Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior (Englisch)
- Neue Suche nach: Huang, Timothy B.
- Weitere Informationen zu Huang, Timothy B.:
- https://orcid.org/0000-0003-0244-2382
- Neue Suche nach: Sharma, Himani
- Neue Suche nach: Manepalli, Rahul
- Neue Suche nach: Kandanur, Sashi
- Neue Suche nach: Sundaram, Venky
- Neue Suche nach: Tummala, Rao R.
- Neue Suche nach: Huang, Timothy B.
- Weitere Informationen zu Huang, Timothy B.:
- https://orcid.org/0000-0003-0244-2382
- Neue Suche nach: Sharma, Himani
- Neue Suche nach: Manepalli, Rahul
- Neue Suche nach: Kandanur, Sashi
- Neue Suche nach: Sundaram, Venky
- Neue Suche nach: Tummala, Rao R.
In:
Journal of Electronic Materials
;
47
, 12
; 7401-7408
;
2018
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior
-
Beteiligte:Huang, Timothy B. ( Autor:in ) / Sharma, Himani ( Autor:in ) / Manepalli, Rahul ( Autor:in ) / Kandanur, Sashi ( Autor:in ) / Sundaram, Venky ( Autor:in ) / Tummala, Rao R. ( Autor:in )
-
Erschienen in:Journal of Electronic Materials ; 47, 12 ; 7401-7408
-
Verlag:
- Neue Suche nach: Springer US
- Neue Suche nach: TMS
-
Erscheinungsort:Warrendale, Pa
-
Erscheinungsdatum:2018
-
ISSN:
-
ZDBID:
-
DOI:
-
Medientyp:Aufsatz (Zeitschrift)
-
Format:Elektronische Ressource
-
Sprache:Englisch
- Neue Suche nach: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 / 33.61 / 51.10 / 53.09
- Weitere Informationen zu Basisklassifikation
-
Schlagwörter:
-
Klassifikation:
BKL: 53.09$jWerkstoffe der Elektrotechnik / 51.40$jWerkstoffe für bestimmte Anwendungsgebiete / 33.61$jFestkörperphysik / 51.10$jMetallphysik / 51.40 Werkstoffe für bestimmte Anwendungsgebiete / 33.61 Festkörperphysik / 51.10 Metallphysik / 53.09 Werkstoffe der Elektrotechnik -
Datenquelle:
Inhaltsverzeichnis – Band 47, Ausgabe 12
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