Role of trace elements on tensile behavior of accumulative roll-bonded pure copper (Englisch)
- Neue Suche nach: Jang, Younghwan
- Neue Suche nach: Kim, Sangshik
- Neue Suche nach: Han, Seungzeon
- Neue Suche nach: Lim, Chayong
- Neue Suche nach: Kim, Changjoo
- Neue Suche nach: Goto, Masahiro
- Neue Suche nach: Jang, Younghwan
- Neue Suche nach: Kim, Sangshik
- Neue Suche nach: Han, Seungzeon
- Neue Suche nach: Lim, Chayong
- Neue Suche nach: Kim, Changjoo
- Neue Suche nach: Goto, Masahiro
In:
Journal of Materials Science
;
40
, 13
;
3527-3529
;
2005
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Role of trace elements on tensile behavior of accumulative roll-bonded pure copper
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Beteiligte:Jang, Younghwan ( Autor:in ) / Kim, Sangshik ( Autor:in ) / Han, Seungzeon ( Autor:in ) / Lim, Chayong ( Autor:in ) / Kim, Changjoo ( Autor:in ) / Goto, Masahiro ( Autor:in )
-
Erschienen in:Journal of Materials Science ; 40, 13 ; 3527-3529
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Verlag:
- Neue Suche nach: Kluwer Academic Publishers
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Erscheinungsort:Boston
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Erscheinungsdatum:01.07.2005
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Format / Umfang:3 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 40, Ausgabe 13
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- iv
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Keyword contentsEditorial Board et al. | 2005