Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging (Englisch)
- Neue Suche nach: Moon, Kyoung-sik
- Neue Suche nach: Wong, C.P.
- Neue Suche nach: Kim, Soo-hyung
- Neue Suche nach: Choi, Hyung Do
- Neue Suche nach: Han, Seung
- Neue Suche nach: Yoon, Ho Gyu
- Neue Suche nach: Suh, Kwang S.
- Neue Suche nach: Moon, Kyoung-sik
- Neue Suche nach: Wong, C.P.
- Neue Suche nach: Kim, Soo-hyung
- Neue Suche nach: Choi, Hyung Do
- Neue Suche nach: Han, Seung
- Neue Suche nach: Yoon, Ho Gyu
- Neue Suche nach: Suh, Kwang S.
In:
Journal of Electronic Materials
;
36
, 12
; 1711-1718
;
2007
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Ferrite Polymer Composite for Improving the Electromagnetic Compatibility of Semiconductor Packaging
-
Beteiligte:Moon, Kyoung-sik ( Autor:in ) / Wong, C.P. ( Autor:in ) / Kim, Soo-hyung ( Autor:in ) / Choi, Hyung Do ( Autor:in ) / Han, Seung ( Autor:in ) / Yoon, Ho Gyu ( Autor:in ) / Suh, Kwang S. ( Autor:in )
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Erschienen in:Journal of Electronic Materials ; 36, 12 ; 1711-1718
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Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: TMS
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Erscheinungsort:Warrendale, Pa
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Erscheinungsdatum:2007
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ISSN:
-
ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
- Neue Suche nach: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
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Schlagwörter:electromagnetic absorber , EMC , EMS , polymer composite , electronic package , EMI , Ferrite , GTEM
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Klassifikation:
BKL: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 Werkstoffe für bestimmte Anwendungsgebiete / 33.61 Festkörperphysik / 51.10 Metallphysik / 53.09 Werkstoffe der Elektrotechnik -
Datenquelle:
Inhaltsverzeichnis – Band 36, Ausgabe 12
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