Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking (Englisch)
- Neue Suche nach: Xie, Ling
- Neue Suche nach: Choi, Won-Kyoung
- Neue Suche nach: Premachandran, C.S.
- Neue Suche nach: Selvanayagam, C.S.
- Neue Suche nach: Bai, Ke-Wu
- Neue Suche nach: Zeng, Ying-Zhi
- Neue Suche nach: Ong, Siong-Chiew
- Neue Suche nach: Liao, Ebin
- Neue Suche nach: Khairyanto, A.
- Neue Suche nach: Sekhar, V.N.
- Neue Suche nach: Thew, S.
- Neue Suche nach: Xie, Ling
- Neue Suche nach: Choi, Won-Kyoung
- Neue Suche nach: Premachandran, C.S.
- Neue Suche nach: Selvanayagam, C.S.
- Neue Suche nach: Bai, Ke-Wu
- Neue Suche nach: Zeng, Ying-Zhi
- Neue Suche nach: Ong, Siong-Chiew
- Neue Suche nach: Liao, Ebin
- Neue Suche nach: Khairyanto, A.
- Neue Suche nach: Sekhar, V.N.
- Neue Suche nach: Thew, S.
In:
ECTC, IEEE Electronic Components and Technology Conference, 61
;
279-284
;
2011
-
ISBN:
- Aufsatz (Konferenz) / Print
-
Titel:Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC Stacking
-
Beteiligte:Xie, Ling ( Autor:in ) / Choi, Won-Kyoung ( Autor:in ) / Premachandran, C.S. ( Autor:in ) / Selvanayagam, C.S. ( Autor:in ) / Bai, Ke-Wu ( Autor:in ) / Zeng, Ying-Zhi ( Autor:in ) / Ong, Siong-Chiew ( Autor:in ) / Liao, Ebin ( Autor:in ) / Khairyanto, A. ( Autor:in ) / Sekhar, V.N. ( Autor:in )
-
Erschienen in:
-
Verlag:
- Neue Suche nach: IEEE Operations Center
-
Erscheinungsort:Piscataway
-
Erscheinungsdatum:2011
-
Format / Umfang:6 Seiten, 10 Quellen
-
ISBN:
-
DOI:
-
Medientyp:Aufsatz (Konferenz)
-
Format:Print
-
Sprache:Englisch
-
Schlagwörter:
-
Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
-
Committee members| 2011
- 1
-
Looking for research results in components, materials, modeling, packaging, reliability and the other fields covered at ECTC?| 2011
- 1
-
Table of contents| 2011
- 1
-
[Copyright notice]| 2011
- 1
-
Affiliation index| 2011
- 1
-
Professional development courses for the 61st ECTC| 2011
- 27
-
High density 20 micrometer pitch CuSn microbump process for high-end 3D applicationsVos, J. / Jourdain, A. / Erismis, M.A. / Zhang, W. / Munck, K. / Manna, A.L. / Tezcan, D.S. / Soussan, P. et al. | 2011
- 90
-
Solidification processes in the Sn-rich part of the SnCu systemPanchenko, I. / Mueller, M. / Wiese, S. / Schindler, S. / Wolter, Klaus-Juergen et al. | 2011
- 163
-
High quality factor RF inductors using low loss conductor featured with skin effect suppression for standard CMOS/BiCMOSIramnaaz, I. / Sandoval, T. / Zhuang, Y. / Schellevis, H. / Rejaei, B. et al. | 2011
- 190
-
A study of the roughness propagation effects in waveguides with the mode matching technique combined with the method of momentsDing, Ruihua / Tsang, Leung / Braunisch, Henning et al. | 2011
- 279
-
Design, simulation and process optimization of AuInSn low temperature TLP bonding for 3D IC StackingXie, Ling / Choi, Won-Kyoung / Premachandran, C.S. / Selvanayagam, C.S. / Bai, Ke-Wu / Zeng, Ying-Zhi / Ong, Siong-Chiew / Liao, Ebin / Khairyanto, A. / Sekhar, V.N. et al. | 2011
- 530
-
High-speed flex-on-board assembly method using anisotropic conductive films (ACFs) combined with room temperature ultrasonic (US) bonding for high-density module interconnection in mobile phonesLee, Kiwon / Oh, Sangmin / Saarinen, I.J. / Pykari, L. / Paik, Kyung-Wook et al. | 2011
- 547
-
Impact of isothermal aging on Sn-Ag-Cu solder interconnect board level high G mechanical shock performanceLee, Tae-Kyu / Xie, Weidong / Liu, Kuo-Chuan et al. | 2011
- 813
-
Dual-layer WDM Routing for Wafer-scale Packaging of Photonically-interconnected Computing SystemsLee, D.C. / Zheng, Xuezhe / Feng, Dazeng / Kung, Cheng-Chih / Fong, J. / Qian, Wei / Yao, Jin / Li, Guoliang / Raj, K. / Cunningham, J.E. et al. | 2011
- 971
-
Effect of interfacial strength between Cu6Sn5 and Cu3Sn intermetallics on the brittle fracture failure of lead-free solder joints with OSP pad finishYang, Chaoran / Song, Fubin / Lee, S.W.R. et al. | 2011
- 1122
-
Integration of TSVs, wafer thinning and backside passivation on full 300 mm CMOS wafers for 3D applicationsJourdain, A. / Buisson, T. / Phommahaxay, A. / Redolfi, A. / Thangaraju, S. / Travaly, Y. / Beyne, E. / Swinnen, B. et al. | 2011
- 1211
-
Aerosol Jet printing on rapid prototyping materials for fine pitch electronic applicationsGoth, C. / Putzo, S. / Franke, J. et al. | 2011
- 1228
-
Nano and micro materials in a Pb-free worldDas, R.N. / Lauffer, J.M. / Knadle, K. / Vincent, M. / Poliks, M.D. / Markovich, V.R. et al. | 2011
- 1239
-
Synthesis of high quality, closely packed vertically aligned carbon nanotube array and a quantitative study of the influence of packing density on the collective thermal conductivityGu, Wentian / Lin, Wei / Yao, Yagang / Wong, ChingPing et al. | 2011
- 1244
-
Novel nanomagnetic materials for high-frequency RF applicationsRaj, P.Markondeya / Sharma, Himani / Reddy, G.Prashant / Reid, David / Altunyurt, Nevin / Swaminathan, Madhavan / Tummala, Rao / Nair, Vijay et al. | 2011
- 1319
-
Technology and design of innovative flexible electrode for biomedical applicationsBalucani, M. / Nenzi, P. / Crescenzi, R. / Marracino, P. / Apollonio, F. / Liberti, M. / Densi, A. / Colizzi, C. et al. | 2011
- 1325
-
Embedded discrete passives technology for bandage-type medical sensors of E-healthcare systemLee, Baik-Woo / Booh, Seong-Woon / Shin, Kunsoo et al. | 2011
- 1412
-
Embedded 3D BioMEMS for multiplexed label free detectionVasan, A.S.S. / Doraiswami, R. / Pecht, M. et al. | 2011
- 1489
-
Wire bonding of Cu and Pd coated Cu wire: Bondability, reliability, and IMC formationQin, I. / Hui, Xu / Clauberg, H. / Cathcart, R. / Acoff, V.L. / Chylak, B. / Huynh, Cuong et al. | 2011
- 1523
-
Effect of heat affected zone on the mechanical properties of copper bonding wireLiu, Dong / Chen, Haibin / Wong, Fei / Lee, Kan / Shiu, I. / Wu, Jingshen et al. | 2011
- 1541
-
Si microchannel cooler integrated with high power amplifiers for base station of mobile communication systemsMizuno, Y. / Soga, I. / Hirose, S. / Tsuboi, O. / Iwai, T. et al. | 2011
- 1572
-
Polymer opto-electronic-fluidic detection module on plastic film substratesOhlander, A. / Burghart, M. / Strohhofer, C. / Bollmann, D. / Landesberger, C. / Klink, G. / Bock, K. et al. | 2011
- 1631
-
Performance of high-brightness LEDs with VACNT-TIM on aluminum heat spreadersGao, Zhaoli / Zhang, Kai / Yuen, M.M.F. et al. | 2011
- 1636
-
Thermal improvements for high power UV LED clustersSchneider, M. / Leyrer, B. / Herbold, C. / Trampert, K. / Brandner, J.J. et al. | 2011
- 1649
-
Inline Thermal Transient Testing of High Power LED Modules for Solder Joint Quality ControlElger, G. / Lauterbach, R. / Dankwart, K. / Zilkens, C. et al. | 2011
- 1679
-
Thermal behaviours of silicone-based optical interconnects with mirror optical couplingCai, D.K. / Neyer, A. et al. | 2011
- 1770
-
Low-Temperature Bonding of LSI Chips to Polymer Substrate using Au Cone Bump for Flexible ElectronicsShuto, T. / Watanabe, N. / Ikeda, A. / Asano, T. et al. | 2011
- 1834
-
Silicon microfilter device fabrication and characterization for diverse microfluidics applicationsMajeed, B. / Zhang, Lei / Tezcan, D.S. / Soussan, P. / Fiorini, P. et al. | 2011
- 1889
-
Microwave artificially structured periodic media microfluidic sensorWiwatcharagoses, N. / Park, Kyoung-Youl / Hejase, J.A. / Williamson, L. / Chahal, P. et al. | 2011
- 1999
-
Mechanical characterization of nickel nanowires by using a customized atomic microscope in scanning electron microscopeCelik, E. / Guven, I. / Madenci, E. et al. | 2011
- 2073
-
Enhancement of dielectric strength and processibility of high dielectric constant Al nanocomposite by organic molecule treatmentLi, Zhuo / Moon, Kyoung-Sik / Kim, Saewon / Wong, C.P. et al. | 2011
- 2079
-
Low Temperature Cu-Cu Direct Bonding using Formic Acid Vapor PretreatmentYang, Wenhua / Shintani, H. / Akaike, M. / Suga, T. et al. | 2011
- 2084
-
Modeling, optimization and benchmarking of chip-to-chip electrical interconnects with low loss air-clad dielectricsKumar, V. / Bashirullah, R. / Naeemi, A. et al. | 2011
- 2119
-
Micro texture dependence of the mechanical and electrical reliability of electroplated copper thin film interconnectionsMurata, N. / Saito, N. / Endo, F. / Tamakawa, K. / Suzuki, K. / Miura, H. et al. | 2011