Thermo‐Mechanical Analysis of Epoxy Resins Under the Influence of Moisture‐Heat Coupling by Molecular Dynamics Simulation (Englisch)
- Neue Suche nach: Sheng, Can
- Neue Suche nach: Liang, Kang
- Neue Suche nach: Wang, Shizhao
- Neue Suche nach: Liu, Sheng
- Neue Suche nach: Sheng, Can
- Neue Suche nach: Liang, Kang
- Neue Suche nach: Wang, Shizhao
- Neue Suche nach: Liu, Sheng
In:
Advanced Theory and Simulations
;
7
, 3
;
2024
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ISSN:
- Aufsatz (Zeitschrift) / Elektronische Ressource
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Titel:Thermo‐Mechanical Analysis of Epoxy Resins Under the Influence of Moisture‐Heat Coupling by Molecular Dynamics Simulation
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Beteiligte:Sheng, Can ( Autor:in ) / Liang, Kang ( Autor:in ) / Wang, Shizhao ( Autor:in ) / Liu, Sheng ( Autor:in )
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Erschienen in:
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Verlag:
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Erscheinungsdatum:01.03.2024
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Format / Umfang:8 pages
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ISSN:
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DOI:
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Medientyp:Aufsatz (Zeitschrift)
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Format:Elektronische Ressource
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Sprache:Englisch
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Schlagwörter:
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Datenquelle:
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