Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP (Englisch)
- Neue Suche nach: Kimura, Keiichi
- Neue Suche nach: Suzuki, Keisuke
- Neue Suche nach: Khajornrungruang, Panart
- Neue Suche nach: Kimura, Keiichi
- Neue Suche nach: Suzuki, Keisuke
- Neue Suche nach: Khajornrungruang, Panart
In:
ICPT 2012
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6
;
2012
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ISBN:
- Aufsatz (Konferenz) / Elektronische Ressource
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Titel:Study on fine particle behavior in slurry flow between wafer and polishing pad as a material removal process in CMP
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Beteiligte:
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Kongress:ICPT 2012 - International Conference on Planarization / CMP Technology ; 2012 ; Grenoble, France
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Erschienen in:ICPT 2012 ; 6
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Verlag:
- Neue Suche nach: VDE VERLAG GMBH
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Erscheinungsdatum:01.01.2012
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Format / Umfang:6 pages
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ISBN:
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Medientyp:Aufsatz (Konferenz)
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Format:Elektronische Ressource
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Sprache:Englisch
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Datenquelle:
Inhaltsverzeichnis Konferenzband
Die Inhaltsverzeichnisse werden automatisch erzeugt und basieren auf den im Index des TIB-Portals verfügbaren Einzelnachweisen der enthaltenen Beiträge. Die Anzeige der Inhaltsverzeichnisse kann daher unvollständig oder lückenhaft sein.
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