erscheinungsort:Kidlington
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Erscheinungsdatum:2015
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ISSN:
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ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 770/5110
- Neue Suche nach: 51.32 / 51.32
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
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Datenquelle:
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