Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications (Englisch)
- Neue Suche nach: Lee, Hyo S.
- Neue Suche nach: Jeon, Kyung Y.
- Neue Suche nach: Kim, Hee Y.
- Neue Suche nach: Hong, Soon H.
- Neue Suche nach: Lee, Hyo S.
- Neue Suche nach: Jeon, Kyung Y.
- Neue Suche nach: Kim, Hee Y.
- Neue Suche nach: Hong, Soon H.
In:
Journal of Materials Science
;
35
, 24
; 6231-6236
;
2000
-
ISSN:
- Aufsatz (Zeitschrift) / Print
-
Titel:Fabrication process and thermal properties of SiCp/Al metal matrix composites for electronic packaging applications
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Beteiligte:Lee, Hyo S. ( Autor:in ) / Jeon, Kyung Y. ( Autor:in ) / Kim, Hee Y. ( Autor:in ) / Hong, Soon H. ( Autor:in )
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Erschienen in:Journal of Materials Science ; 35, 24 ; 6231-6236
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Verlag:
- Neue Suche nach: Kluwer Academic Publishers
- Neue Suche nach: Springer Science + Business Media B.V.
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Erscheinungsort:Norwell, Mass
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Erscheinungsdatum:2000
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ISSN:
-
ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Print
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Sprache:Englisch
- Neue Suche nach: 51.00
- Weitere Informationen zu Basisklassifikation
- Neue Suche nach: 275/5010
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Schlagwörter:
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Klassifikation:
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Datenquelle:
Inhaltsverzeichnis – Band 35, Ausgabe 24
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