High-temperature variable melting point Sn-Sb lead-free solder pastes using transient liquid-phase powder processing (Englisch)
- Neue Suche nach: Corbin, S. F.
- Neue Suche nach: Corbin, S. F.
In:
Journal of Electronic Materials
;
34
, 7
; 1016-1025
;
2005
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:High-temperature variable melting point Sn-Sb lead-free solder pastes using transient liquid-phase powder processing
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Beteiligte:Corbin, S. F. ( Autor:in )
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Erschienen in:Journal of Electronic Materials ; 34, 7 ; 1016-1025
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Verlag:
- Neue Suche nach: Springer-Verlag
- Neue Suche nach: TMS
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Erscheinungsort:Warrendale, Pa.
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Erscheinungsdatum:2005
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ISSN:
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ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 770/5670
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 34, Ausgabe 7
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