Advances on 45nm SiGe-Compatible NiPt Salicide Process (Englisch)
Nationallizenz
- Neue Suche nach: Chen, Yi Wei
- Neue Suche nach: Ho, Nien Ting
- Neue Suche nach: Lai, Jerander
- Neue Suche nach: Tsai, T.C.
- Neue Suche nach: Huang, C.C.
- Neue Suche nach: Tzou, S.F.
- Neue Suche nach: Chu, James M.M.
In:
Solid State Phenomena
;
145-146
;
211-214
;
2009
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Advances on 45nm SiGe-Compatible NiPt Salicide Process
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Beteiligte:
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Erschienen in:Solid State Phenomena ; 145-146 ; 211-214
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Verlag:
- Neue Suche nach: Trans Tech Publications
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Erscheinungsort:Stafa-Zurich, Switzerland
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Erscheinungsdatum:06.01.2009
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Format / Umfang:4 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
Inhaltsverzeichnis – Band 145-146
Zeige alle Jahrgänge und Ausgaben
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- -1
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Preface| 2009
- -2
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Photo| 2009
- -3
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Committees and Sponsors| 2009
- 3
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Direct Observation of Single Bubble Cavitation Damage for MHz Cleaning| 2009
- -4
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Acknowledgements| 2009
- 7
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High Speed Imaging of 1 MHz Driven Microbubbles in Contact with a Rigid Wall| 2009
- 11
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Characterization of a Cavitation Bubble Structure at 230 kHz: Bubble Population, Sonoluminescence and Cleaning Potential| 2009
- 15
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Impact of Megasonic Activation with Different Chemistries on Silicon Surface in Single Wafer Tool| 2009
- 19
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Impacts of Ionization Potentials and Megasonic Dispersion| 2009
- 23
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The Influence of Standing Waves on Cleaning with a Megasonic Nozzle| 2009
- 27
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Megasonic Sweeping and Silicon Wafer Cleaning| 2009
- 31
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Removal of Nano-Particles by Aerosol Spray: Effect of Droplet Size and Velocity on Cleaning Performance| 2009
- 35
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High Aspect Ratio Contact Clean Study in 58nm Flash Device| 2009
- 39
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High Velocity Aerosol Cleaning with Organic Solvents: Particle Removal and Substrate Damage| 2009
- 43
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Cleaning Technique Using High-Speed Steam-Water Mixed Spray| 2009
- 47
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Pattern Collapse and Particle Removal Forces of Interest to Semiconductor Fabrication Process| 2009
- 51
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Applications of Electrostatic Spray Techniques to Surface Cleaning| 2009
- 55
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Analyzing the Collapse Force of Narrow Lines Measured by Lateral Force AFM Using an Analytical Mechanical Model| 2009
- 61
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Reduced Particle Removal Efficiency Upon Wafer Storage| 2009
- 65
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Local Distribution of Particles Deposited on Patterned Surfaces| 2009
- 69
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Particle Retention Mechanism of Filter in High Temperature Chemical| 2009
- 73
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Improving Process Control for Copper Electroplating through Filter Membrane Optimization| 2009
- 77
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Particle – Wafer Interactions in Semiaqueous Silicon Cleaning Systems| 2009
- 87
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Drying of High Aspect Ratio Structures: A Comparison of Drying Techniques via Electrical Stiction Analysis| 2009
- 91
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Relationship between Atmospheric Humidity and Watermark Formation in IPA Dry of Si Wafer after HF Clean| 2009
- 97
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Complementary Metrology within a European Joint Laboratory| 2009
- 101
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Highly Sensitive Detection of Inorganic Contamination| 2009
- 105
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Trace Metallic Contamination Analysis on Wafer Edge and Bevel by TXRF and VPD-TXRF| 2009
- 109
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Surface Potential Difference Imaging Applied to Wet Clean Monitoring| 2009
- 115
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Metallic Contamination Control in Leading-Edge ULSI Manufacturing| 2009
- 123
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Molybdenum Contamination in Silicon: Detection and Impact on Device Performances| 2009
- 127
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Developing a High Volume Manufacturing Wet Clean Process to Remove BF2 Implant Induced Molybdenum Contamination| 2009
- 131
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Impact of Metal-Ion Contaminated Silica Particles on Gate Oxide Integrity| 2009
- 135
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Monitoring System for Airborne Molecular Contamination (AMC) in Semiconductor Manufacturing Areas and Micro-Environments| 2009
- 139
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Reduction of Airborne Molecular Contamination on 300 mm Front Opening Unified POD (FOUP) and Wafers Surface by Vacuum Technology| 2009
- 143
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Study of the Volatile Organic Contaminants Absorption and their Reversible Outgassing by FOUPs| 2009
- 151
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Prevention of Condensation Defects on Contact Patterns by Improving Rinse Process| 2009
- 155
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Single Wafer Ozone-Based Processing for Effective Edge Fluoropolymer Cleaning| 2009
- 159
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Cleanliness Management in Advanced Microelectronic| 2009
- 165
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Surface Preparation and Passivation of III-V Substrates for Future Ultra-High Speed, Low Power Logic Applications| 2009
- 169
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Preparation and Characterization of Self-Assembled Monolayers on Germanium Surfaces| 2009
- 173
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Application of Single-Wafer Wet Cleaning Prior to Epitaxial SiGe Process| 2009
- 177
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Low Temperature Pre-Epi Treatment: Critical Parameters to Control Interface Contamination| 2009
- 181
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Silicon Surface Preparation and Passivation by Vapor Phase of Heavy Water| 2009
- 185
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Defects of Silicon Substrates Caused by Electro-Static Discharge in Single Wafer Cleaning Process| 2009
- 189
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Three-Step Room Temperature Wet Cleaning Process for Silicon Substrate| 2009
- 193
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Effect of Wet Treatment on Stability of Spin-On Dielectrics for STI Gap-Filling in Nanoscale Memory| 2009
- 197
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Influence of Wet Cleaning on Tungsten Deposited with Different Techniques| 2009
- 203
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Etch Rate Study of Germanium, GaAs and InGaAs: A Challenge in Semiconductor Processing| 2009
- 207
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Poly-Silicon Etch with Diluted Ammonia: Application to Replacement Gate Integration Scheme| 2009
- 211
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Advances on 45nm SiGe-Compatible NiPt Salicide Process| 2009
- 215
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Impact of Galvanic Corrosion on Metal Gate Stacks| 2009
- 219
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Photoresist Adhesion during Wet Etch on Single Wafer Tool| 2009
- 223
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Surface Texturization and Interface Passivation of Mono-Crystalline Silicon Substrates by Wet Chemical Treatments| 2009
- 227
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Mechanism of Plasma-Less Gaseous Etching Process for Damaged Oxides from the Ion Implantation Process| 2009
- 231
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Current Advances in Anhydrous HF/Organic Solvent Processing of Semiconductor Surfaces| 2009
- 235
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Co-Solvent Effect on the HF/CO2 Dry Etching of Sacrificial Oxides| 2009
- 239
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A Novel Vapor Phase Etching Process for Si| 2009
- 245
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Material Loss Impact on Device Performance for 32nm CMOS and Beyond| 2009
- 249
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Evaluation of Plasma Strip Induced Substrate Damage| 2009
- 253
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Post Extension Ion Implant Photo Resist Strip for 32 nm Technology and beyond| 2009
- 257
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Influence of Dry Ashing and Wet Treatments on NVM Metal Gate Structures| 2009
- 261
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Chemical and Mechanical Analysis of HDIS Residues Using Auger Electron Spectroscopy and Nanoindentation| 2009
- 265
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Shortening of Plasma Strip Process Resulting in Better Removal of Photo Resist after High Dose Implantation| 2009
- 269
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Stripping and Cleaning of High-Dose Ion-Implanted Photoresists Using a Single-Wafer, Single-Chamber Dry/Wet Hybrid System| 2009
- 273
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Post Ion-Implant Photoresist Stripping Using Steam and Water: Pre-Treatment in a Steam Atmosphere and Steam-Water Mixed Spray| 2009
- 277
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Steam-Injected SPM Process for All-Wet Stripping of Implanted Photoresist| 2009
- 281
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Novel Methods for Wet Stripping High Dose Implanted Photoresist Using Sulfur Trioxide| 2009
- 285
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All Wet Photoresist Strip by Solvent Aerosol Spray| 2009
- 289
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Stripping of Ion Implanted Photoresist by CO2 Cryogenic Pre-Treatment Followed by Wet Cleaning| 2009
- 295
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Porous Low-k Wet Etch in HF-Based Solutions: Focus on Cleaning Process Window, "Pore-Sealing" and "k Recovery"| 2009
- 303
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Photoresist Removal Using Alternative Chemistries and Pressures| 2009
- 311
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Ozone Chemistry for BEOL Resist Stripping – A Systematic Analytical Attempt to Understand the Interaction of O3 with Modern DUV-Resists| 2009
- 315
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Design and Development of Novel Remover for Cu/Porous Low-k Interconnects| 2009
- 319
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Surface Energy and Wetting Behaviour of Plasma Etched Porous SiCOH Surfaces and Plasma Etch Residue Cleaning Solutions| 2009
- 323
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Modification of Photoresist by UV for Post-Etch Wet Strip Applications| 2009
- 327
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Recyclable Fluorine-Based Cleaning Solvents for Resist Removal| 2009
- 331
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Cu Dendrite Formation in Post Trench Etch Cleaning| 2009
- 335
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The Interaction of Sublimed Iminodiacetic Acid with a Cu{110} Surface| 2009
- 339
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Advances in Test Wafer Reclaim Technology – Wet Stripping Porous Low-k Films with No Substrate Damage| 2009
- 343
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Electrochemical Behavior of Cobalt in Post-Via Etch Cleaning Solutions| 2009
- 349
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Characterization of Post Etch Residues Depending on Resist Removal Processes after Aluminum Etch| 2009
- 353
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Impact of Dry Etch and Ash Conditions on Removability of Plasma Etch Residues in Al-Metallization. Approach to Improve PER Cleaning Efficiency by EHS-Friendly Aqueous Remover| 2009
- 357
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Borderless via Clean Study for Minimizing Al-Cu Loss in 58nm Flash Devices| 2009
- 363
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Effect of Various Cleaning Solutions and Brush Scrubber Kinematics on the Frictional Attributes of Post Copper CMP Cleaning Process| 2009
- 367
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The Effect of PVA Brush Scrubbing on Post CMP Cleaning Process for Damascene Cu Interconnection| 2009
- 371
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Cu Surface Characterization after Wet Cleaning Processes| 2009
- 377
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Impact of CMP Polish and pCMP Cleaning on Adhesion of SiCN Capping Layer on PECVD-Derived Porous OSG and Copper| 2009
- 381
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Damage-Free Post-CMP Cleaning Solution for Low-k Fluorocarbon on Advanced Interconnects| 2009
- 385
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Process Dependence on Defectivity Count on Copper and Dielectric Surfaces in Post-Copper CMP Cleaning| 2009
- 389
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A Novel Copper Interconnection Cleaning by Atomic Hydrogen Using Diluted Hydrogen Gas| 2009