Preparation and conductive mechanism of copper nanoparticles ink (Englisch)
- Neue Suche nach: Yang, Wendong
- Neue Suche nach: Liu, Chunyan
- Neue Suche nach: Zhang, Zhiying
- Neue Suche nach: Liu, Yun
- Neue Suche nach: Nie, Shidong
- Neue Suche nach: Yang, Wendong
- Neue Suche nach: Liu, Chunyan
- Neue Suche nach: Zhang, Zhiying
- Neue Suche nach: Liu, Yun
- Neue Suche nach: Nie, Shidong
In:
Journal of Materials Science: Materials in Electronics
;
24
, 12
; 5175-5182
;
2013
-
ISSN:
- Aufsatz (Zeitschrift) / Print
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Titel:Preparation and conductive mechanism of copper nanoparticles ink
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Beteiligte:Yang, Wendong ( Autor:in ) / Liu, Chunyan ( Autor:in ) / Zhang, Zhiying ( Autor:in ) / Liu, Yun ( Autor:in ) / Nie, Shidong ( Autor:in )
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Erschienen in:Journal of Materials Science: Materials in Electronics ; 24, 12 ; 5175-5182
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Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: Springer
-
Erscheinungsort:Norwell, Mass.
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Erscheinungsdatum:2013
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ISSN:
-
ZDBID:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 275/5620
- Neue Suche nach: 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 24, Ausgabe 12
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