The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Volume 41,
Issue 3
Volume 41,
Issue 2
Volume 41,
Issue 1
Volume 40,
Issue 4
Volume 40,
Issue 3
Volume 40,
Issue 2
Volume 40,
Issue 1
Volume 39,
Issue 4
Volume 39,
Issue 3
Volume 39,
Issue 2
Volume 39,
Issue 1
Volume 38,
Issue 4
Volume 38,
Issue 3
Volume 38,
Issue 2
Volume 38,
Issue 1
Volume 37,
Issue 4
Volume 37,
Issue 3
Volume 37,
Issue 2
Volume 37,
Issue 1
Volume 36,
Issue 4
Volume 36,
Issue 3
Volume 36,
Issue 2
Volume 36,
Issue 1
Volume 35,
Issue 4
Volume 35,
Issue 3
Volume 35,
Issue 2
Volume 35,
Issue 1
Volume 34,
Issue 3
Volume 34,
Issue 2
Volume 34,
Issue 1
Volume 33,
Issue 3
Volume 33,
Issue 2
Volume 33,
Issue 1
Volume 32,
Issue 3
Volume 32,
Issue 2
Volume 32,
Issue 1
Volume 31,
Issue 3
Volume 31,
Issue 2
Volume 31,
Issue 1
Volume 30,
Issue 3
Volume 30,
Issue 2
Volume 30,
Issue 1
Volume 29,
Issue 3
Volume 29,
Issue 2
Volume 29,
Issue 1
Volume 28,
Issue 3
Volume 28,
Issue 2
Volume 28,
Issue 1
Volume 27,
Issue 3
Volume 27,
Issue 2
Volume 27,
Issue 1
Volume 26,
Issue 3
Volume 26,
Issue 2
Volume 26,
Issue 1
Volume 25,
Issue 3
Volume 25,
Issue 2
Volume 25,
Issue 1
Volume 24,
Issue 3
Volume 24,
Issue 2
Volume 24,
Issue 1
Volume 23,
Issue 3
Volume 23,
Issue 2
Volume 23,
Issue 1
Volume 22,
Issue 3
Volume 22,
Issue 2
Volume 22,
Issue 1
Volume 21,
Issue 3
Volume 21,
Issue 2
Volume 21,
Issue 1
Volume 20,
Issue 3
Volume 20,
Issue 2
Volume 20,
Issue 1
Volume 19,
Issue 3
Volume 19,
Issue 2
Volume 19,
Issue 1
Volume 18,
Issue 3
Volume 18,
Issue 2
Volume 18,
Issue 1
Volume 17,
Issue 3
Volume 17,
Issue 2
Volume 17,
Issue 1
Volume 16,
Issue 3
Volume 16,
Issue 2
Volume 16,
Issue 1
Volume 15,
Issue 3
Volume 15,
Issue 2
Volume 15,
Issue 1
Volume 14,
Issue 3
Volume 14,
Issue 2
Volume 14,
Issue 1
Volume 13,
Issue 3
Volume 13,
Issue 2
Volume 13,
Issue 1
Volume 12,
Issue 3
Volume 12,
Issue 2
Volume 12,
Issue 1
Volume 11,
Issue 3
Volume 11,
Issue 2
Volume 11,
Issue 1
Volume 10,
Issue 3
Volume 10,
Issue 2
Volume 10,
Issue 1
Volume 9,
Issue 3
Volume 9,
Issue 2
Volume 9,
Issue 1
Volume 8,
Issue 3
Volume 8,
Issue 2
Volume 8,
Issue 1
Volume 7,
Issue 3
Volume 7,
Issue 2
Volume 7,
Issue 1
Volume 6,
Issue 3
Volume 6,
Issue 2
Volume 6,
Issue 1
Volume 5,
Issue 3
Volume 5,
Issue 2
Volume 5,
Issue 1
Volume 4,
Issue 3
Volume 4,
Issue 2
Volume 4,
Issue 1
Volume 3,
Issue 3
Volume 3,
Issue 2
Volume 3,
Issue 1
Volume 2,
Issue 4
Volume 2,
Issue 3
Volume 2,
Issue 2
Volume 2,
Issue 1
Volume 1,
Issue 4
Volume 1,
Issue 2
Volume 1,
Issue 1
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Table of contents
5
The Plastic Composite Package Provides an Economic Alternative To LSI-VLSI Packaging for High Density Microcircuits
Mallem, O.
/ Lantaires, J.
et al.
| 1985
10
Influence of Trimming on the Electric Field Distribution in Thick Film Resistors
Casselman, G.
/ De Mey, G.
et al.
| 1985
13
A Fluorochemical Coating Material for the Protection of Electronic Circuits
Wood, R.
et al.
| 1985
15
Use of Adhesives in Surface Mounting
Grant, S.
/ Wigham, J.
et al.
| 1985
17
A New Dice Bonding Method for Hybrid Technology
Ramy, J.P.
/ Demeure, L.
et al.
| 1985
19
Accuracy of Integrated Voltage Dividers in Plastic Packaged Linear ICs
Cognetti, C.
/ Simonini, F.
/ Villa, F.F.
et al.
| 1985
21
Hermetic Sealing of Kovar Hybrid Packages by Laser Welding
Norrman, S.
/ Torstensson, P.A.
et al.
| 1985
24
Thick Film Conductors and Resistors on Dielectrics for High Reliability Applications
Wheeler, J.M.
et al.
| 1985
28
Polyimide Protection of Thin Film Chip Resistors
Diletti, H.
/ Noser, J.R.
/ Sele, G.J.
et al.
| 1985
32
Practical Evaluation of a Cu Thick Film Multilayer System and Wire Bonding on Cu Conductors
Beyne, E.
/ Delen, E.
/ Govaerts, R.
et al.
| 1985
63
Thermal Design of Hybrid Microelectronics for Everyone
Dean, D.J.
et al.
| 1985
68
ISHM news
Monneraye, Marc
/ Panizza
/ Waterfield, Brian
et al.
| 1985
78
Industry news
| 1985
82
New products
| 1985