Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions (Englisch)
- Neue Suche nach: Jung, Ja-Young
- Neue Suche nach: Lee, Shin-Bok
- Neue Suche nach: Lee, Ho-Young
- Neue Suche nach: Joo, Young-Chang
- Neue Suche nach: Park, Young-Bae
- Neue Suche nach: Jung, Ja-Young
- Neue Suche nach: Lee, Shin-Bok
- Neue Suche nach: Lee, Ho-Young
- Neue Suche nach: Joo, Young-Chang
- Neue Suche nach: Park, Young-Bae
In:
Journal of Electronic Materials
;
37
, 8
;
1111-1118
;
2008
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Effect of Ionization Characteristics on Electrochemical Migration Lifetimes of Sn-3.0Ag-0.5Cu Solder in NaCl and Na2SO4 Solutions
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Beteiligte:Jung, Ja-Young ( Autor:in ) / Lee, Shin-Bok ( Autor:in ) / Lee, Ho-Young ( Autor:in ) / Joo, Young-Chang ( Autor:in ) / Park, Young-Bae ( Autor:in )
-
Erschienen in:Journal of Electronic Materials ; 37, 8 ; 1111-1118
-
Verlag:
- Neue Suche nach: Springer US
-
Erscheinungsort:Boston
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Erscheinungsdatum:12.06.2008
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Format / Umfang:8 pages
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis – Band 37, Ausgabe 8
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