Modeling Aspect Ratio of a Micro EDM Hole (Englisch)
Nationallizenz
- Neue Suche nach: Yin, G.
- Neue Suche nach: Yu, Z.
- Neue Suche nach: An, C.
- Neue Suche nach: Li, J.
In:
Advanced Materials Research
;
126-128
;
829-834
;
2010
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Modeling Aspect Ratio of a Micro EDM Hole
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Beteiligte:
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Erschienen in:Advanced Materials Research ; 126-128 ; 829-834
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Verlag:
- Neue Suche nach: Trans Tech Publications
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Erscheinungsort:Stafa-Zurich, Switzerland
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Erscheinungsdatum:11.08.2010
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Format / Umfang:6 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 126-128
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A Dishing Model for Chemical Mechanical Polishing of Plug Structures| 2010
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Two Dimensional Ultrasonic Vibration Assisted Chemo-Mechanical Grinding of Si Wafer| 2010
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Machining Force and Modes for Si Wafer Machining with Rotational Tool| 2010
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Wafer Polishing Process with Signal Analysis and Monitoring for Optimum Condition of Machining| 2010
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Study on Chemical Mechanical Polishing with Ultrasonic Vibration| 2010
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Experimental Investigation on Effects of Passivants in the Abrasive-Free Polishing of Copper Film| 2010
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Friction Phenomenon in Chemical Mechanical Polishing of Oxide Film| 2010
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Diamond Pad Conditioners with Oriented Polycrystalline Diamond Cubes| 2010
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Estimation of Heat Transfer Coefficients in Dry and Cold-Air Cutting| 2010
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Tool Life and Surface Roughness of FCD 700 Ductile Cast Iron when Dry Turning Using Carbide Tool| 2010
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Condition Monitoring in a Machine Tool Spindle Using Wireless Sensor| 2010
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