3D-simulation of electrodynamical characteristics of packages, feedthrus and interconnects (Englisch)
- Neue Suche nach: Werthen, M.
- Neue Suche nach: Rittweger, M.
- Neue Suche nach: Wolff, I.
- Neue Suche nach: Werthen, M.
- Neue Suche nach: Rittweger, M.
- Neue Suche nach: Wolff, I.
In:
Micro Systems Technology 94, Micro System Technologies, International Conference on Micro Electro, Opto, Mechanical Systems and Components, 4
;
673-682
;
1994
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ISBN:
- Aufsatz (Konferenz) / Print
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Titel:3D-simulation of electrodynamical characteristics of packages, feedthrus and interconnects
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Weitere Titelangaben:3D-Simulation von elektrodynamischen Charakteristiken für die Packungsdichte, das Leitverhalten und den Zusammenhalt mit Hilfe der FDTD-Methode und den Maxwellschen Gleichungen
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Beteiligte:
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Erschienen in:
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Verlag:
- Neue Suche nach: VDE-Verlag
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Erscheinungsort:Berlin, Offenbach
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Erscheinungsdatum:1994
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Format / Umfang:10 Seiten, 11 Bilder, 7 Quellen
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Print
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis Konferenzband
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