Development of a solder material process to relieve the plastic constraint associated with thin joints (Englisch)
Nationallizenz
- Neue Suche nach: Lauten, Frederick S.
- Neue Suche nach: Ranieri, John P.
- Neue Suche nach: Avery, Donald H.
- Neue Suche nach: Lauten, Frederick S.
- Neue Suche nach: Ranieri, John P.
- Neue Suche nach: Avery, Donald H.
In:
Journal of Electronic Materials
;
24
, 10
;
1425-1428
;
1995
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Development of a solder material process to relieve the plastic constraint associated with thin joints
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Beteiligte:
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Erschienen in:Journal of Electronic Materials ; 24, 10 ; 1425-1428
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Verlag:
- Neue Suche nach: Springer-Verlag
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Erscheinungsort:New York
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Erscheinungsdatum:01.10.1995
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Format / Umfang:4 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 24, Ausgabe 10
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