Cu Substrates with Different Grain Sizes (Englisch)
- Neue Suche nach: Wang, Jo-Mei
- Neue Suche nach: Wang, Kai-Jheng
- Neue Suche nach: Duh, Jenq-Gong
- Neue Suche nach: Wang, Jo-Mei
- Neue Suche nach: Wang, Kai-Jheng
- Neue Suche nach: Duh, Jenq-Gong
In:
Journal of Electronic Materials
;
40
, 7
; 1549-1555
;
2011
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Cu Substrates with Different Grain Sizes
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Beteiligte:
-
Erschienen in:Journal of Electronic Materials ; 40, 7 ; 1549-1555
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Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: TMS
-
Erscheinungsort:Warrendale, Pa.
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Erscheinungsdatum:2011
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ISSN:
-
ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
-
Sprache:Englisch
- Neue Suche nach: 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 770/5670
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 40, Ausgabe 7
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