Coupling Modeling for Functional Surface of Electronic Equipment (Englisch)
Freier Zugriff
- Neue Suche nach: DUAN, Baoyan
- Neue Suche nach: WANG, Congsi
- Neue Suche nach: WANG, Wei
- Neue Suche nach: DUAN, Baoyan
- Neue Suche nach: WANG, Congsi
- Neue Suche nach: WANG, Wei
In:
Chinese Journal of Mechanical Engineering
;
30
, 3
; 497-499
;
2017
-
ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Coupling Modeling for Functional Surface of Electronic Equipment
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Beteiligte:
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Erschienen in:Chinese Journal of Mechanical Engineering ; 30, 3 ; 497-499
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Verlag:
- Neue Suche nach: Chinese Mechanical Engineering Society
- Neue Suche nach: China Machine Press
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Erscheinungsort:Beijing
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Erscheinungsdatum:2017
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ISSN:
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ZDBID:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 30, Ausgabe 3
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Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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