Application of Diffusion Path Analysis to Understand the Mechanisms of Transient Liquid-Phase Bonding in the Ni-Si-B System (Englisch)
- Neue Suche nach: Moreau, E. D.
- Neue Suche nach: Corbin, S. F.
- Neue Suche nach: Moreau, E. D.
- Neue Suche nach: Corbin, S. F.
In:
Metallurgical and Materials Transactions A
;
50
, 12
; 5678-5688
;
2019
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Application of Diffusion Path Analysis to Understand the Mechanisms of Transient Liquid-Phase Bonding in the Ni-Si-B System
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Beteiligte:Moreau, E. D. ( Autor:in ) / Corbin, S. F. ( Autor:in )
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Erschienen in:Metallurgical and Materials Transactions A ; 50, 12 ; 5678-5688
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Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: Springer
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Erscheinungsort:Boston
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Erscheinungsdatum:2019
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ISSN:
-
ZDBID:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
- Neue Suche nach: 51.50 / 51.50$jMetallische Werkstoffe: Allgemeines
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:
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Klassifikation:
BKL: 51.50 Metallische Werkstoffe: Allgemeines / 51.50$jMetallische Werkstoffe: Allgemeines -
Datenquelle:
Inhaltsverzeichnis – Band 50, Ausgabe 12
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