Calendar of events (Unbekannt)
In:
Journal of Adhesion Science and Technology
;
2
, 1
;
69-71
;
1988
- Aufsatz (Zeitschrift) / Elektronische Ressource
-
Titel:Calendar of events
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Erschienen in:Journal of Adhesion Science and Technology ; 2, 1 ; 69-71
-
Verlag:
- Neue Suche nach: Taylor & Francis Group
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Erscheinungsdatum:01.01.1988
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Format / Umfang:3 pages
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ISSN:
-
DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Unbekannt
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Datenquelle:
Inhaltsverzeichnis – Band 2, Ausgabe 1
Zeige alle Jahrgänge und Ausgaben
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
-
Adhesion measurement of metal films on a Si(111) surface by a microtribometerKinbara, A. / Baba, S. / Kikuchi, A. et al. | 1988
- 11
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XPS studies of the bonding and hydrolysis of di(dioctyl)pyrophosphate ethylene titanate coupling agent on metal surfacesYang, Charles Q. / Moulder, John F. / Fateley, William et al. | 1988
- 21
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Effect of HAF black on the self-adhesion of natural rubberKurian, Jossit / Nando, G.B. / De, P.P. / Bhattacharya, A.K. / De, S.K. et al. | 1988
- 35
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Adhesion of polyvinylalcohol cord and fabric to polychloroprene rubber in the presence of drybonding agentsSubramanian, V. / Nando, Golok B. et al. | 1988
- 43
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Effects of pre-heat treatment and testing atmosphere on the joint strength of Si3N4/Al/Si3N4Morita, Masaya / Suganuma, Katsuaki / Okamoto, Taira et al. | 1988
- 59
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The effect of high energy 'electrodeless' plasma polymerized methane polymers on the adhesion characteristics of poly-p-xylylene filmsNichols, M.F. / Hahn, A.W. / Sharma, A.K. et al. | 1988
- 67
-
Book reviewsCasper, L.A. / Feldman, D. et al. | 1988
- 69
-
Calendar of events| 1988
- 77
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A study of the mechanism of cathodic debonding of adhesively bonded neoprene rubber from steelHamadeh, R.F. / Van Ooij, W.J. / Dillard, D.A. et al. | 1988
- 95
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Adhesion and interface investigation of polyimide on metalsKim, Y.-H. / Kim, J. / Walker, G.F. / Feger, C. / Kowalczyk, S.P. et al. | 1988
- 107
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Epoxy-lignin polyblends. Part II. Adhesive behavior and weatheringFeldman, Dorel / Khoury, Marwan et al. | 1988
- 117
-
Work of adhesion of water to a Teflon surface and stability of the system Teflon-air bubble-waterJanczuk, Bronislaw / Bialopiotrowicz, Tomasz et al. | 1988
- 125
-
Surface modification of polyethylene to improve its adhesion to aluminumGolander, Carl-Gustaf / Sultan, Bernt-Ake et al. | 1988
- 137
-
Effect of epoxy smear removal processes on the locus of failure of electrolytic copper plated hole walls in a printed circuit boardPendleton, Phillip et al. | 1988
- 157
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Synthesis and properties of allyloxyethyl 2-cyanoacrylate adhesiveDenchev, Z.Z. / Kotzev, D.L. / Serafimov, B.L. et al. | 1988
- 167
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Adhesion between individual components and mechanical properties of natural rubber-polypropylene thermoplastic elastomeric blendsChoudhury, Namita Roy / Bhowmick, Anil K. et al. | 1988
- 179
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Silane primers for epoxy adhesivesPlueddemann, Edwin P. et al. | 1988
- 189
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Debond and failure characteristics of a double-lap adhesively bonded jointMantena, Raju / Gibson, R.F. / Place, T. Alan / Srivatsan, T.S. / Sudarshan, T.S. et al. | 1988
- 203
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Modification of waste silicas by silanes and titanates and their use as reinforcing fillers in elastomer compositesKrysztafkiewicz, Andrzej et al. | 1988
- 215
-
Buckling instability during the 180°-peeling of brass shim from polychloroprene rubberHamed, G.R. / Tsaur, T. et al. | 1988
- 227
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The determination of bond strength of polymeric films by indentation debondingConway, H.D. / Thomsin, J.P.R. et al. | 1988
- 245
-
Adhesion enhancement of polyimide on copper by Ar ion beam etching of copperPaik, Kyung W. / Ruoff, Arthur L. et al. | 1988
- 255
-
Surface energy of liquid copper and single-crystal sapphire and the wetting behavior of copper on sapphireOwnby, P. Darrell / Liu, Jenq et al. | 1988
- 271
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Mechanism of adhesion failure of epoxy-bonded galvanized steel sheets exposed to a wet atmosphereMaeda, S. / Asai, T. / Fuj, S. / Nomura, Y. / Nomoto, A. et al. | 1988
- 287
-
Silicone-based release agents for polyurethane: a general assessment of the importance of interface structure and morphologyBriscoe, B.J. / Panesar, S.S. et al. | 1988
- 311
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The constrained blister test for the energy of interfacial adhesionNapolitano, M.J. / Chudnovsky, A. / Moet, A. et al. | 1988
- 331
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Direct observations of deformations resulting from particle-substrate adhesionDemejo, L.P. / Rimai, D.S. / Bowen, R.C. et al. | 1988
- 339
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Role of silanes in adhesion-Part I. Dynamic mechanical properties of silane coatings on glass fibersEckstein, Yona et al. | 1988
- 349
-
Axisymmetric pull-off test for a cracked adhesive layerGecit, Mehmet Rusen et al. | 1988
- 363
-
Wettability and adhesion studies of plasma-treated plastic substrates for gelatin hologramsChow, B.L. / Whittle, D.J. et al. | 1988
- 369
-
Testing of adhesion of thin films to substratesPawel, J.E. / McHargue, C.J. et al. | 1988
- 385
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Use of the scratch test to measure changes in adhesion of Cr/Al2O3 due to ion beam mixingPawel, J.E. / McHargue, C.J. et al. | 1988
- 395
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Acid-base properties of copper oxides and fluorides by means of band calculations: Relevance to metal-polymer adhesionCain, Stephen R. / Matienzo, Luis J. et al. | 1988
- 407
-
NMR imaging-A promising new adhesive evaluation techniqueNieminen, Antti O.K. / Koenig, Jack L. et al. | 1988
- 415
-
Effect of addition of an interfacial agent on the joint strength of a nitrile-phenolic structural adhesiveAchary, P. Sasidharan / Chockalingam, G. / Ramaswamy, R. et al. | 1988
- 427
-
The coated inclusion effect on the mode of fracture of encapsulated particulatesTheocaris, P.S. / Demakos, C.B. et al. | 1988
- 449
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Evaluation of a thermoplastic polyimide (422) for bonding GR/PI compositeProgar, Donald J. et al. | 1988
- 463
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Adhesion of PMDA-ODA polyimide to silicon oxide surface: sensitivity to fluorine contaminationBuchwalter, L.P. / Lacombe, R.H. et al. | 1988