Changes in the microstructure of materials and their impact on reliability: experiments and modeling (Englisch)
- Neue Suche nach: Brandmair, Andreas
- Neue Suche nach: Böhme, Thomas
- Neue Suche nach: Müller, Wolfgang H.
- Neue Suche nach: Brandmair, Andreas
- Neue Suche nach: Böhme, Thomas
- Neue Suche nach: Müller, Wolfgang H.
In:
Microsystem Technologies
;
15
, 1
; 201-215
;
2008
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Changes in the microstructure of materials and their impact on reliability: experiments and modeling
-
Beteiligte:
-
Erschienen in:Microsystem Technologies ; 15, 1 ; 201-215
-
Verlag:
- Neue Suche nach: Springer-Verlag
- Neue Suche nach: Springer
-
Erscheinungsort:Berlin
-
Erscheinungsdatum:2008
-
ISSN:
-
ZDBID:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Print
-
Sprache:Englisch
- Neue Suche nach: 50.94
- Weitere Informationen zu Basisklassifikation
-
Schlagwörter:
-
Klassifikation:
BKL: 50.94 Mikrosystemtechnik, Nanotechnologie -
Datenquelle:
Inhaltsverzeichnis – Band 15, Ausgabe 1
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
-
MST Special Issue on the conference MicroNanoReliability 2007Michel, Bernd et al. | 2008
- 3
-
Failure modeling of ACA-glued flip-chip on flex assembliesWunderle, B. / Kallmayer, C. / Walter, H. / Braun, T. / Gollhardt, A. / Michel, B. / Reichl, H. et al. | 2008
- 17
-
A simple method for testing the electromigration resistance of soldersSaka, M. / Kohara, T. / Hasegawa, T. / Yamashita, M. et al. | 2008
- 27
-
Strength of hierarchical materialsCarpinteri, Alberto / Cornetti, Pietro / Pugno, Nicola / Sapora, Alberto et al. | 2008
- 33
-
Effects of fatigue and damage on the hysteresis loops of ferroelectric ceramicsYu, Shouwen / Yu, Li et al. | 2008
- 39
-
Design limitations related to conductive anodic filament formation in a micro-worldCaputo, Antonio / Turbini, Laura J. / Perovic, Doug D. et al. | 2008
- 45
-
How to extract continuum materials properties for (lead-free) solders from tensile tests and nanoindentation experimentsMüller, W. H. / Worrack, H. / Sterthaus, J. / Villain, J. / Wilden, J. / Juritza, A. et al. | 2008
- 57
-
Interlayer cooling potential in vertically integrated packagesBrunschwiler, T. / Michel, B. / Rothuizen, H. / Kloter, U. / Wunderle, B. / Oppermann, H. / Reichl, H. et al. | 2008
- 75
-
Simulations of nanoscale thermal conductionHeino, Pekka et al. | 2008
- 83
-
Application of interfacial fracture mechanics approach for obtaining design rules for flip chip interconnectionsDreßler, M. / Becker, K-F. / Wunderle, B. / Auersperg, J. / Reichl, H. et al. | 2008
- 89
-
Study on fault diagnostic strategy of intelligent magnetic detection microsystemsWang, Yongqiang / Lou, Wenzhong / Fan, Ningjun / Hao, Jianwei / Zhang, Dayin et al. | 2008
- 95
-
Distributed BIT diagnostic network Microsystems for miniature mobile robotXiuli, Yu / Wenzhong, Lou / Xiaosong, Liu / Baozheng, Ma / Yongqiang, Wang et al. | 2008
- 101
-
Modeling of interfacial intermetallic compounds in the application of very fine lead-free solder interconnectionsHuang, Zhiheng / Conway, Paul P. / Qin, Rongshan et al. | 2008
- 109
-
Exploring the applicability of gradient elasticity to certain micro/nano reliability problemsAifantis, Elias C. et al. | 2008
- 117
-
Nonsingular dislocation and crack fields: implications to small volumesKioseoglou, J. / Konstantopoulos, I. / Ribarik, G. / Dimitrakopulos, G. P. / Aifantis, E. C. et al. | 2008
- 123
-
Failure of electronic devices due to condensationSchimpf, C. / Feldmann, K. / Matzner, C. / Steinke, A. et al. | 2008
- 129
-
Physics of failure for interconnect structures: an essayTilgner, Rainer et al. | 2008
- 139
-
Reliability testing of nano-particle system packagingMorris, James E. et al. | 2008
- 145
-
Electrical and reliability properties of isotropic conductive adhesives on immersion silver printed-circuit boardsLee, J. / Cho, C. S. / Morris, J. E. et al. | 2008
- 151
-
Focused ion beam core hole drilling for stress detection in thin-filmsGerdes, H. / Gatzen, H. H. et al. | 2008
- 155
-
Influence of material stiffness and geometrical variations on the electro-thermally driven microactuator performanceShamshirsaz, M. / Maroufi, M. / Asgari, M. B. / Gheisarieha, M. et al. | 2008
- 161
-
Assessment of testing methodologies for thin-film vacuum MEMS packagesLi, Qian / Goosen, Hans / van Keulen, Fred / van Beek, Joost / Zhang, Guoqi et al. | 2008
- 169
-
Poly-si extensions and etching residues as a reliability riskJacob, Peter et al. | 2008
- 175
-
Macroscopic invisible cablesPugno, Nicola M. et al. | 2008
- 181
-
TSV constraints related to temperature excursion, pressure during molding, materials used and handling loadsFałat, Tomasz / Friedel, Kazimierz / Marenco, Norman / Warnat, Stephan et al. | 2008
- 191
-
A silicon test chip for the thermomechanical analysis of MEMS packagingsMajcherek, Soeren / Leneke, Thomas / Hirsch, Soeren et al. | 2008
- 201
-
Changes in the microstructure of materials and their impact on reliability: experiments and modelingBrandmair, Andreas / Böhme, Thomas / Müller, Wolfgang H. et al. | 2008