Triangular Carbon Nanotube Bundle Interconnects for Subthreshold VLSI Circuits (Englisch)
- Neue Suche nach: Uma Sathyakam, P.
- Neue Suche nach: Mallick, P. S.
- Neue Suche nach: Uma Sathyakam, P.
- Neue Suche nach: Mallick, P. S.
In:
Journal of Electronic Materials
;
48
, 10
; 6372-6381
;
2019
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Triangular Carbon Nanotube Bundle Interconnects for Subthreshold VLSI Circuits
-
Beteiligte:Uma Sathyakam, P. ( Autor:in ) / Mallick, P. S. ( Autor:in )
-
Erschienen in:Journal of Electronic Materials ; 48, 10 ; 6372-6381
-
Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: TMS
-
Erscheinungsort:Warrendale, Pa.
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Erscheinungsdatum:2019
-
ISSN:
-
ZDBID:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Print
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Sprache:Englisch
- Neue Suche nach: 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 770/5670
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 48, Ausgabe 10
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AgNi Alloy As a Suitable Barrier Layer Material for NbFeSb-Based Half-Heusler Thermoelectric ModulesZhu, Jiaxu / Liu, Fusheng / Gong, Bo / Wang, Xiao / Ao, Weiqin / Zhang, Chaohua / Li, Yu / Hu, Lipeng / Xie, Heping / Gu, Kunming et al. | 2019
- 6823
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Oxide-Free Copper Pastes for the Attachment of Large-Area Power DevicesDel Carro, Luca / Zinn, Alfred A. / Ruch, Patrick / Bouville, Florian / Studart, André R. / Brunschwiler, Thomas et al. | 2019
- 6835
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Wettability, Interfacial Behavior and Joint Properties of Sn-15Bi SolderWang, Fengjiang / Ding, Yu / Liu, Luting / Huang, Ying / Wu, Mingfang et al. | 2019
- 6849
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Electromigration Mechanism of Indium-44Tin-6Zinc AlloyWang, Jingze / Mao, Dongxin / Meng, Guizhi / Shi, Lei / Chen, Hongtao / Xia, Ruihan / Li, Manning et al. | 2019
- 6857
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Realistic Creep Characterization for Sn3.0Ag0.5Cu Solder Joints in Flip Chip BGA PackageLee, Ho Hyung / Kwak, Jae B. et al. | 2019
- 6866
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Investigating the Effect of Ag Content on Mechanical Properties of Sn-Ag-Cu Micro-BGA JointsChen, Hao / Chou, Tzu-Ting / Fleshman, Collin / Duh, Jenq-Gong et al. | 2019