Evaluation of Dielectric Properties of HTCC Alumina for Realization of Plasma Sources (Englisch)
- Neue Suche nach: Berglund, Martin
- Weitere Informationen zu Berglund, Martin:
- https://orcid.org/0000-0003-0832-1848
- Neue Suche nach: Persson, Anders
- Weitere Informationen zu Persson, Anders:
- https://orcid.org/0000-0003-2853-9238
- Neue Suche nach: Thornell, Greger
- Weitere Informationen zu Thornell, Greger:
- https://orcid.org/0000-0003-4468-6801
- Neue Suche nach: Berglund, Martin
- Weitere Informationen zu Berglund, Martin:
- https://orcid.org/0000-0003-0832-1848
- Neue Suche nach: Persson, Anders
- Weitere Informationen zu Persson, Anders:
- https://orcid.org/0000-0003-2853-9238
- Neue Suche nach: Thornell, Greger
- Weitere Informationen zu Thornell, Greger:
- https://orcid.org/0000-0003-4468-6801
In:
Journal of Electronic Materials
;
44
, 10
; 3654-3660
;
2015
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Evaluation of Dielectric Properties of HTCC Alumina for Realization of Plasma Sources
-
Beteiligte:
-
Erschienen in:Journal of Electronic Materials ; 44, 10 ; 3654-3660
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Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: TMS
-
Erscheinungsort:Warrendale, Pa
-
Erscheinungsdatum:2015
-
ISSN:
-
ZDBID:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
- Neue Suche nach: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
-
Schlagwörter:
-
Klassifikation:
BKL: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 Werkstoffe für bestimmte Anwendungsgebiete / 33.61 Festkörperphysik / 51.10 Metallphysik / 53.09 Werkstoffe der Elektrotechnik -
Datenquelle:
Inhaltsverzeichnis – Band 44, Ausgabe 10
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- 3927
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Effect of Electromigration on the Type of Drop Failure of Sn–3.0Ag–0.5Cu Solder Joints in PBGA PackagesHuang, M. L. / Zhao, N. et al. | 2015
- 3934
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Fatigue Characterization for Flexible Circuit with Polyimide on Adhesiveless CopperHuang, Kuo-Hua / Duh, Jenq-Gong et al. | 2015
- 3942
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In Situ Synchrotron X-ray Diffraction Measurement of the Strain Distribution in Si Die for the Embedded SubstratesHsu, Hsueh Hsien / Chen, Hao / Ouyang, Yao Tsung / Chiu, Tz Cheng / Chang, Tao Chih / Lee, Hsin Yi / Ku, Chin Shun / Wu, Albert T. et al. | 2015
- 3948
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Influence of the Porous Microstructure on the Elastic Properties of Sintered Ag Paste as Replacement Material for Die AttachmentMilhet, X. / Gadaud, P. / Caccuri, V. / Bertheau, D. / Mellier, D. / Gerland, M. et al. | 2015
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New Failure Mode of Flip-Chip Solder Joints Related to the Metallization of an Organic SubstrateJang, J. W. / Yoo, S. J. / Hwang, H. I. / Yuk, S. Y. / Kim, C. K. / Kim, S. J. / Han, J. S. / An, S. H. et al. | 2015
- 3962
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Electrical Bistabilities and Conduction Mechanisms of Nonvolatile Memories Based on a Polymethylsilsesquioxane Insulating Layer Containing CdSe/ZnS Quantum DotsMa, Zehao / Ooi, Poh Choon / Li, Fushan / Yun, Dong Yeol / Kim, Tae Whan et al. | 2015
- 3967
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Highly Transparent and Low-Resistance Indium-Free ZnO/Ag/ZnO Multilayer Electrodes for Organic Photovoltaic DevicesKim, Jun Ho / Na, Jin-Young / Kim, Sun-Kyung / Yoo, Young-Zo / Seong, Tae-Yeon et al. | 2015
- 3973
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Parametric Study on Pressureless Sintering of Nanosilver Paste to Bond Large-Area (≥100 $ mm^{2} $) Power Chips at Low Temperatures for Electronic PackagingFu, Shancan / Mei, Yunhui / Li, Xin / Ning, Puqi / Lu, Guo-Quan et al. | 2015
- 3985
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Electrical Bistability and Erasable Memory Effect of a Functional Polyimide Film: Synthesis and Investigation of MechanismTian, Guofeng / Jia, Nanfang / Qi, Shengli / Wu, Dezhen et al. | 2015
- 3992
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Humidity Sensor Based on PEDOT:PSS and Zinc Stannate Nano-compositeAziz, Shahid / Chang, Dong Eui / Doh, Yang Hoi / Kang, Chul Ung / Choi, Kyung Hyun et al. | 2015
- 4000
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Optical and Electrical Properties of New Perylene Diimide Thin FilmsBoobalan, G. / Imran, P.K.M. / Manoharan, C. / Nagarajan, S. et al. | 2015
- 4006
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Phenylvinyl-Substituted Carbazole Twin Compounds as Efficient Materials for the Charge-Transporting Layers of OLED DevicesTavgeniene, D. / Liu, L. / Krucaite, G. / Volyniuk, D. / Grazulevicius, J. V. / Xie, Z. / Zhang, B. / Grigalevicius, S. et al. | 2015
- 4012
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Validation of the Dynamic Recrystallization (DRX) Mechanism for Whisker and Hillock Growth on Sn Thin FilmsVianco, P. T. / Neilsen, M. K. / Rejent, J. A. / Grant, R. P. et al. | 2015
- 4035
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Simulation-Based Uncertainty Quantification for Additively Manufactured Cellular StructuresChoi, Seung-Kyum / Gorguluarslan, Recep M. / Park, Sang-In / Stone, Thomas / Moon, Jack K. / Rosen, David W. et al. | 2015
- 4042
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Metallization Process of a Polyimide Surface with Palladium-Free Activation for Electronic Field ApplicationsLi, Libo / Ma, Yue / Xie, Jingchen / Yang, Xiuchun / Wang, Heng / Tian, Haiyan / Mu, Hongjing / Wang, Wentao et al. | 2015