Microelectronics International
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 67
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RF equivalent circuit modeling of surface mounted components for PCB applicationsMenićanin, Aleksandar B. / Damnjanović, Mirjana S. / Živanov, Ljiljana D. et al. | 2010
- 75
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Influence of process parameters on the substrate heating in direct current plasma magnetron sputtering deposition processKrishnasamy, Jegenathan / Chan, Kah-Yoong / Tou, Teck-Yong et al. | 2010
- 79
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Effect of bismuth oxide thick film overlay on microstrip patch antennaPatil, S. / Puri, Vijaya et al. | 2010
- 84
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Creating screen-printed passive components for microwave applicationsArenas, Osvaldo J. / Leynia de la Jarrige, Emilie / Boone, François et al. | 2010
- 93
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Improved thermal stability of nitrogen annealed sputtered hafnium oxide thin films for VLSI technologyNahar, R.K. / Singh, Vikram et al. | 2010
- 98
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3D LED and IC wafer level packagingLau, John / Lee, Ricky / Yuen, Matthew et al. | 2010
- 106
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Experimental analysis of I-V and C-V characteristics of Ni/SiO2/4H-SiC system with varying oxide thicknessGupta, Sanjeev K. / Azam, A. / Akhtar, J. et al. | 2010
- 113
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The effects of threading dislocations and tensile strain in Ge/Si photodetectorYang, Jian-hong / Wei, Ying / Cai, Xue-yuan et al. | 2010
- 117
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The effect of porosity on the properties of silicon solar cellRamizy, Asmiet / Aziz, Wisam J. / Hassan, Z. et al. | 2010
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NXP launches LPCXpresso toolchain for LPC1100 Cortex-M0 family| 2010
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Qualcomm and TSMC collaborating on 28 nm process technology| 2010
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TSMC announces process technologies for integrated light emitting diodes drivers| 2010
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Molex introduces industrys smallest SMT board-to-board connector| 2010
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Conclusion of absorption-type company split agreement| 2010
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Wolfson launches world-leading high-performance audio solution| 2010
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Rutronik presents high-accuracy motion sensor from STMicroelectronics| 2010
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Five new liquid electrolyte hydride sensors offer improved performance in demanding environments| 2010
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International diary| 2010
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IFS 2010Annual semiconductor industry forecast seminar| 2010
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Cadence strengthens virtuoso custom IC design franchise leading EDA software for analog and mixed-signal design| 2010
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TSMC holds topping ceremony for Fab 12, Phase 5| 2010
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Advanced digital signal processing application design will be a blast with new Xilinx Virtex 6 FPGA-based XMC and PMC boards| 2010
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InterTech expands turnkey testing services to European automotive manufacturers| 2010
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Future Horizons signs up India affiliate| 2010
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Fairchild semiconductors new energy-efficient LED driver| 2010
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GE, Philips, SNCF to present at worlds largest energy harvesting event| 2010
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Cranfield develops revolutionary technology for manufacturing micro-scale devices| 2010
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Synopsys launches DesignWare HDMI 1.4 Tx/Rx controller and PHY IP solutions for 40 nm process technologies| 2010