Next generation multilayer dielectrics for high reliability multilayer hybrid circuits (Englisch)
- Neue Suche nach: Flick, Stefan
- Neue Suche nach: Kipka, Annette
- Neue Suche nach: Malanga, David
- Neue Suche nach: Flick, Stefan
- Neue Suche nach: Kipka, Annette
- Neue Suche nach: Malanga, David
In:
IMAPS, International Symposium on Microelectronics, 39
;
914-919
;
2006
-
ISBN:
- Aufsatz (Konferenz) / Print
-
Titel:Next generation multilayer dielectrics for high reliability multilayer hybrid circuits
-
Beteiligte:
-
Erschienen in:
-
Verlag:
- Neue Suche nach: IMAPS
-
Erscheinungsort:Washington
-
Erscheinungsdatum:2006
-
Format / Umfang:6 Seiten, 6 Bilder, 3 Tabellen, 2 Quellen
-
ISBN:
-
Medientyp:Aufsatz (Konferenz)
-
Format:Print
-
Sprache:Englisch
-
Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 5
-
A novel wideband embedded decoupling structure for power supply distribution in rf and microwave circuits that eliminates bypass capacitors by controlling resonancesJerse, Thomas A. / Barnett, Ron et al. | 2006
- 100
-
Characterization of carbon nanotube filled conductive adhesiveLi, Jing / Lumpp, Janet K. et al. | 2006
- 105
-
High-temperature spin-on adhesive for temporary wafer bondingPillalamarri, S. / Puligadda, R. / Brubaker, C. / Wimplinger, M. / Pargfrieder, S. et al. | 2006
- 148
-
Super thin flip chip assemblies on flex substrates - adhesive bonding and soldering technology - reliability investigations and applicationsHaberland, Julian / Pahl, Barbara / Kallmayer, Christine / Aschenbrenner, Rolf / Reichl, Herbert et al. | 2006
- 156
-
A new low stress flip chip bonding method using ultra-precision cutting of metal/adhesive layersSakai, Taiji / Sakuyama, Seiki / Mizukoshi, Masataka et al. | 2006
- 204
-
Flexible interconnects for deformable ultra-thin substratesZoumpoulidis, T. / Wang, L. / Bartek, M. / Jansen, K.M.B. / Polyakov, A. / Sosin, S. / Ernst, L.J. / Dekker, R. / Burghartz, J.N. et al. | 2006
- 241
-
Packaged microwave components for multimedia satellite communicationKulke, Reinhard / Günner, Carsten / Kersten, Olaf / Winkler, Josef / Rittweger, Matthias et al. | 2006
- 254
-
mm-wave packaging: A cost-effective solution based on a leadless plastic packageEngl, Mario / Pressel, Klaus / Dangelmaier, Jochen / Theuss, Horst / Kienmayer, Christoph / Knapp, Herbert / Simbuerger, Werner / Weigel, Robert et al. | 2006
- 262
-
Reducing LTCC losses at high millimetre-wave frequenciesHenry, M. / Free, C. / Reynolds, Quentin / Malkmus, Stefan / Wood, Jim et al. | 2006
- 284
-
Low inductance land-grid array decoupling capacitorsRitter, Andrew P. / Garrafa, Roberto N. et al. | 2006
- 365
-
Leadfree automotive electronics: status quo & first experiences in production and fieldDavis, Dan / Lange, Petrik / Davidson, Troy et al. | 2006
- 413
-
Plasma treatment for enhancing wire bonding to Cu surfaceSoussan, Philippe / Stoukatch, Serguei / Beyne, Eric et al. | 2006
- 478
-
Micro bump formation by using a super fine inkjet systemMurata, Kazuhiro / Shimizu, Kazuo et al. | 2006
- 545
-
RF/microwave modeling of SiP modules - a novel approachNdip, Ivan / Reichl, Herbert / Guttowski, Stephan et al. | 2006
- 583
-
Embedded thin film capacitor for PCB applicationChung, Yul-Kyo / Lee, Jungwon / Sohn, SeungHyun / Lim, Sung Taek / Lee, Inhyung / Jung, HyungMi / Lee, Seung-Eun / Moon, Jin-Seok / Kim, Woon-Chun / Oh, Yong-Soo et al. | 2006
- 596
-
Frontend components for 40 GHz FWA applications in multilayer LTCCKulke, Reinhard / Kersten, Olaf / Möllenbeck, Gregor / Rittweger, Matthias et al. | 2006
- 653
-
Multiple flip-chip assembly for hybrid compact optoelectronic modules using electroplated AuSn solder bumpsChu, K.M. / Lee, J.S. / Oppermann, H. / Engelmann, G. / Wolf, J. / Reichl, H. / Jeon, D.Y. et al. | 2006
- 668
-
Development of 100+ GHz high-frequency MicroCoax wire bondsCahill, Sean S. / Sanjuan, Eric A. / Levine, Lee et al. | 2006
- 709
-
Recent development of DBC (Direct Copper Bonded) substrates: massive copper vias and high temperature solder stopSchulz-Harder, Jürgen / Exel, Karl / Meyer, Andreas et al. | 2006
- 742
-
Performance, production, and applications of advanced metal diamond composite heat spreaderBollina, Ravi / Wagner, H. / Landgraf, J. / Wilhelm, R. / Knippscheer, S. / Tabernig, B. et al. | 2006
- 766
-
Lead-free die-attach material for power electronicsThomas, Muriel / Schaack, Klaus et al. | 2006
- 826
-
Test chip for measurement of the mechanical stress caused by packaging applicationsHirsch, Soeren / Schmidt, Bertram et al. | 2006
- 914
-
Next generation multilayer dielectrics for high reliability multilayer hybrid circuitsFlick, Stefan / Kipka, Annette / Malanga, David et al. | 2006
- 920
-
Interactions between thick film resistors and aluminium nitride substratesKretzschmar, Christel / Hentsche, Melanie / Reppe, Günther et al. | 2006
- 937
-
On the influence of layer-to-layer misalignment on the microwave performance of LTCC antenna modulesUhlig, Peter / Holzwarth, Sybille / Litschke, Oliver / Serwa, Alexandra / Tran, Dinh Trung et al. | 2006
- 1008
-
A novel DoD metal-jet system for solder bumping formationLee, Taik-Min / Kang, Tae Goo / Yang, Jeong-Soon / Jo, Jeong-Dai / Kim, Kwang-Young / Choi, Byung-Oh / Kim, Dong-Soo et al. | 2006
- 1019
-
Latest technological advancements in stencil printing processes for ultrafine-pitch flip chip bumping down to 60 micron pitchManessis, Dionysios / Patzelt, Rainer / Ostmann, Andreas / Aschenbrenner, Rolf / Reichl, Herbert / Kay, Robert / Gourcuff, Erwan de et al. | 2006
- 1084
-
Packaged N-typed field effect transistors using GaN nanowiresNguyen, Son / Delalic, Joan Zdenka / Catchmark, Jeffrey M. et al. | 2006
- 1094
-
Development of a portable zeolite-based gas sensorKargbo, D.M. / Delalic, Z.J. / Hasan, Z. / Catchmark, J.M. / Nguyen, S. et al. | 2006
- 1108
-
Portable device for detection of toxic chemicals using yeast- based biosensorNguyen, Son / Vijayanna, Sowrabha / Delalic, Joan Z. / Dhanasekaran, Danny et al. | 2006
- 1140
-
Electrical and thermomechanical evaluation of 2nd-level-interconnects for LTCC modulesBaras, Torben / Hernandez, Maria Corrales / Jacob, Arne F. et al. | 2006
- 1199
-
Characterization methods for mechanical stress caused by packaging processesHirsch, Soeren / Schmidt, Bertram et al. | 2006
- 1280
-
High-performance flip-chip BGA technology based on thin-core and coreless package substrateKoide, Masateru / Fukuzono, Kenji / Yoshimura, Hideaki / Sato, Toshihisa / Abe, Kenichiro / Fujisaki, Hidehiko et al. | 2006
- 1286
-
Novel concepts for BCB processingBrubaker, C. / Jennison, M. et al. | 2006
- 1323
-
Rare earth doped photonic glass materials for the miniaturization and integration of optoelectronic devicesChoi, J.H. / Margaryan, Alfred / Margaryan, Ashot / Veer, Wytze van der / Shi, Frank G. et al. | 2006
- 1353
-
Fully wafer-level packaged RF MEMS switch using low voltage operated piezoelectric actuator for the application to reconfigurable antennaPark, Jae-Hyoung / Lee, Hee-Chul / Park, Yong-Hee / Kim, Yong-Dae / Kwon, Hyouk / Nam, Hyo-Jin / Bu, Jong-Uk et al. | 2006
- 1367
-
Bump interconnect of IC using plating technologyOhno, Yasuhide / Taniguchi, Keisuke / Kimiya, Yasuhiro / Fukunaga, Katsuaki et al. | 2006