Journal of Micromechanics and Microengineering
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 287
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INVITED TALK - A review of focused ion beam applications in microsystem technologyReyntjens, S. et al. | 2001
- 287
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A review of focused ion beam applications in microsystem technologySteve Reyntjens / Robert Puers et al. | 2001
- 301
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Micromachined filters for 38 and 77 GHz supported on thin membranesA Müller / G Constantinidis / F Giaccomozzi et al. | 2001
- 301
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Micromachined filters for 38 and 77 GHz supported on thin membranesMüller, A. et al. | 2001
- 306
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Fabrication and test of thermal vertical bimorph actuators for movement in the wafer planeSehr, H. et al. | 2001
- 306
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Fabrication and test of thermal vertical bimorph actuators for movement in the wafer planeHarald Sehr / Alan G R Evans / Arthur Brunnschweiler et al. | 2001
- 311
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Micromachined structures for thermal measurements of fluid and flow parametersBaar, J.J.van et al. | 2001
- 311
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Micromachined structures for thermal measurements of fluid and flow parametersJ J van Baar / R J Wiegerink / T S J Lammerink et al. | 2001
- 319
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Silicon microphone based on surface and bulk micromachiningBrauer, M. et al. | 2001
- 319
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Silicon microphone based on surface and bulk micromachiningM Brauer / A Dehé / T Bever et al. | 2001
- 323
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Electrostatic parallel-plate actuators with large deflections for use in optical moving-fibre switchesMartin Hoffmann / Dirk Nüsse / Edgar Voges et al. | 2001
- 323
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Electrostatic parallel-plate actuators with large deflections for use in optical moving-fibre switchesHoffmann, M. et al. | 2001
- 329
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Integrated diode detector and optical fibres for in situ detection within micromachined polymerase chain reaction chipsSchabmueller, C.G.J. et al. | 2001
- 329
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Integrated diode detector and optical fibres for in situ detection within micromachined polymerase chain reaction chipsC G J Schabmueller / J R Pollard / A G R Evans et al. | 2001
- 334
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Balanced membrane micromachined loudspeaker for bearing instrument applicationRehder, J. et al. | 2001
- 334
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Balanced membrane micromachined loudspeaker for hearing instrument applicationJörg Rehder / Pirmin Rombach / Ole Hansen et al. | 2001
- 339
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Chip mounting and interconnection in multi-chip modules for space applicationsPeter Nilsson / Mats Jönsson / Lars Stenmark et al. | 2001
- 339
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MICRODEVICES, MICROSYSTEMS AND ASSEMBLY - Chip mounting and interconnection in multi-chip modules for space applicationsNilsson, P. et al. | 2001
- 344
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Membrane covered electrically isolated through-wafer via holesDaniel Rosén / Jörgen Olsson / Christer Hedlund et al. | 2001
- 344
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MATERIALS AND PROCESS TECHNOLOGY - Membrane covered electrically isolated through-wafer via holesRosén, D. et al. | 2001
- 348
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MATERIALS AND PROCESS TECHNOLOGY - Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activationTakagi, H. et al. | 2001
- 348
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Room-temperature wafer bonding of Si to LiNbO3, LiTaO3 and Gd3Ga5O12 by Ar-beam surface activationHideki Takagi / Ryutaro Maeda / Tadatomo Suga et al. | 2001
- 353
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MATERIALS AND PROCESS TECHNOLOGY - Advanced photoresist technologies for microsystemsO'Brien, J. et al. | 2001
- 353
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Advanced photoresist technologies for microsystemsJ O'Brien / P J Hughes / M Brunet et al. | 2001
- 359
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MATERIALS AND PROCESS TECHNOLOGY - Silicon fusion bond interfaces resilient to wet anisotropic etchantsKöhler, J. et al. | 2001
- 359
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Silicon fusion bond interfaces resilient to wet anisotropic etchantsJohan Köhler / Carola Strandman / Örjan Vallin et al. | 2001
- 364
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MATERIALS AND PROCESS TECHNOLOGY - Oxygen plasma wafer bonding evaluated by the Weibull fracture probability methodJonsson, K. et al. | 2001
- 364
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Oxygen plasma wafer bonding evaluated by the Weibull fracture probability methodK Jonsson / J Köhler / C Hedlund et al. | 2001
- 371
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MATERIALS AND PROCESS TECHNOLOGY - Plasma etched initial pits for electrochemically etched macroporous silicon structuresGrigoras, K. et al. | 2001
- 371
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Plasma etched initial pits for electrochemically etched macroporous silicon structuresKestutis Grigoras / Antti J Niskanen / Sami Franssila et al. | 2001
- 376
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MATERIALS AND PROCESS TECHNOLOGY - Diffusion at anodically bonded interfacesVisser, M.M. et al. | 2001
- 376
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Diffusion at anodically bonded interfacesM M Visser / S T Moe / A B Hanneborg et al. | 2001
- 382
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Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionsM T Blom / E Chmela / J G E Gardeniers et al. | 2001
- 382
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MATERIALS AND PROCESS TECHNOLOGY - Local anodic bonding of Kovar to Pyrex aimed at high-pressure, solvent-resistant microfluidic connectionsBlom, M.T. et al. | 2001
- 386
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MATERIALS AND PROCESS TECHNOLOGY - Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensorsSchlautmann, S. et al. | 2001
- 386
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Powder-blasting technology as an alternative tool for microfabrication of capillary electrophoresis chips with integrated conductivity sensorsStefan Schlautmann / Henk Wensink / Richard Schasfoort et al. | 2001
- 390
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CHARACTERIZATION AND MODELLING - Experimental characterization of the reference channel of a differential pressure sensor using pressure shock wavesBruyker, D.De et al. | 2001
- 390
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Experimental characterization of the reference channel of a differential pressure sensor using pressure shock wavesDirk De Bruyker / Robert Puers et al. | 2001
- 397
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Operation and short-term drift of polysilicon-heated CMOS microstructures at temperatures up to 1200 KM Ehmann / P Ruther / M von Arx et al. | 2001
- 397
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CHARACTERIZATION AND MODELLING - Operation and short-term drift of polysilicon-heated CMOS microstructures at temperatures up to 1200 KEhmann, M. et al. | 2001
- 402
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CHARACTERIZATION AND MODELLING - Determination of the effect of processing steps on the CMOS compatibility of a surface micromachined pressure sensorBerney, H. et al. | 2001
- 402
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Determination of the effect of processing steps on the CMOS compatibility of a surface micromachined pressure sensorH Berney / M Hill / D Cotter et al. | 2001
- 409
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CHARACTERIZATION AND MODELLING - A Monte Carlo study of etching in the presence of a mask junctionVeenendaal, E.van et al. | 2001
- 409
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A Monte Carlo study of etching in the presence of a mask junctionE van Veenendaal / H M Cuppen / W J P van Enckevort et al. | 2001
- 416
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Aeroelasticity - the interplay between fluids and solidsJari Hyvärinen / Jan Söderkvist et al. | 2001
- 416
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CHARACTERIZATION AND MODELLING - Aeroelasticity -- The interplay between fluids and solidsHyvärinen, J. et al. | 2001
- 423
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Modelling and design of an electrostatically levitated disc for inertial sensing applicationsMichael Kraft / Mateen M Farooqui / Alan G R Evans et al. | 2001
- 423
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CHARACTERIZATION AND MODELLING - Modelling and design of an electrostatically levitated disc for inertial sensing applicationsKraft, M. et al. | 2001
- 428
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Innovative design and modelling of a micromechanical relay with electrostatic actuationRobert Sattler / Peter Voigt / Helmut Pradel et al. | 2001
- 428
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CHARACTERIZATION AND MODELLING - Innovative design and modelling of a micromechanical relay with electrostatic actuationSattler, R. et al. | 2001