On Thin Film MCM-D Interconnects (Englisch)
- Neue Suche nach: Roggen, J.
- Neue Suche nach: Beyne, E.
- Neue Suche nach: Truzzi, C.
- Neue Suche nach: Ringoot, E.
- Neue Suche nach: Pieters, P.
- Neue Suche nach: Roggen, J.
- Neue Suche nach: Beyne, E.
- Neue Suche nach: Truzzi, C.
- Neue Suche nach: Ringoot, E.
- Neue Suche nach: Pieters, P.
In:
Microelectronic Interconnections and Assembly
3
;
141-144
;
1998
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ISSN:
- Aufsatz/Kapitel (Buch) / Elektronische Ressource
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Titel:On Thin Film MCM-D Interconnects
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Beteiligte:Roggen, J. ( Autor:in ) / Beyne, E. ( Autor:in ) / Truzzi, C. ( Autor:in ) / Ringoot, E. ( Autor:in ) / Pieters, P. ( Autor:in )
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Erschienen in:Microelectronic Interconnections and Assembly , 3 ; 141-144NATO ASI Series ; 54, 3 ; 141-144
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Verlag:
- Neue Suche nach: Springer Netherlands
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Erscheinungsort:Dordrecht
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Erscheinungsdatum:01.01.1998
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Format / Umfang:4 pages
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ISBN:
-
ISSN:
-
DOI:
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Medientyp:Aufsatz/Kapitel (Buch)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis E-Book
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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The Packaging & Interconnection Trends in the Nordic Microelectronics IndustryNørlyng, Søren et al. | 1998
- 9
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IC Packaging for Miniaturised Consumer ElectronicsVeen, Co et al. | 1998
- 13
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The Move Towards Further MiniaturisationSage, M. G. et al. | 1998
- 21
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Plastic Packaging is Highly ReliableProf. Sinnadurai, Nihal et al. | 1998
- 33
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Thermal Simulation and Characterization of Single Chip PackagesSlattery, Orla / Cahill, Ciaran / Barrett, John / O’Flaherty, Martin / Rodgers, Kenneth et al. | 1998
- 45
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Current Trends and Future Issues in SolderabilityEwell, Gary J. et al. | 1998
- 53
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The At-Temperature Mechanical Properties of Lead-Tin Based AlloysJones, W. Kinzy / Liu, Y. Q. / Zampino, Marc A. / Gonzalez, Gerardo L. et al. | 1998
- 59
-
Flip Chip Technology: Is It Time of Mass Production?Cognetti, Carlo et al. | 1998
- 77
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Flip-Chip - The Ultimate Solution Comparing Flip-Chip and Chip Scale PackagingBrox, Bill / Boustedt, Katarina et al. | 1998
- 79
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Solder and Solderless Flip Chip Assembly on a MCM-D in a BGA PackageBodo, Peter / Hentzell, Hans / Strandberg, Jan / Haglund, Joacim / Valizadeh, Sima et al. | 1998
- 81
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Solder Bumping for Flip Chip InterconnectionsAnnala, P. / Kaitila, J. / Salonen, J. / Suni, I. et al. | 1998
- 87
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Reliability of Solder Joint Interconnections in Thermally Matched AssembliesSuhir, E. et al. | 1998
- 97
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Mechanical Stress in Microelectronic InterconnectsGielisse, Peter J. / Tu, Meirong / White, Dongming Y. / Famu-Fsu, Yang Xu et al. | 1998
- 109
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Low Cost Interconnection Technology for Fast Prototyping of Multichip ModulesIllyefalvi-Vitéz, Zsolt / Pinkola, János / Gál, László / Tóth, Endre et al. | 1998
- 119
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Opto-Electronic Multi-Chip Modules (OE-MCMs): Current R&D and Applications to Microelectronic InterconnectionsMukherjee, Sayan D. et al. | 1998
- 141
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On Thin Film MCM-D InterconnectsRoggen, J. / Beyne, E. / Truzzi, C. / Ringoot, E. / Pieters, P. et al. | 1998
- 145
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VLSI Interconnection by Bumpless TABDehaine, Gérard / Courant, Patrick / Kurzweil, Karel et al. | 1998
- 157
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Critical Issues in Wire-Bonded Chip Interconnections to the Year 2001Harman, George G. et al. | 1998
- 167
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Bonding of Al Wires to Copper Contacts on PCBs and Alumina Substrates - a Comparative StudyCież, Michał et al. | 1998
- 179
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Microwelding of Leads to the Film Structures Working at Elevated TemperaturesPisarkiewicz, T. / Habdank-Wojewodzki, T. / Ciez, M. et al. | 1998
- 185
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New Trends in the Integration and Education in Microsystems TechnologyProf. Dr. Banský, Juraj et al. | 1998
- 187
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MCM Implementation of a 2.5 Gb/s ATM switchPlaza, Pierre / Conesa, Jose Luis et al. | 1998
- 193
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Processing and Performance of High Dielectric Permeability Thin Anodised Films in Multilayer Structures for MCM(D) High Speed Digital ApplicationsDr. Arnaudov, Radosvet G. / Yordanov, Nikola / Dr. Sc. Phillipov, Phillip et al. | 1998
- 213
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Optical Interconnection Elements Investigation in Chalcogenide Glass Layers for Integrated OpticsKikinesshy, A. / Marjan, M. / Vlasov, V. / Mojzes, I. / Ripka, G. et al. | 1998
- 217
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Material Composition Changes During High Temperature Annealing and Electrochemical Migration ReliabilityHarsányi, Gábor / Pernes, Liana / Jones, W. Kinzy et al. | 1998
- 225
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Nonlinearity between Interconnection and Resistive LayerMach, Pavel et al. | 1998
- 233
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Education in Hybrid Microelectronics at the University of BrnoSzendiuch, Ivan et al. | 1998
- 237
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Thick Film Interconnections for Sensor ApplicationsBelavič, Darko / Maček, Srečko / Šoba, Stojan / Pavlin, Marko / Hrovat, Marko / Ročak, Dubravka et al. | 1998
- 249
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PTF (Polymer Thick Film) Interconnections in Term of Long Time ReliabilityUrbančík, Ján et al. | 1998
- 257
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The Usage of the Polymer Inks in Interconnection TechnologyKolesár, František / Somora, Miloš et al. | 1998
- 263
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Production of metallic patterns with the help of highresolution inorganic resistsStronski, Alexander V. et al. | 1998