Wafer-level low temperature bonding with Au-In system (Englisch)
- Neue Suche nach: Sohn, Yoon-Chul
- Neue Suche nach: Wang, Qian
- Neue Suche nach: Ham, Suk-Jin
- Neue Suche nach: Jeong, Byung-Gil
- Neue Suche nach: Jung, Kyu-Dong
- Neue Suche nach: Choi, Min-Seog
- Neue Suche nach: Kim, Woon-Bae
- Neue Suche nach: Moon, Chang-Youl
- Neue Suche nach: Sohn, Yoon-Chul
- Neue Suche nach: Wang, Qian
- Neue Suche nach: Ham, Suk-Jin
- Neue Suche nach: Jeong, Byung-Gil
- Neue Suche nach: Jung, Kyu-Dong
- Neue Suche nach: Choi, Min-Seog
- Neue Suche nach: Kim, Woon-Bae
- Neue Suche nach: Moon, Chang-Youl
In:
ECTC, IEEE Electronic Components and Technology Conference, 57
;
633-637
;
2007
-
ISBN:
- Aufsatz (Konferenz) / Print
-
Titel:Wafer-level low temperature bonding with Au-In system
-
Beteiligte:Sohn, Yoon-Chul ( Autor:in ) / Wang, Qian ( Autor:in ) / Ham, Suk-Jin ( Autor:in ) / Jeong, Byung-Gil ( Autor:in ) / Jung, Kyu-Dong ( Autor:in ) / Choi, Min-Seog ( Autor:in ) / Kim, Woon-Bae ( Autor:in ) / Moon, Chang-Youl ( Autor:in )
-
Erschienen in:
-
Verlag:
- Neue Suche nach: IEEE Operations Center
-
Erscheinungsort:Piscataway
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Erscheinungsdatum:2007
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Format / Umfang:5 Seiten, 15 Quellen
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ISBN:
-
DOI:
-
Medientyp:Aufsatz (Konferenz)
-
Format:Print
-
Sprache:Englisch
-
Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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- 722
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Silicon-Based, Multi-Chip LED PackageJeung, Won Kyu / Shin, Sang Hyun / Hong, Suk Youn / Choi, Seog Moon / Yi, Sung / Yoon, Young Bok / Kim, Hyun Jun / Lee, Sung Jun / Park, Ki Yeol et al. | 2007
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A 40-Gb/s Optical Module Using 4-Channel WDM TOSA for Access Network ApplicationsLin, Min-Ching / Shih, Tien-Tsorng / Chieh, Hu / Cheng, Chih-Chin / Tseng, Pei-Hao / Cheng, Wood-Hi et al. | 2007
- 734
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High Thermal Dissipation of Ultra High Power Light-Emitting Diodes by Copper ElectroplatingChen, Kuan Chun / Chuang, Ricky W. / Su, Y. K. / Lin, C. L. / Hsu, Hsiao Chiu / Huang, J. Q. / Yang, K. F. et al. | 2007
- 737
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Controlling Top Package Warpage for POP ApplicationsCarson, Flynn / Lee, Seong Min / Vijayaragavan, Niranjan et al. | 2007
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Platform of 3D Package IntegrationWang, Wei Chung / Lee, Fred / Weng, GL / Tai, Willie / Ju, Michael / Chuang, Ron / Fang, Weileun et al. | 2007
- 748
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Effects of Organic Package Warpage on Microprocessor Thermal PerformanceToo, Seah S. / Hayward, James / Master, Raj / Tan, Tek-Seng / Keok, Kee-Hean et al. | 2007
- 755
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Environmental Effects on Dielectric Films in Plastic Encapsulated Silicon DevicesLi Li, / Xue, Jie / Ahmad, Mudasir / Brillhart, Mark / Lu, Gary / Luo, Zhiquan / Im, Jay / Ho, Paul S. et al. | 2007
- 761
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Laser Dicing and Subsequent Die Strength Enhancement Technologies for Ultra-thin WaferLi, Jianhua / Hwang, Hyeon / Ahn, Eun-Chul / Chen, Qiang / Kim, Pyoungwan / Lee, Teakhoon / Chung, Myeongkee / Chung, Taegyeong et al. | 2007
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Advanced Co-Planarity Measurement Tools for the Warpage Investigation of Non-Conventional Packages Caused by Reflow and Assembly ProcessHartsough, C. / Goswami, A. / Jang, C. / Han, B. et al. | 2007
- 773
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Novel Manufacturing Processes for Ultra-Low-Cost Paper-Based RFID Tags with Enhanced "Wireless Intelligence"Rida, Amin / Li Yang, / Vyas, Rushi / Basat, Serkan / Bhattacharya, Swapan K. / Tentzeris, Manos M. et al. | 2007
- 777
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Competitiveness and Technical Challenges of Low Cost Wirebond Packaging for High Speed SerDes Applications in ASICsZwitter, Deborah / Na, Nanju / Arseneault, Marcel / Yonehara, Katsuyuki / Hu, Haitian / Bailey, Mark / Cannon, Todd et al. | 2007
- 785
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Off-Chip Rough-Metal-Surface Propagation Loss Modeling and Correlation with MeasurementsBraunisch, Henning / Gu, Xiaoxiong / Camacho-Bragado, Alejandra / Tsang, Leung et al. | 2007
- 792
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Frequency-Dependent Dielectric Constant and Loss Tangent Characterization of Thin Dielectrics Using a Rapid SolverEngin, A. Ege / Tambawala, Abdemanaf / Swaminathan, Madhavan / Bhattacharya, Swapan / Pramanik, Pranabes / Yamazaki, Kazuhiro et al. | 2007
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Co-Simulation of IC, Package and PCB Power Delivery Networks in Ultra-Low Voltage Power Rail DesignsKowalski, Marc E. / Codd, Patrick et al. | 2007
- 804
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Effect of Power and Ground Co-Reference to Performance of Memory Interface I/Os in FPGA and Structural ASIC Device PackagesShi, Hong / Jiang, Xiaohong / Yew, Yeehuan et al. | 2007
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A Measurement Based Comparison of Full-Wave and Quasi-static Methods for Baseband Modeling of Plated Through Hole Structures to 20GHzCartier, Marc / Sivaprasad, Kondagunta U. et al. | 2007
- 815
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Hybrid of Scattering Matrix Method and Integral Equation used for Co-simulation of Power Integrity and EMI in Electronic Package with Large Number of P/G ViasOo, Zaw Zaw / Liu, En-Xiao / Wei, XingChang / Choon, Mark Tan Yew / Li, Er-Ping / Zhang, Yaojiang / Li, Le-Wei et al. | 2007
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A 3D Stacked Memory Integrated on a Logic Device Using SMAFTI TechnologyKurita, Yoichiro / Matsui, Satoshi / Takahashi, Nobuaki / Soejima, Koji / Komuro, Masahiro / Itou, Makoto / Kakegawa, Chika / Kawano, Masaya / Egawa, Yoshimi / Saeki, Yoshihiro et al. | 2007
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Via First Technology Development Based on High Aspect Ratio Trenches Filled with Doped PolysiliconHenry, D. / Baillin, X. / Lapras, V. / Vaudaine, MH. / Quemper, JM. / Sillon, N. / Dunne, B. / Hernandez, C. / Vigier-Blanc, E. et al. | 2007
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Self-Assembly Process for Chip-to-Wafer Three-Dimensional IntegrationFukushima, T. / Yamada, Y. / Kikuchi, H. / Tanaka, T. / Koyanagi, M. et al. | 2007
- 842
-
Copper Via Plating in Three Dimensional InterconnectsWorwag, Wojeiech / Dory, Tom et al. | 2007
- 847
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Development and Evaluation of 3-D SiP with Vertically Interconnected Through Silicon Vias (TSV)Jang, Dong Min / Ryu, Chunghyun / Lee, Kwang Yong / Cho, Byeong Hoon / Kim, Joungho / Oh, Tae Sung / Lee, Won Jong / Yu, Jin et al. | 2007
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Integrated System Development for 3-D VLSISchaper, L. / Burkett, S. / Gordon, M. / Cai, L. / Liu, Y. / Jampana, G. / Abhulimen, I. U. et al. | 2007
- 858
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Via Interconnections for Wafer Level Packaging: Impact of Tapered Via Shape and Via Geometry on Product Yield and ReliabilityShariff, Dzafir / Suthiwongsunthorn, Nathapong / Bieck, Florian / Leib, Jurgen et al. | 2007
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Cu/SnAg Double Bump Flip Chip Assembly as an Alternative of Solder Flip Chip on Organic Substrates for Fine Pitch ApplicationsSon, Ho-Young / Jung, Gi-Jo / Lee, Jun-Kyu / Choi, Joon-Young / Paik, Kyung-Wook et al. | 2007
- 872
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Lead-Free Solder Micro-Ball Bumps for the Next Generation of Flip Chip Interconnection: Micro-Ball Materials, Bump Formation Process and ReliabilityIshikawa, Shinji / Uchiyama, Tomoyuki / Hashino, Eiji / Kohno, Taro / Tanaka, Masamoto / Tatsumi, Kohei et al. | 2007
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Development and Implementation of C4NP Technology for 300 mm WafersGiri, Ajay P. / Perfecto, Eric D. / Longworth, Hai P. / Semkow, Krystyna W. / Knickerbocker, Sarah H. et al. | 2007
- 885
-
Low-Stress Interconnection for Flip Chip BGA Employing Lead-Free Solder BumpUchida, Masayuki / Ito, Hisashi / Yabui, Ken / Nishiuchi, Hideo / Togasaki, Takashi / Higuchi, Kazuhito / Ezawa, Hirokazu et al. | 2007
- 892
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Crystallographic Features of Copper Column Growth by Reversible Pulse Current ElectrodepositionLiu, Jun / Liu, Changqing / Conway, Paul P et al. | 2007
- 898
-
Novel Flip-Chip Bonding Technology using Chemical ProcessYamaji, Yasuhiro / Yokoshima, Tokihiko / Oosato, Hirotaka / Igawa, Noboru / Tamura, Yuichiro / Kikuchi, Katsuya / Nakagawa, Hiroshi / Aoyagi, Masahiro et al. | 2007
- 905
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Reliability of Nano-Structured Nickel Interconnections Replacing FlipChip Solder Assembly without UnderfillAggarwal, Ankur / Raj, P. Markondeya / Lee, Baik-Woo / Yim, Myung Jin / Tambawala, Abdemanaf / Iyer, Mahadevan / Swaminathan, Madhavan / Wong, C. P. / Tummala, Rao et al. | 2007
- 914
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Transient Dynamic Simulation and Full-Field Test Validation for A Slim-PCB Of Mobile Phone under Drop / ImpactPark, Seungbae / Shah, Chirag / Kwak, Jae / Jang, Changsoo / Pitarresi, James / Park, Taesang / Jang, Seyoung et al. | 2007
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High Speed Digital Image Correlation for Transient-Shock Reliability of ElectronicsLall, Pradeep / Panchagade, Dhananjay / Iyengar, Deepti / Shantaram, Sandeep / Suhling, Jeff / Schrier, Hubert et al. | 2007
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Effect of Temperature on the Drop Reliability of Wafer-Level Chip Scale Packaged Electronics AssembliesMattila, T. T. / James, R. J. / Nguyen, L. / Kivilahti, J. K. et al. | 2007
- 946
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Improvement of JEDEC Drop Test in SJR Qualification through Alternative Test Board DesignZhao, Junfeng / Liu, Fang / Zhou, Xin / Zhou, Haiting / Jing, Jianping / Zhao, Mei et al. | 2007
- 951
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Effect of Pb free Alloy Composition on Drop/Impact Reliability of 0.4, 0.5 & 0.8mm Pitch Chip Scale Packages with NiAu Pad FinishSyed, Ahmer / Kim, Tae-Seong / Cha, Se-Woong / Scanlon, Joan / Ryu, Chang-Gyun et al. | 2007
- 957
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Comparative Study of Drop Reliability between Cu and Ni(P)/Au UBM with Sn-3.5Ag-xZn SoldersJee, Y. K. / Ko, Y. H. / Yu, Jin / Lee, T. Y. / Cho, M. K. / Lee, H. M. et al. | 2007
- 962
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Improved Drop Reliability Performance with Lead Free Solders of Low Ag Content and Their Failure ModesKim, Hyunchul / Zhang, Mu / Kumar, Chetan M. / Suh, Daewoong / Liu, Pilin / Kim, Dongwook / Xie, Mayue / Wang, Zhiyong et al. | 2007
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Passi4: The next Technology for Passive Integration on Siliconden Dekker, A. / van Geelen, A. / van der Wel, P. / Koster, R. / Rodenburg, E.C. et al. | 2007
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Low Cost Passive UHF RFID Packaging with Electromagnetic Band Gap (EBG) Substrate for Metal ObjectsGao, Bo / Cheng, Chi Ho / Yuen, Matthew M.F. / Murch, Ross D. et al. | 2007
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Global Universal Radio Units (GURU) Realized Using Multilayer Organics (MLO)Dalmia, S. / White, G. / Govind, V. / Carastro, L. / Min, Sung-Hwan / Sundaram, V. et al. | 2007
- 986
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Complete Front-to-back RF SiP Design Implementation FlowPark, John / Hartung, Juergen / Dudek, Heiko et al. | 2007
- 992
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Electrical Characterization and Design Optimization of Embedded Chip in Substrate CavitiesSankaran, Nithya / Lee, Baik-Woo / Sundaram, Venky / Engin, Ege / Iyer, Mahadevan / Swaminathan, Madhavan / Tummala, Rao et al. | 2007
- 1000
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Technology Options for Next-Generation High Pin Count RF PackagingPolka, Lesley A. / Hsu, Rockwell / Myers, Todd B. / Chen, Jing H. / Bao, Andy et al. | 2007
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High-Performance Millimeter-Wave SOP Technology with Flip-Chip InterconnectionSong, Sangsub / Maeng, Jimin / Lee, Heeseok / Seo, Kwang-Seok et al. | 2007
- 1014
-
Processing, Properties and Electrical Reliability of Embedded Ultra-Thin Film Ceramic Capacitors in Organic PackagesAbothu, Isaac Robin / Raj, P. Markondeya / Hwang, Jin Hyun / Kumar, Manish / Iyer, Mahadevan / Yamamoto, Hiroshi / Tummala, Rao et al. | 2007
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Electrospun Nano-Fibrous Polymer Films with Barium Titanate Nanoparticles for Embedded Capacitor ApplicationsCarlberg, Bjorn / Norberg, Jonas / Liu, Johan et al. | 2007
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Characteristics of Fine Patterned Epoxy/BaTiO3 Composite Embedded Capacitor Films (ECFs) for Organic SubstratesHyun, Jin-Gul / Paik, Kyung-Wook et al. | 2007
- 1033
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Tailored Dielectric Properties of High-k Polymer Composites via Nanoparticle Surface Modification for Embedded Passives ApplicationsLu, Jiongxin / Wong, C.P. et al. | 2007
- 1040
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Moisture Transport and its Effects on Fracture Strength and Dielectric Constant of Underfill MaterialsLu, Kuan H. / Chao, Brook / Luo, Zhiquan / Zhang, Lijuan / Shi, Hualiang / Im, Jay / Ho, Paul S. / Li Li, / Ahmad, Mudasir et al. | 2007
- 1045
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Fiber Bragg Grating Sensor to Characterize Curing Process-dependent Mechanical Properties of Polymeric MaterialsWang, Y. / Han, B. / Bar-Cohen, A. / Cho, S. et al. | 2007
- 1051
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Halogen-Free Mold Compound Development for Ultra-Thin PackagesLiu, Fenny / Yao, C. T / Jiang, Don Son / Wang, Yu Po / Hsiao, C. S. et al. | 2007
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Mechanical Characterization of Deformable Ultra-Thin Substrates by Experiment and FE SimulationWang, L. / Zoumpoulidis, T. / Jansen, K.M.B. / Bartek, M. / Zhang, G.Q. / Ernst, L.J. et al. | 2007
- 1062
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Experimental and Numerical Study of the Effect of Viscoelasticity on Delamination in a Plastic IC PackageGuojun, Hu / Tay, Andrew A. O. / Yongwei, Zhang / Chew, Spencer et al. | 2007
- 1069
-
Experimental and Numerical Characterization of Non-Fickian Moisture Diffusion in Electronic PackagesCelik, Emrah / Guven, Ibrahim / Madenci, Erdogan et al. | 2007
- 1074
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Solder Joint Reliability under Electromigration and Thermal-Mechanical LoadWang, ShiNan / Liang, Lihua / Liu, Yong / Irving, Scott / Luk, Timwah et al. | 2007
- 1084
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Integrated Modeling of C4 InterconnectsSylvestre, Julien et al. | 2007
- 1091
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Reliability Modeling of Lidded Flip Chip PackagesZhai, Charlie J / Too, Seah S / Master, Raj N et al. | 2007
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Prognostics Health Monitoring (PHM) for Prior-Damage Assessment in Electronics Equipment under Thermo-Mechanical LoadsLall, Pradeep / Hande, Madhura / Bhat, Chandan / Suhling, Jeff / Lee, Jay et al. | 2007
- 1112
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Time-Lapse Measurements of Stress Relaxation in MEMS Sensor Die BondsMarinis, Thomas F. / Soucy, Joseph W. / Marinis, Ryan T. / Klempner, Adam R. / Hefti, Peter / Pryputniewicz, Ryszard J. et al. | 2007
- 1119
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Method for Creating Low Cost 3D MEMS Chemical Sensors by Using Through Wafer VIAS and Wafer BondingWagner, Mark / Zou, Jin et al. | 2007
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Characterization and Reliability Verification of Wafer-Level Hermetic Package with Nano-Liter Cavity for RF-MEMS ApplicationsHam, Suk-Jin / Jeong, Byung-Gil / Lim, Ji-Hyuk / Jung, Kyu-Dong / Baek, Kae-Dong / Kim, Woon-Bae / Moon, Chang-Youl et al. | 2007
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Preparation of Superhydrophobic Silica Thin Films for Antistiction of MEMS Devices Using a Novel Sol-Gel ProcessXiu, Yonghao / Zhu, Lingbo / Hess, Dennis W. / Wong, C. P. et al. | 2007
- 1143
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Design, Fabrication and Testing of Miniaturised Wireless Inertial Measurement Units (IMU)Barton, J / Gonzalez, A / Buckley, J / O'Flynn, B / O'Mathuna, S C et al. | 2007
- 1149
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Concept and Analytical analysis of Silicon micro/nanopillars based 3-D stacked microchannel heat sink for advanced heat dissipation applicationsDixit, Pradeep / Lin, Nay / Miao, Jianmin / Wong, Wai Kwan / Teo, Kiat Choon et al. | 2007
- 1155
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New Fluxless Hermetic Sealing Technique Using Electroplated Sn-Rich Soft SolderKim, Jong S. / Wang, Pin J. / Lee, Chin C. et al. | 2007
- 1161
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Statistical Pattern Recognition and Built-in Reliability Test for Feature Extraction and Health Monitoring of Electronics under Shock LoadsLall, Pradeep / Choudhary, Prakriti / Gupte, Sameep / Suhling, Jeff / Hofmeister, James et al. | 2007
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Thermo-Mechanical Analysis of Thru-Silicon-Via Based High Density Compliant InterconnectArunasalam, Parthiban / Zhou, Fan / Ackler, Harold D. / Sammakia, Bahgat G. et al. | 2007
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Challenges in Temperature Cycling Test for Electronic Packages Containing Low-K/Cu SiliconLee, Chu-Chung / Tran, Tu Anh / Yuan, Yuan / Siong, Chin-Teck / Lau, TB et al. | 2007
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Power Delivery Network Design for 3D SIP Integrated over Silicon Interposer PlatformLee, Heeseok / Choi, Yun-Seok / Song, Eunseok / Choi, Kiwon / Cho, Taeje / Kang, Sayoun et al. | 2007
- 1199
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Efficient Simulation of Power/Ground Planes for SiP ApplicationsBharath, Krishna / Engin, Ege / Swaminathan, Madhavan / Uriu, Kazuhide / Yamada, Toru et al. | 2007
- 1206
-
A Novel Electromagnetic Bandgap Structure for SSN Suppression in PWR/GND plane pairsScogna, A. Ciccomancini / Schauer, M. et al. | 2007
- 1212
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Wideband and High-Isolation Properties of Power Bus Structure by the Combination of Thin-Film Embedded Capacitor and Planar EBG StructureSudo, Toshio / Ichijo, Seiju / Kushihira, Takanobu et al. | 2007
- 1218
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A Novel Method to Prepare Superhydrophobic, Self-Cleaning and Transparent Coatings for Biomedical ApplicationsXiu, Yonghao / Hess, Dennis W. / Wong, C.P. et al. | 2007
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Carbon Nanotube/Copper Composites for Via Filling and Thermal ManagementChai, Yang / Zhang, Kai / Zhang, Min / Chan, Philip C. H. / Yuen, Matthrew M. F. et al. | 2007
- 1230
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Suitably Patterned Thin Stiff Films as General Platforms for Flexible ElectronicsLi, Teng et al. | 2007
- 1235
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A Stackable Silicon Interposer with Integrated Through-Wafer InductorsCarlson, J. / Lueck, M. / Bower, C. A. / Temple, D. / Feng, Z. -P / Steer, M.B. / Moll, A.J. / Knowlton, W.B. et al. | 2007
- 1239
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A Novel And Efficient Packaging Technology For RF-MEMS DevicesTheunis, F. / Lisec, T. / Reinert, W. / Bielen, J. / Yang, D. / de Jongh, M. / Krusemann, P.V.E. et al. | 2007
- 1246
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On-Chip Millimeter-Wave Library Device - Scalable Wilkinson Power Divier/CombinerDing, Hanyi / Lam, Kwanhim / Mina, Essam / Rascoe, Jay / Jordan, Donald / Zeeb, Adam / Gaucher, Brian et al. | 2007
- 1252
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A Simple Transmission-Line Model to Distinguish the Q-Factor Responses among Various Kinds of Integrated InductorsTsai, Yu-Shun / Huang, Chien-Hsiang / Chiu, Chi-Tsung / Horng, Tzyy-Sheng / Hung, Chih-Pin et al. | 2007
- 1256
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160-Gb/s Bidirectional Parallel Optical Transceiver Module for Board-Level Interconnects Using a Single-Chip CMOS ICDoany, Fuad E. / Schow, Clint L. / Baks, Christian / Budd, Russell / Chang, Yin-Jung / Pepeljugoski, Petar / Schares, Laurent / Kuchta, Daniel / John, Richard / Kash, Jeffrey A. et al. | 2007
- 1262
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OE Device Integration for Optically Enabled MCMTaira, Yoichi / Numata, Hidetoshi / Yamada, Fumiaki / Katayama, Yasunao / Nakagawa, Shigeru / Hasegawa, Masaki / Terada, Kenji / Tsukada, Yutaka et al. | 2007
- 1268
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Demonstration of High Frequency Data Link on FR4 Printed Circuit Board Using Optical WaveguidesLim, Teck Guan / Lee, Bryan Sik Pong / Shioda, Tsuyoshi / Kuruveettil, Haridas / Li, Jing / Suzuki, Kenji / Fujita, Kazuhito / Yamada, Kazuhiro / Ramana, Pamidighantam V. et al. | 2007
- 1275
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A High-Coupling-Efficiency Multilayer Optical Printed Wiring Board with a Cube-Core Structure for High-Density Optical InterconnectionsShishikura, M. / Matsuoka, Y. / Ban, T. / Shibata, T. / Takahashi, A. et al. | 2007
- 1281
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Embedding of Optical Interconnections in Flexible ElectronicsBosman, E. / Van Steenberge, G. / Geerinck, P. / Christiaens, W. / Vanfleteren, J. / Van Daele, P. et al. | 2007
- 1288
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120 Gb/s Optical Card-to-Card Interconnect Link Demonstrator with Embedded WaveguidesDellmann, L. / Berger, C. / Beyeler, R. / Dangel, R. / Gmur, M. / Hamelin, R. / Horst, F. / Lamprecht, T. / Meier, N. / Morf, T. et al. | 2007
- 1294
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SDH/SONET Multi-rate SFP Module with Gain Selectable Transimpedance Amplifier and Extinction Ratio Control CircuitTanaka, Keiji / Seki, Morihiro / Furudate, Seigo / Moto, Akihiro / Takagi, Toshio / Yoshikawa, Satoshi / Saeki, Tomoya / Uesaka, Katsumi et al. | 2007
- 1300
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Pattern Density Methodology Using IBM Foundry TechnologiesScagnelli, David / Grant, Casey / Carrig, Keith / Kemerer, Tim / Landis, Howard / McDevitt, Tom / Sucharitaves, Jeanne-tania / Tsai, Esther / Kumar, Mukesh / Pastel, Paul et al. | 2007
- 1308
-
Embedded Chip Build-Up in a Wafer-Level Packaging EnvironmentBauer, C. E. / Neuhaus, H. J. et al. | 2007
- 1313
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Comprehensive Assembly and Reliability Study of 0201's for High Reliability Applications for Utilizing both a Pb-Free and Sn/Pb Assembly ProcessRamakrishna, Gnyaneshwar / Nandagopal, Bala / Dick, Tim / Burton, Anthony / Higdon, Reggie / Anvari, Mike / Hu, Mason / Teng, Sue / Xue, Jie et al. | 2007
- 1320
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C4NP Technology for Lead Free Solder BumpingLaine, Eric / Perfecto, Eric / Campbell, Barrie / Wood, James / Busby, James / Garant, John / Guerin, Luc et al. | 2007
- 1326
-
Novel Flip Chip Technologies for Ultra Thin ChipTakyu, Shinya / Kiritani, Mika / Kurosawa, Tetsuya / Shimizu, Noriko / Sato, Akinori / Maeda, Jun / Otsuka, Masahisa / Takamatsu, Hiroyuki et al. | 2007
- 1333
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From Leaded to Lead Free Assembly and New Packaging Technology ChallengesLavoie, Helene / Paquet, Marie-Claude / Sylvestre, Julien / Ouimet, Sylvain / Duchesne, Eric / Barbeau, Stephane / Gauvin, Marco / Oberson, Valerie et al. | 2007
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Solder Joint Characteristics and Reliability of Lead-Free Area Array Packages Assembled Under Various Tin-Lead Soldering Process ConditionsNguyen, Jennifer / Geiger, David / Rooney, Daniel / Shangguan, Dongkai et al. | 2007
- 1350
-
Nano-Scale Conductive Films with Low Temperature Sintering for High Performance Fine Pitch InterconnectLi, Yi / Yim, Myung Jin / Moon, Kyung Sik / Wong, C.P. et al. | 2007
- 1356
-
Development of Material and Processing Technology for High Thermal Conductive Multilayer ModuleKohara, Yasuhiro / Usui, Ryosuke / Mizuhara, Hideki / Nishida, Atsuhiro / Nakasato, Mayumi / Kusabe, Takaya / Nakamura, Takeshi / Takakusaki, Nobuhisa / Igarashi, Yusuke / Inoue, Yasunori et al. | 2007
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Surface Micro-patterning with Self-assembled Monolayers Selectively Deposited on Copper Substrates by Ink-jet PrintingEbbens, Stephen / Hutt, David A. / Liu, Changqing / Williams, Owain et al. | 2007
- 1368
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Realization of Electrical-Optical-Circuit-Board Self-packagingCai, D.K. / Neyer, A. et al. | 2007
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In-situ Characterization of Moisture Absorption and Desorption in a Thin BT Core SubstrateHe, Yi / Fan, Xuejun et al. | 2007
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Silicon, Low-K Dielectric, and Nano-Scale Metal Interface Characterization Using Stress-Engineered Superlayer Test MethodsZheng, Jiantao / Modi, Mitul / Ginga, Nicholas / Sitaraman, Suresh et al. | 2007
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Ultra-thin Die Characterization for Stack-die PackagingSun, Wei / Zhu, W.H. / Che, F.X. / Wang, C.K. / Sun, Anthony Y.S. / Tan, H.B. et al. | 2007
- 1397
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High Density PoP (Package-on-Package) and Package Stacking DevelopmentDreiza, Moody / Yoshida, Akito / Ishibashi, Kazuo / Maeda, Tadashi et al. | 2007
- 1403
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PoP (Package-on-Package) Stacking Yield Loss StudyIshibashi, Kazuo et al. | 2007
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Chip Scale Module Package for WLAN Module ApplicationLiu, Kai / Frye, Robert C. / Guruprasad, Badakere / Chelvam, Marimuthu P. / Dunlap, Brett / Gongora, Eric et al. | 2007
- 1415
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Chip Scale Package Design for Thermal Performance in Mobile HandsetsBai, Cher / Veatch, Mark et al. | 2007
- 1420
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New Encapsulation Process for the SIP (System in Package)Kim, Tae Hyun / Yi, Sung / Seo, Hyoung Ho / Jung, Tae Sung / Guo, Yan Shuang / Doh, Jae Cheon / Okuno, Atsushi / Lee, Seog Hee et al. | 2007
- 1425
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Flip Chip Package-in-Package (fcPiP): A New 3D Packaging Solution for Mobile PlatformsPendse, Raj / Choi, BS / Kim, Baker / Kim, KM / Kim, YC / Lee, Kenny / Park, Susan / Yang, DW / Zhao, Lily / Gregorich, Tom et al. | 2007
- 1431
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Multi-layer Copper-Dielectric Adhesion Challenges of 5-12 micron Lines/Spaces for Next Generation SOP (System-on-Package) / Microprocessor Package SubstratesWiedenman, Boyd / Sundaram, Venky / Liu, Fuhan / Krishnan, Ganesh / Roberts, Hugh / Brooks, Patrick / Johal, Kuldip / Iyer, Mahadevan / Tummala, Rao R et al. | 2007
- 1436
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Joule Heating Effect on the Electromigration Lifetimes and Failure Mechanisms of Sn-3.5Ag Solder BumpLee, Jang-Hee / Lee, Yong-Duk / Park, Young-Bae / Yang, Seung-Taek / Suh, Min-Suk / Chung, Qwan-Ho / Byun, Kwang-Yoo et al. | 2007
- 1442
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Investigation of Intermetallic Compound Growth Enhanced by Electromigration in Pb-Free Solder JointsChae, Seung-Hyun / Chao, Brook / Zhang, Xuefeng / Im, Jay / Ho, Paul S. et al. | 2007
- 1450
-
Electromigration Study in Flip Chip Solder JointsNah, Jae-Woong / Chen, Kai / Suh, J. O. / Tu, K. N. et al. | 2007
- 1456
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Current Carrying Capability of Sn0.7Cu Solder Bumps in Flip Chip Modules for High Power ApplicationsRamanathan, Lakshmi N. / Lee, Tien-Yu Tom / Jang, Jin-Wook / Chae, Seung-Hyun / Ho, Paul S. et al. | 2007
- 1462
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Failure Mechanism of Sn-Ag-Cu Flip-chip Solder Joints with Different Cu Weight Contents Under Comparatively Low Current StressingLai, Yi-Shao / Chiu, Ying-Ta et al. | 2007
- 1467
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The Electromigration Investigation on the Newly Developed Pb-free Sn-Zn-Ag-Al-Ga Solder Ball InterconnectLin, Kwang-Lung / Lin, Ger-Pin et al. | 2007
- 1472
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Electromigration of Pb-Free Solder Flip Chip Using Electroless Ni-P/Au UBMKwon, Yong-Min / Paik, Kyung-Wook et al. | 2007
- 1478
-
Continuous In-Situ Die Stress Measurements During Thermal Cycling Accelerated Life TestingRahim, M. Kaysar / Roberts, Jordan / Suhling, Jeffrey C. / Jaeger, Richard C. / Lall, Pradeep et al. | 2007
- 1490
-
Localized Stress Measurements - A New Approach Covering Needs for Advanced Micro and Nanoscale System DevelopmentVogel, Dietmar / Gollhardt, Astrid / Sabate, Neus / Keller, Juergen / Michel, Bernd / Reichl, Herbert et al. | 2007
- 1498
-
Fiber Optic Strain and Structural Health Monitoring in Polymer Electronic PackagingSchreier-Alt, Thomas / Ansorge, Frank / Reichl, Herbert et al. | 2007
- 1504
-
High-Speed Solder Ball Shear and Pull Tests vs. Board Level Mechanical Drop Tests: Correlation of Failure Mode and Loading SpeedSong, Fubin / Lee, S. W. Ricky / Newman, Keith / Sykes, Bob / Clark, Stephen et al. | 2007
- 1514
-
Rapid Interface Reliability Testing of Flip Chip EncapsulantsRau, I. / Becker, K.-F. / Wunderle, B. / Reichl, H. et al. | 2007
- 1522
-
A Component Level Test Method for Evaluating the Resistance of Pb-free BGA Solder Joints to Brittle Fracture under Shock ImpactZhao, X. J. / Caers, J.F.J.M. / de Vries, J.W.C. / Wong, E. H. / Rajoo, R. et al. | 2007
- 1530
-
Board-Level Solder Joint Reliability Study of Land Grid Array Packages for RF Applications Using a Laser Ultrasound Inspection SystemYang, Jin / Zhang, Lizheng / Ume, I. Charles / Ghiu, Camil / White, George et al. | 2007
- 1536
-
Highly Conductive Flexible Transparent Polymeric Anode and its Application in OLEDsWang, Guang-Feng / Tao, Xiao-Ming / Wang, Rong-Xin et al. | 2007
- 1540
-
Large Area Cost-Efficient Electronics Systems IntegrationBock, Karlheinz / Klink, Gerhard / Strohhofer, Christof / Hemmetzberger, Dieter / Feil, Michel et al. | 2007
- 1544
-
Deformable Silicon Electronics Using Segmentation and Flexible InterconnectZoumpoulidis, T. / Wang, L. / Bartek, M. / Jansen, K.M.B. / Ernst, L.J. et al. | 2007
- 1550
-
Electrochemical Biosensors and Microfluidics in Organic System-on-Package TechnologyD.Goud, Janagama / Raj, P. Markondeya / Liu, Jin / Narayan, Roger / Iyer, Mahadevan / Tummala, Rao et al. | 2007
- 1556
-
Design, Fabrication and Assembly of an Optical Biosensor Probe Package for OCT (Optical Coherence Tomography) ApplicationPremachandran, C.S. / Sheng, Kelvin Chen Wei / Singh, Janak / Teo, Jason / Yingshun, Xu / Nanguang, Chen / Sheppard, Colin / Olivo, Malini et al. | 2007
- 1561
-
Wafer Level Assembly Methods for Complex Pathway Micro-Fluidic PCR ReactorStoffel, Nancy / Fisher, Almon / Tan, Songsheng / Boysel, Mark / Grover, Joel W. / Juncosa, Robert et al. | 2007
- 1567
-
Wafer Level Processing of Silicon Arrays for Implantable Medical DevicesBhandari, Rajmohan / Negi, Sandeep / Rieth, Loren / Topper, Michael / Normann, Richard A. / Solzbacher, Florian et al. | 2007
- 1573
-
Fluxless Bonding of Silicon to Molybdenum Using Sn-rich SoldersWang, Pin J. / Kim, Jong S. / Kim, Dongwook / Lee, Chin C. et al. | 2007
- 1579
-
Effect of Composition and Cooling Rate on the Microstructure of SnAgCu-Solder JointsMueller, M. / Wiese, S. / Roellig, M. / Wolter, K.-J. et al. | 2007
- 1589
-
Effects of Assembly Process Parameters on the Structure and Thermal Stability of Sn-Capped Cu Bump BondsHuffman, Alan / Lueck, Matthew / Bower, Christopher / Temple, Dorota et al. | 2007
- 1597
-
Critical Factors Affecting the Undercooling of Pb-free, Flip-Chip Solder Bumps and In-situ Observation of Solidification ProcessKang, Sung K. / Cho, Moon Gi / Lauro, Paul / Shih, Da-Yuan et al. | 2007
- 1604
-
Reliability of Cu Wire Bonding to Al MetallizationEngland, Luke / Jiang, Tom et al. | 2007
- 1614
-
Evaluation of High Compliant Low Ag Solder Alloys on OSP as a Drop Solution for the 2nd Level Pb-Free InterconnectionKim, Dongwook / Suh, Daewoong / Millard, Thomas / Kim, Hyunchul / Kumar, Chetan / Zhu, Mark / Xu, Youren et al. | 2007
- 1620
-
Effect of Electrodeposition Conditions on Kirkendall Void Formation between Electrodeposited Cu Film and Sn-3.5Ag SolderKim, Jong Yeon / Yu, Jin / Lee, Taek Young et al. | 2007
- 1626
-
Enhancement of Laguerre-FDTD with Initial Conditions for Fast Transient EM/Circuit SimulationSrinivasan, K. / Swaminathan, M. / Engin, E. et al. | 2007
- 1632
-
Hierarchical Modeling and Computationally-Efficient Transient Simulation of On-Chip Power GridChung, In Jae / Cangellaris, Andreas C. et al. | 2007
- 1638
-
Implementation of Apertures in a MoM-Based Simulator for Stripline Packaging ProblemsCao, Yi / Wang, Xing / Nielson, Derek / Dvorak, Steven L. et al. | 2007
- 1646
-
Electrical-Optical High Speed Serial Server Scalability Linkde Araujo, D. N. / Mutnury, B. / Cases, M. et al. | 2007
- 1653
-
A Novel Approach for System Level Package Modeling to Address Signal and Power Integrity IssuesWei, X.C. / Liu, E.X. / Oo, Z.Z. / Li, E.P. / Vahldieck, R. et al. | 2007
- 1659
-
Compact Physical Models for Power Supply Noise and Chip/Package Co-Design of Gigascale IntegrationHuang, Gang / Sekar, Deepak C. / Naeemi, Azad / Shakeri, Kaveh / Meindl, James D. et al. | 2007
- 1667
-
Multi-Rate Latency Insertion Method with RLCG-MNA Formulation for Fast Transient Simulation of Large-Scale Interconnect and Plane NetworksAsai, Hideki / Tsuboi, Noritake et al. | 2007
- 1673
-
Premold on Substrate for MEMS PackageWang, Meng-Jen / Yang, Kuo-Bin / Peng, Sheng-Yang / Hsiao, Wei-Min / Wang, Feng-Yan / Wang, Wei-Chung et al. | 2007
- 1678
-
FlexConnects: A Cost-Effective Implementation of Compliant Chip-to-Substrate InterconnectsKacker, Karan / Sokol, Thomas / Sitaraman, Suresh K. et al. | 2007
- 1685
-
Mechanical and Electrical Characterization of Benzocyclobutene Membrane PackagingSeok, S. / Rolland, N. / Rolland, P.-A. et al. | 2007
- 1690
-
Thermal Performance Enhancement for CSP PackagesRetuta, Danny / Ma, Y. Y. / Kanth, Ravi / Boon, Tan Hien / Sun, Anthony / Tanary, Susanto et al. | 2007
- 1696
-
Analysis of Field Loads in Automotive ECUs and MEMS SensorsPustan, David / Fischer, Sebastian / Wilde, Juergen et al. | 2007
- 1701
-
Assessment of Fluxless Solid Liquid Interdiffusion Bonding by Compressive Force of Au-PbSn and Au-SAC for Flip Chip PackagingLee, Teck Kheng / Zhang, Sam / Wong, C.C. / Tan, A.C. et al. | 2007
- 1707
-
Adhesion and Reliability of Anisotropic Conductive Films (ACFs) Joints on Organic Solderability Preservatives (OSPs) Metal Surface FinishKim, Hyoung-Joon / Paik, Kyung-Wook et al. | 2007
- 1714
-
The Influence of Interconnect Line Patterns using Flat-Surface and Low-Dielectric-Loss Material under High Speed Signal PropagationSugimura, M. / Imai, H. / Nakayama, M. / Kawasaki, M. / Fujimura, M. / Oonuki, H. / Kawashima, O. / Morimoto, A. / Teramoto, A. / Sugawa, S. et al. | 2007
- 1720
-
Stacking Dies: Combined Virtual Prototyping and Reliability Testing Based Design RulesReal, R. A. / van Driel, W.D. / Yang, D.G. / Zhang, G.Q. / Pasion, J. et al. | 2007
- 1725
-
Effects of Heating Rate During ACFs Curing Process on Material Properties and Thermal Cycling Reliability of Flip Chip AssemblyJang, Kyung-Woon / Paik, Kyung-Wook et al. | 2007
- 1731
-
Wafer-Level Film Selection for Stacked-Die Chip Scale PackagesShi, Daniel / Fan, Xuejun et al. | 2007
- 1737
-
A Review on 3D Integrated Approaches in Multimode Optical Polymeric Waveguide FabricationHin, Tze Yang / Liu, Changqing / Conway, Paul P. et al. | 2007
- 1742
-
Simulation Based Package Impedance Characterization of High Speed Differential SystemsMandhana, Om P. / Zhao, Jin et al. | 2007
- 1748
-
Electrical Design Space Exploration for High Speed ServersWesley, Caleb / Mutnury, Bhyrav / Pham, Nam / Matoglu, Erdem / Cases, Moises et al. | 2007
- 1754
-
Efficient Evaluation of Substrate Warpage by Finite Element Method and Factorial Design AnalysisWen, Tsrong-Yi / Ku, Shih-Chang et al. | 2007
- 1760
-
Z-Axis NEXT & FEXT Reduction: Broadside Coupling Reduction Using Cu Vacuum Deposition in Mesh Reference CircuitsBailey, Mark J. / Doyle, Matthew S. / Booth, Roger A. et al. | 2007
- 1765
-
High Performance Coreless Flip-Chip BGA Packaging TechnologyChang, David / Wang, Y.P. / Hsiao, C.S. et al. | 2007
- 1769
-
Warpage Measurement of Board Assemblies Using Projection Moire System with Improved Automatic Image Segmentation AlgorithmTan, Wei / Ume, I. Charles et al. | 2007
- 1775
-
Overview of Metal Lifted Failure Modes During Fine-Pitch Wirebonding Low K/Copper Dies with Bond Over Active (BOA) Circuitry DesignLee, Chu-Chung / Tran, TuAnh / Miller, Charles et al. | 2007
- 1782
-
Study of Interfacial Moisture Diffusion at Cu/Epoxy Interface by FTIR-MIR TechniqueChan, Edward K L / Yuen, Matthew M F et al. | 2007
- 1788
-
Board Design Influence on BGA Mechanical ReliabilityUppalapati, Ramgopal V. / Leiser, Kristie / Van Sickle, Mark / Parupalli, Satish / Vasudevan, Vasu et al. | 2007
- 1796
-
Sources of Creep Data Scattering of Solders in Micro-electronic PackagingYu, Jin / Shin, S. W. / Kim, S.B. et al. | 2007
- 1802
-
Study on Inter-Metallic Compound (IMC) at Interface of Pb-Free Solder and Nickel UBM for Mobile ApplicationChoi, Joon Young / Kang, In Soo / Park, Byung Jin / Park, Yun Mook / Jung, Gi Jo et al. | 2007
- 1809
-
System-Design-for-Reliability Tools for Highly Integrated Electronic Packaging SystemsKim, Injoong / Pucha, Raghuram V. / Peak, Russell S. / Sitaraman, Suresh K. et al. | 2007
- 1815
-
Feasibility of SAB using Nano-adhesion Layer for Low Temperature GaN Wafer BondingSuga, Tadatomo / Wakamatsu, Tsuguharu / Akaike, Masatake / Shigetou, Akitsu / Higurashi, Eiji et al. | 2007
- 1819
-
A Comparative Study of Sn3.5Ag and Sn3.8Ag0.7Cu for BGA Spheres on Ni/Au FinishEu, Poh-Leng / Ding, Min / Hoh, Huey-Jiun / Rayos, Joachim / Su, Peng / Lindsay, Wayne / Chopin, Sheila / Ahmad, Ibrahim et al. | 2007
- 1825
-
Massive Spalling of Intermetallics in Solder Joints: a General Phenomenon that Can Occur in Multiple Solder-Substrate SystemsYang, S. C. / Kao, C. R. et al. | 2007
- 1831
-
Non-Conductive Films (NCFs) with Multi-Functional Epoxies and Silica Fillers for Reliable NCFs Flip Chip On Organic Boards (FCOB)Chung, Chang-Kyu / Paik, Kyung-Wook et al. | 2007
- 1839
-
Mechanical Degradation, Thermal-and Electromigration in Large Volume Solder JointsMeier, Karsten / Roellig, Mike / Wiese, Steffen / Goette, Carsten / Deml, Ulrich / Wolter, Klaus-Juergen et al. | 2007
- 1846
-
Different Wire Layouts for CMOS InductorsKarjalainen, Paivi H. / Heino, Pekka et al. | 2007
- 1851
-
Monolithic Low Cost Ka-Band Wilkinson Power Dividers on Flexible Organic SubstratesHorst, Stephen / Bhattacharya, Swapan / Tentzeris, Manos / Papapolymerou, John et al. | 2007
- 1855
-
RF Characterisation and Process Control for Passive Integration Componentsvan der Wel, P.J. / Dijkhuis, J. F. / Chanlo, C. / Dolle, H.K.J. ten / van den Oever, L.C.M. / Havens, R.J. et al. | 2007
- 1861
-
Linking Geometrical and Electrical Parameters of Flex Substrate Vertical Interconnects for 2.5D System-in-Package DesignMaaB, Uwe / Polityko, David Dmitry / Richter, Christian / Ndip, Ivan / Hefer, Jan / Guttowski, Stephan / Reichl, Herbert et al. | 2007
- 1866
-
Organic-Based RF Capacitors with Ceramic-Like PropertiesHwang, Jin-Hyun / Raj, P. Markondeya / Abothu, Isaac Robin / Yoon, Chong / Iyer, Mahadevan / Jung, Hyung-Mi / Hong, Jong-Kuk / Tummala, Rao et al. | 2007
- 1870
-
Low-Loss Flex Circuit Interconnect: Development of Reduced Insertion-Loss Flexible PackagingDoyle, Matthew S. / Martin, Wesley / Pease, David / Timpane, Trevor et al. | 2007
- 1877
-
Metal-Transfer-Micromolded RF Components for System-On-Package (SOP)Zhao, Yanzhu / Yoon, Yong-Kyu / Allen, Mark G. et al. | 2007
- 1884
-
A Post-Processing De-Embedding Technique and Effect of TRL Measurement Using an Incorrect FixturingHwang, Lih-Tyng / Kuo, Shun-Meen et al. | 2007
- 1889
-
Ultra-Compact Power Conversion Based on a CMOS-Compatible Microfabricated Power Inductor with Minimized Core LossesGalle, Preston / Wu, Xiaosong / Milner, Luke / Kim, Seong-Hyok / Johnson, Peter / Smeys, Peter / Hopper, Peter / Hwang, Kyuwoon / Allen, Mark G. et al. | 2007
- 1895
-
The New Heart Beat of Electronics - Silicon MEMS OscillatorsHsu, Wan-Thai / Pai, Minfan et al. | 2007
- 1900
-
Design, Integration and Testing of Fluidic Dispensing Control Valve into a DNA/RNA Sample Preparation Micro fluidic Package for Lab on a Chip (LOC) ApplicationsXie, Ling / Premachandran, C.S. / Chong, Ser Choong / Chew, Michelle et al. | 2007
- 1905
-
Study on the Board Level Reliability Test of Package on Package (PoP) with 2nd Level UnderfillLee, Joon-Yeob / Hwang, Tae-Kyung / Kim, Jin-Young / Yoo, Min / Sohn, Eun-Sook / Chung, Ji-Young / Dreiza, Moody et al. | 2007
- 1911
-
Novel Monolayer-enhanced Non-Conductive Film (NCF) for Ultra-Fine Pitch High Performance Interconnect in Lead-free ElectronicsLi, Yi / Yim, Myung Jin / Wong, C.P. et al. | 2007
- 1916
-
A Large Area and 2 Dimensional Optical Interconnection PlatformHwang, Sung Hwan / Cho, Mu Hee / Kang, Sae-Kyoung / Lee, Tae-Woo / Park, Hyo-Hoon / Rho, Byung Sup et al. | 2007
- 1921
-
Comparative Analysis of Electrical Performance on Coreless and Standard Flip-Chip SubstrateSung, Robert / Chiang, Kevin / Wang, Yu-Po / Hsiao, C.S. et al. | 2007
- 1925
-
Characterization and Modeling of Thin Film Interface Strength Considering Mode MixityXiao, A. / Wang, L. G. / van Driel, W. D. / Ernst, L. J. / van der Sluis, O. / Yang, D. G. / Zhang, G. Q. et al. | 2007
- 1931
-
Highly Efficient Modeling Automation for Electronic Package Thermal AnalysisZhang, Yuan Xiang / Liang, Lihua / Xia, Yangjian / Liu, Yong / Irving, Scott / Luk, Timwah et al. | 2007
- 1936
-
Transmission Line Characteristics of a CNT-based Vertical Interconnect SchemeTan, Chee Wee / Miao, Jianmin et al. | 2007
- 1942
-
Effect of Poly(4-Styrene Sulfonic Acid) on the Surface Resistivities of Sulfonated Poly(Styrene-B-Ethylenebutylene-B-Styrene) Filled with Multiwalled Carbon Nanotubes (MWNTs) for Antistatic Coating and EMI ShieldingLee, Seon Suk / Kang, Il Ho / Jin, Sung Hun / Choi, Deok Kyu / Lee, Dai Soo et al. | 2007
- 1947
-
A Design Methodology for the Yield Enhancement of MEMS Designs with Respect to Process Induced VariationsVudathu, Shyam Praveen / Laur, Rainer et al. | 2007
- 1953
-
High-speed GDDRIII System Implementation by Channel Signal and Power Integrity Factorial DesignHsu, Jimmy / Hsiao, Randy et al. | 2007
- 1959
-
Low-Cost Hybrid WDM Module Integrated on Planar Lightwave Circuit (PLC) with a Coated WDM Filter Using Passive Alignment TechniqueLim, Jung Woon / Hwang, Sung Hwan / Kim, Seon Hoon / Kim, Boo-Gyoun / Rho, Byung Sup et al. | 2007
- 1964
-
The Sn Whisker Growth Evolution of IC Packaging on the PC Board AssemblyLee, Jeffrey C.B. / Chen, P.C. / Tyan, C.G. et al. | 2007
- 1971
-
Label-Free Protein Detection by ZnO Nanowire Based Bio-SensorsLiu, Jin / Goud, Janagama / Raj, P. Markondeya / Iyer, Mahadevan / Wang, Zhonglin / Tummala, Rao R. et al. | 2007
- 1977
-
Paper-Based Ultra-Low-Cost Integrated RFID Tags for Sensing and Tracking ApplicationsRida, Amin / Vyas, Rushi / Basat, Serkan / Ferrer-Vidal, Antonio / Li Yang, / Bhattacharya, Swapan K. / Tentzeris, Manos M. et al. | 2007
- 1981
-
Assembling Carbon Nanotube Bundles Using Transfer Process for Fine-Pitch Electrical Interconnect ApplicationsZhu, Lingbo / Moon, Kyoung-Sik / Bertram, Brian / Hess, Dennis W. / Wong, C. P. et al. | 2007
- 1986
-
A New Carrier Transport Model for Light Emitting Devices with Quantum WellLee, Chin C. et al. | 2007
- 1994
-
Characteristics of a Driver Amplifier Integrated 40 Gb/s EML ModuleYun, Ho-Gyeong / Choi, Kwang-Seong / Kwon, Yong-Hwan / Choe, Joong-Seon / Moon, Jong-Tae et al. | 2007
- 2000
-
A Triple Balanced Mixer in Multi-layer Liquid Crystalline Polymer (LCP) SubstrateYun, Wansuk / Sundaram, Venky / Swaminathan, Madhavan et al. | 2007
- 2006
-
Assembling Carbon Nanotube Films as Thermal Interface MaterialsZhu, Lingbo / Hess, Dennis W. / Wong, C. P. et al. | 2007
- 2011
-
Characterization of Nano-grained High Aspect Ratio Through-wafer Copper Interconnect ColumnXu, Luhua / Dixit, Pradeep / Pang, John H.L. / Miao, Jianmin / Zhang, Xi / Tu, King-Ning / Preisser, Robert et al. | 2007
- 2017
-
Design of On-Chip Microchannel Fluidic Cooling StructuresZhao, Mingyuan / Huang, Z. Rena et al. | 2007
- 2024
-
Fully Embedded High Q Passives and Band Pass Filters for Low Cost Organic RF SOP (System on Package) ApplicationsLee, Seung J. / Lee, Hwan H. / Park, Jae Y. et al. | 2007
- 2030
-
Intelligent Textiles Based on MEMS TechnologyMeng, Maozhou / Xu, Yong / Zhang, Honghai / Liu, Sheng et al. | 2007
- 2035
-
Vertically Coupled Polymer Microdisk Resonators Fabricated by Photolithography TechniqueLuan, Lin / Cho, Sang-Yeon / Jokerst, Nan Marie et al. | 2007
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Foreword| 2007
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57th Electronic Components & Technology Conference| 2007
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advert| 2007
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PDF Not Yet Available In IEEE Xplore| 2007
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future-events| 2007
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Professional Development Courses for the 57th ECTC| 2007
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Best of Conference Papers - 2006| 2007
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Outstanding Papers - 2006| 2007
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Committee Members| 2007
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Table of Contents| 2007
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Affiliation Index| 2007
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Author index| 2007
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Copyright page| 2007