Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing (Englisch)
- Neue Suche nach: Roozeboom, F.
- Neue Suche nach: Smets, M.
- Neue Suche nach: Kniknie, B.
- Neue Suche nach: Hoppenbrouwers, M.
- Neue Suche nach: Dingemans, G.
- Neue Suche nach: Keuning, W.
- Neue Suche nach: Kessels, W.M.M.
- Neue Suche nach: Pohl, R.
- Neue Suche nach: Huis in't Veld, A.J.
- Neue Suche nach: Roozeboom, F.
- Neue Suche nach: Smets, M.
- Neue Suche nach: Kniknie, B.
- Neue Suche nach: Hoppenbrouwers, M.
- Neue Suche nach: Dingemans, G.
- Neue Suche nach: Keuning, W.
- Neue Suche nach: Kessels, W.M.M.
- Neue Suche nach: Pohl, R.
- Neue Suche nach: Huis in't Veld, A.J.
In:
IMAPS, International Symposium on Microelectronics, 46
;
1-6
;
2013
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturing
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Beteiligte:Roozeboom, F. ( Autor:in ) / Smets, M. ( Autor:in ) / Kniknie, B. ( Autor:in ) / Hoppenbrouwers, M. ( Autor:in ) / Dingemans, G. ( Autor:in ) / Keuning, W. ( Autor:in ) / Kessels, W.M.M. ( Autor:in ) / Pohl, R. ( Autor:in ) / Huis in't Veld, A.J. ( Autor:in )
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Erschienen in:
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Verlag:
- Neue Suche nach: Curran Associates
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Erscheinungsort:Red Hook
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Erscheinungsdatum:2013
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Format / Umfang:6 Seiten, Bilder, Tabellen, 25 Quellen
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
- 1
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Alternative technology concepts for low-cost and high-speed 2D and 3D interconnect manufacturingRoozeboom, F. / Smets, M. / Kniknie, B. / Hoppenbrouwers, M. / Dingemans, G. / Keuning, W. / Kessels, W.M.M. / Pohl, R. / Huis in't Veld, A.J. et al. | 2013
- 13
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2.5 / 3D packaging technology solution for high frequency deviceMorikawa, Yasuhiro / Murayama, Takahide / Sakuishi, Toshiyuki / Suu, Koukou et al. | 2013
- 26
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Analysis of stress/strain in Electroless Copper FilmsBernhard, Tobias / Bamberg, Simon / Brüning, Frank / Brüning, Ralf / Gregoriades, Laurence J. / Sharma, Tanu / Brown, Delilah / Klaus, M. / Genzel, C. et al. | 2013
- 31
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Using Physics of Failure to Predict System Level Reliability for Avionic ElectronicsCaswell, Greg et al. | 2013
- 72
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Small-chip Attachment on Copper Leadframe with Sintered Nanosilver PasteCalata, Jesus N. / Zheng, Hanguang / Lu, Guo-Quan / Ngo, Khai et al. | 2013
- 84
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Better, Faster and Cheaper Precision Cleaning: Advanced CO2 Cleaning TechnologyJackson, David et al. | 2013
- 120
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Thermal Cycling Reliability of Alternative Low-Silver Tin-based SoldersGeorge, Elviz / Osterman, Michael / Pecht, Michael / Coyle, Richard / Parker, Richard / Benedetto, Elizabeth et al. | 2013
- 128
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Voiding and Reliability of Assembly of BGA with SAC and 57Bi42Sn1Ag AlloysLiu, Yan / Keck, Joanna / Page, Erin / Lee, Ning-Cheng et al. | 2013
- 158
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Anti-Counterfeit, Advanced Microelectronics Packaging Solutions for Miniaturized Medical DevicesDas, Rabindra N. / Egitto, Frank D. / Lin, How et al. | 2013
- 171
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Assembly and Packaging Enabling System IntegrationPressel, Klaus / Beer, Gottfried / Wojnowski, Maciej et al. | 2013
- 177
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Smart Power Module Molding Advances: Evaluating high temperature suitability of Molding CompoundsBecker, K.F. / Thomas, T. / Bauer, J. / Kahle, R. / Braun, T. / Aschenbrenner, R. / Schneider-Ramelow, M. / Lang, K.D. et al. | 2013
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Integrated Ψ-Type Photonic Polarization Diversity Receivers for Wireless Radio-over-Fiber Communication LinksRymanov, V. / Dülme, S. / Wachholz, M. / Palandöken, M. / Tekin, T. / Stöhr, A. et al. | 2013
- 239
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Package Technology Selection of 28nm High Power FPGA with Pb-Free Solder Bumps: Flip Chip Molded BGA (FCMBGA) versus Traditional Flip Chip Bare Die PackageLyakas, Michael / Reichman, Corey / Jimarez, Miguel / Ocampo, Romina Mimi / Elberg, Aaron / Hasan, Altaf / Hale, Dierdre / Hamilton, Fred / Kim, Joon Dong et al. | 2013
- 250
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Design for Solder Joint Fatigue Life of BGA Package Subject to Mechanical EnvironmentLan, Jia-Shen / Wu, Mei-Ling et al. | 2013
- 303
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Non-Destructive Top Layer Bond Pad Cross SectionCollier, Terence Q. / Gubeljic, Indira et al. | 2013
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Cu Heavy Wirebonding for High Power Device InterconnectionLee, Baik-Woo / Kim, Chang-Sik / Jeong, Changmo / Byun, Younghun / Yoon, Jeong-Won / Kim, Che-Heung / Booh, Seong Woon / Chung, U-In et al. | 2013
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Automated Wirepull Testing - Parallelogram of Forces-Real Time ApplicationGarcia, Richard C. / Sedlmair, Josef et al. | 2013
- 354
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Implementing Inductor Function with Vibrating Capacitor StructuresMarinis, Thomas F. / Soucy, Joseph W. et al. | 2013
- 414
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Development of Organic Multi Chip Package for High Performance ApplicationShimizu, Noriyoshi / Kaneda, Wataru / Arisaka, Hiromu / Koizumi, Naoyuki / Sunohara, Satoshi / Rokugawa, Akio / Koyama, Toshinori et al. | 2013
- 452
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3D Integrated Packaging Approach for High Performance Processor-Memory ModulePolzer, S.C. / Wilkins, W.L. / Fasig, J.L. / Degerstrom, M.J. / Gilbert, B.K. / Daniel, E.S. et al. | 2013
- 496
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Method to Measure Effects of Surface Roughness on High-frequency Transmission LinesIwai, Toshiki / Mizutani, Daisuke / Tani, Motoaki et al. | 2013
- 516
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Development of an ultra thin die-to-wafer flip chip stacking process for 2.5D integrationPares, G. / Attard, A. / Dosseul, F. / N'hari, A. / Boillon, O. / Toffanin, L. / Klug, G. / Simon, G. et al. | 2013
- 523
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Long-term Electromigration Study of Lead-Free Flip-Chips with Solder Bumps with 50 µm or 60 µm Diameter Employing ENIG Surface Finish on Both Chip and Substrate SideGorywoda, Marek / Dohle, Rainer / Härter, Stefan / Wirth, Andreas / Goßler, Jörg / Franke, Jörg et al. | 2013
- 569
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Stencil Printing Process Guidelines for 0.3mm Pitch Chip Scale PackagesWhitmore, Mark / Schake, Jeff / Ashmore, Clive et al. | 2013
- 574
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Z-Axis Interconnection: A Versatile Technology Solution for High Performance ElectronicsDas, Rabindra N. / Lauffer, John M. / Egitto, Frank D. et al. | 2013
- 604
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A Highly Integrated GaAs-based Module for DC-DC RegulatorsMiller, Greg J. et al. | 2013
- 635
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Challenges of Adhesion Promotion for the Metallization of Glass InterposersBamberg, Simon / Merschy, Michael / Bernhard, Tobias / Bruening, Frank / Taylor, Robin / Brandt, Lutz / Liu, Zhiming / Fu, Hailuo / Hunegnaw, Sara et al. | 2013
- 651
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The Effectiveness of Screening Techniques for Revealing Cracks in High Volumetric Efficiency MLCCsTeverovsky, Alexander et al. | 2013
- 657
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Dicing Development for low-k Copper Wafers using Nickel-Palladium-Gold Bond Pads for Automotive ApplicationTran, Tu Anh / Mathew, Varughese / Koh, Wen Shi / Yow, K.Y. / Au, Y.K. et al. | 2013
- 663
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Immersion Tin for QFN Packages to create a 3-D solder joint for reliability enhancementÖzkök, Mustafa / Mertens, Hubertus / Bender, Jerome et al. | 2013
- 689
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Thick film pastes for nitride ceramics for high power applicationsWenzel, Marco / Schmidt, Richard / Partsch, Uwe / Eberstein, Markus et al. | 2013
- 723
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Mechanical Stress Analyses of Packaged Pressure Sensors for Very High TemperaturesZeiser, Roderich / Ayub, Suleman / Hempel, Jochen / Berndt, Michael / Wilde, Jürgen et al. | 2013
- 794
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Integrated Passive Devices and TSV, a disruptive technology for miniaturizationBunel, C. / Tenailleau, J.R. / Voiron, F. / Borel, S. / Levevre, A. et al. | 2013
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Improved compensation for a reduction stepper to meet the challenges for advanced packaging applicationsWebb, James E. / Gardner, Steven / DaSilveira, Elvino et al. | 2013
- 842
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Development of low temperature sintered nano silver pastes using MO technology and resin reinforcing technologySasaki, Koji / Mizumura, Noritsuka et al. | 2013
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Compact Photonic Package for High-Power E-Band (60-90 GHz) Photoreceiver ModulesRymanov, V. / Palandöken, M. / Dülme, S. / Tekin, T. / Stöhr, A. et al. | 2013
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Transient Thermal Analysis as a Test Method for the Reliability Investigation of High Power LEDs during Temperature Cycle TestsElger, Gordon / Kandaswamy, Shri Vishnu / Derix, Robert / Wilde, Jürgen et al. | 2013
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Multi-layer PC boards Fabricated using Aerosol-jet PrintingBolger, John / Lantz, Leon / Lewis, Rich / Trudeau, Rick / Hines, Daniel et al. | 2013
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Advanced Devices and Electronic Packaging for Harsh EnvironmentElshabini, Aicha / Barlow, Fred / Islam, Sharmin / Wang, Pin-Jen et al. | 2013