Thermo-mechanical analysis of advanced electronic packages in early system design (Englisch)
- Neue Suche nach: Sommer, Johann-Peter
- Neue Suche nach: Wittler, Olaf
- Neue Suche nach: Manessis, Dionysios
- Neue Suche nach: Michel, Bernd
- Neue Suche nach: Sommer, Johann-Peter
- Neue Suche nach: Wittler, Olaf
- Neue Suche nach: Manessis, Dionysios
- Neue Suche nach: Michel, Bernd
In:
Microsystem Technologies
;
12
, 1-2
; 75-81
;
2005
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Thermo-mechanical analysis of advanced electronic packages in early system design
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Beteiligte:Sommer, Johann-Peter ( Autor:in ) / Wittler, Olaf ( Autor:in ) / Manessis, Dionysios ( Autor:in ) / Michel, Bernd ( Autor:in )
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Erschienen in:Microsystem Technologies ; 12, 1-2 ; 75-81
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Verlag:
- Neue Suche nach: Springer-Verlag
- Neue Suche nach: Springer
-
Erscheinungsort:Berlin
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Erscheinungsdatum:2005
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ISSN:
-
ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 50.94
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
BKL: 50.94 Mikrosystemtechnik, Nanotechnologie -
Datenquelle:
Inhaltsverzeichnis – Band 12, Ausgabe 1-2
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