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Synonyme wurden verwendet für: Copper
Suche ohne Synonyme: keywords:(Copper)
Verwendete Synonyme:
- kupfer
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An efficient method to functionalize soybean protein fiber for fuse wire application
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Coating, Electroless Copper, Electroless Copper Plating -
Properties of power electronic substrates based on thick printed copper technology
Elsevier | 2016|Schlagwörter: Copper paste, Thick printed copper technology, Thick film copper firing, Copper film morphology, Copper film properties -
Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Film, Copper Nanoparticles -
Mixed ink of copper nanoparticles and copper formate complex with low sintering temperatures
Online Contents | 2016|Schlagwörter: Copper Formate, Copper Film, Copper Nanoparticles -
An efficient method to functionalize soybean protein fiber for fuse wire application
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Coating, Electroless Copper, Electroless Copper Plating -
Effect of copper precursor salts: Facile and sustainable synthesis of controlled shaped copper oxide nanoparticles
Elsevier | 2016|Schlagwörter: Copper oxide, Copper salts -
Influence of $ B_{2} $$ O_{3} $–$ SiO_{2} $–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Powder, Copper Film -
Preparation and conductive mechanism of copper nanoparticles ink
Online Contents | 2013|Schlagwörter: Copper Particle, Copper Film, Copper Nanoparticles -
End of the Supercycle and Growth of Commodity Producers : The Case of Chile
Freier ZugriffTIBKAT | 2015|Schlagwörter: Kupfer -
Preparation and thermal-sensitive characteristic of copper doped n-type silicon material
Tema Archiv | 2015|Schlagwörter: Kupfer -
Preparation of nano/microstructures of CuOEP–TCNQ cocrystals with controlled stacking and their photoresponse properties
Tema Archiv | 2014|Schlagwörter: Kupfer -
Quantitative and Qualitative Characterization of Pure Copper Chromite Nanocomposites for Photodegradation of p-Nitrophenol in Aqueous Medium
Online Contents | 2019|Schlagwörter: Copper chromite, copper oxide -
Microstructure and electrical property of copper films on a flexible substrate formed by an organic ink with 9.6 % of Cu content
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Film, Copper Nanoparticles -
Effect of electric field direction and substrate roughness on three-dimensional self-assembly growth of copper oxide nanowires
Online Contents | 2016|Schlagwörter: Copper Oxide, Copper Foil -
Mixed ink of copper nanoparticles and copper formate complex with low sintering temperatures
Online Contents | 2016|Schlagwörter: Copper Formate, Copper Film, Copper Nanoparticles -
Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications
Online Contents | 2015|Schlagwörter: Copper Substrate, Copper Layer, Copper Foil -
Preparation and conductive mechanism of copper nanoparticles ink
Online Contents | 2013|Schlagwörter: Copper Particle, Copper Film, Copper Nanoparticles -
From carbon atom to graphene on Cu(111): an ab-initio study
Tema Archiv | 2015|Schlagwörter: Kupfer -
Influence of $ B_{2} $$ O_{3} $–$ SiO_{2} $–ZnO–BaO glass ratio and sintering temperature on the microstructure and property of copper thick film for low temperature co-fired ceramic
Online Contents | 2015|Schlagwörter: Copper Particle, Copper Powder, Copper Film -
Fabrication of diverse CuO nanostructures via hydrothermal method and their photocatalytic properties
Online Contents | 2016|Schlagwörter: Copper Acetate Monohydrate, Copper Source -
WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, CROSSLINKED MODIFIED ETFE, NORMAL WEIGHT, SILVER-COATED, COPPER, 200 °C, 600 VOLT, ROHS
SAE Technical Papers | 2023Schlagwörter: Copper -
Optical and structural characterization of copper sulphide nanoparticles from copper(II) piperidine dithiocarbamate
Online Contents | 2020|Schlagwörter: Copper(II) piperidine, Copper sulphide -
Reduction Behavior of Surface Oxide on Submicron Copper Particles for Pressureless Sintering Under Reducing Atmosphere
Online Contents | 2021|Schlagwörter: copper, copper oxide -
Co-simulation of MATLAB and ANSYS for ultrasonic wire bonding process optimization
Elsevier | 2021|Schlagwörter: Copper-copper, Aluminium-copper -
Atomic Layer Deposited Gallium Oxide Buffer Layer Enables 1.2 V Open-Circuit Voltage in Cuprous Oxide Solar Cells
Tema Archiv | 2014|Schlagwörter: Kupfer, Kupfer(I)-hydroxid -
Shape-controlled CuxCe1-xO2 nanorods catalyst and the active components functioned in selective oxidation of CO in hydrogen-rich stream
Elsevier | 2020|Schlagwörter: Copper-ceria nanorod catalyst, Copper dopant -
Plasma etching of copper films at low temperature
Elsevier | 2006|Schlagwörter: Copper etching, Copper plasma etching -
Determination of crystal orientation of silicon via shape-controlled vapor-solid growth of copper nanoparticles
American Institute of Physics | 2012|Schlagwörter: Copper, Copper oxide -
Low-temperature densification of diamond/Cu composite prepared from dual-layer coated diamond particles
Online Contents | 2014|Schlagwörter: Copper Coating, Copper Matrix -
The low temperature exothermic sintering of formic acid treated Cu nanoparticles for conductive ink
Online Contents | 2016|Schlagwörter: Copper Oxide, Copper Film -
WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, CROSS-LINKED MODIFIED ETFE, NORMAL WEIGHT, NICKEL-COATED, COPPER, 200 °C, 600 VOLT, ROHS
SAE Technical Papers | 2023Schlagwörter: Copper -
WIRE, ELECTRICAL, FLUOROPOLYMER-INSULATED, CROSSLINKED MODIFIED ETFE, NORMAL WEIGHT, TIN-COATED, COPPER, 150 °C, 600 VOLT, ROHS
SAE Technical Papers | 2023Schlagwörter: Copper -
Structural influence of copper substrate on magnetic properties of electrodeposited CoPtP films for MEMS applications
Online Contents | 2015|Schlagwörter: Copper Substrate, Copper Layer, Copper Foil -
Dynamik kompakter Kurzschlussläufer - Experimentelle Analyse, Modellbildung und Parameteridentifikation
TIBKAT | 2016|Schlagwörter: Kupfer -
All‐copper Flow Batteries
Wiley | 2023|Schlagwörter: copper chloro‐complexes, copper electrodeposition -
Cu2ZnSnS4 thin film solar cells by fast coevaporation
Tema Archiv | 2011|Schlagwörter: Kupfer, Kupfer-Zink-Zinnsulfid -
Oxide-Free Copper Pastes for the Attachment of Large-Area Power Devices
Online Contents | 2019|Schlagwörter: copper nanoparticles, copper paste -
Copper Azide Confined Inside Templated Carbon Nanotubes
Wiley | 2010|Schlagwörter: copper azide, copper nanoparticles -
An efficient method to functionalize soybean protein fiber for fuse wire application
Springer Verlag | 2015|Schlagwörter: Copper Particle, Copper Coating, Electroless Copper, Electroless Copper Plating -
Photosintering and electrical performance of CuO nanoparticle inks
Elsevier | 2014|Schlagwörter: Copper, Copper oxide nanoparticle -
Growth of p-type Cu-doped GaN films with magnetron sputtering at and below 400°C
Elsevier | 2014|Schlagwörter: Copper doping -
Electroanalytical Study of Organic Additive Interactions in Copper Plating and Their Correlation with Via Fill Behavior
Online Contents | 2018|Schlagwörter: Copper -
Silver-coated copper particles as a new raw material for manufacturing electrical contacts
Elsevier | 2022|Schlagwörter: Copper, Silver-coated copper -
Cu-plated hollow glass microspheres for hydrogen production and degradation
Online Contents | 2016|Schlagwörter: Copper Nanoparticles, Copper Sulfate -
Copper electroplating into deep microvias for the “SiP” application
Elsevier | 2010|Schlagwörter: Copper seed coating, Copper electroplating -
Dynamik kompakter Kurzschlussläufer : experimentelle Analyse, Modellbildung und Parameteridentifikation
TIBKAT | 2016|Schlagwörter: Kupfer -
Fabrication of conductive copper-coated glass fibers through electroless plating process
Online Contents | 2014|Schlagwörter: Copper Layer, Copper Film -
Optimierung umformtechnischer Fügeverfahren zur Kontaktierung elektrischer Leiter
TIBKAT | 2019|Schlagwörter: Kupfer
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