Microelectronics journal
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 1
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Editorial board| 1982
- 39
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Microcomputer draws only 3μA| 1982
- 39
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Quasistatic and nonequilibrium phenomena in MOS structures under the influence of a constant gate-current bias| 1982
- 39
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C-MOS read-only memory mates with a host of processors| 1982
- 39
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Low-power EE-PROM can be programmed fast| 1982
- 39
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Lowered I-F shrinks FM radio onto one chip| 1982
- 39
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Measurement science is catching up| 1982
- 39
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Achieving stability in IC oscillators| 1982
- 39
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A programmable pseudo-random noise generator| 1982
- 39
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VLSI device phenomena in dynamic memory and their application to technology development and device design| 1982
- 40
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TiNx thin-film resistors for hybrid integrated circuits| 1982
- 40
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Design and development of a 68-lead nonhermetic leaded chip carrier| 1982
- 40
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A computer programme with temperature gradient capability for the network analysis of hybrid circuits| 1982
- 40
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Peripheral controller chip ties into 8- and 16-bit systems| 1982
- 40
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Design and production of hybrid circuit artwork| 1982
- 40
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A silicon and aluminium dynamic memory technology| 1982
- 40
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Active filters and hybrid technology| 1982
- 40
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A method for the computer-assisted design of the topology of thick-film hybrid circuits| 1982
- 40
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A new approach to the topological design of hybrid circuits| 1982
- 40
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Numerical analysis of the resistance of interference-fit pin connections| 1982
- 40
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64-K static RAM surrounds n-MOS cells with C-MOS circuits| 1982
- 41
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Hybrids with TAB - at the threshold of production| 1982
- 41
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Advances in thin-film implementation of RC-active filters| 1982
- 41
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Low pinch-off voltage FET logic (LPFL): LSI oriented logic approach using quasinormally off GaAs MESFETs| 1982
- 41
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Chip capacitors tackle mounting and reliability problems| 1982
- 41
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A new process for printing fine conductor lines and spaces on large area substrates| 1982
- 41
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Mechanism of ceramic capacitor leakage failures due to low DC stress| 1982
- 41
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Design of ion implanted resistors with low 1/f noise| 1982
- 41
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Computer controlled imaging system for automatic hybrid inspection| 1982
- 41
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Stress distributions around an interference-fit pin connection in a plated through hole| 1982
- 41
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V-groove isolated BIFET technology for micropower ICs| 1982
- 42
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Foil circuits| 1982
- 42
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Calculation and design of thick-film resistors| 1982
- 42
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Thermochemical calculations on the LPCVD of Si3N4 and SiO2| 1982
- 42
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A latent failure mechanism for surface acoustic wave components utilising lithium niobate| 1982
- 42
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Effects of silicon nitride encapsulation on MOS device stability| 1982
- 42
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Some observations on the accelerated ageing of thick-film resistors| 1982
- 42
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Thin film Al-Al2O3-Al capacitors with dielectric layer formed at 400°C| 1982
- 42
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Electrical transport in thick film resistors| 1982
- 42
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Thin film with surface disorder in the average t-matrix approximation| 1982
- 42
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Failure analysis of multilayer ceramic substrates| 1982
- 42
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X-ray resist materials| 1982
- 43
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Moisture uptake and release by plastic molding compounds - its relationship to system life and failure mode| 1982
- 43
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The longitudinal diffusion coefficient and the mobility of hot electrons in silicon| 1982
- 43
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Failure analysis and reliability of thermal printing devices| 1982
- 43
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Scaling the barriers to VLSI's fine lines| 1982
- 43
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The lubrication of gold surfaces by plasma-deposited thin films of fluorocarbon polymer| 1982
- 43
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Corrosion model for plastic encapsulated and hermetic modules| 1982
- 43
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IC alignment and layout considerations| 1982
- 43
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Reliability analysis of several conductors at high current densities for use in bubble memories| 1982
- 43
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Deformation of Al metallisation in plastic encapsulated semiconductor devices caused by thermal shock| 1982
- 43
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Generic reliability of the high-conductivity TaSi2/n+ poly-Si gate MOS structure| 1982
- 44
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On the physics and modeling of small semiconductor devices - I| 1982
- 44
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Thermal management techniques keep semiconductors cool| 1982
- 44
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Interface charges beneath laser-annealed insulators on silicon| 1982
- 44
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Heat transfer correlations for use in naturally cooled enclosures with high-power integrated circuits| 1982
- 44
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Chips detects errors in 25 ns| 1982
- 44
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The influence of VLSI circuitry on the progress of microlithographic equipment| 1982
- 44
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A study of diffused bipolar transistors by electron microscopy| 1982
- 44
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On the physics and modeling of small semiconductor devices - III. Transient response in the finite collision-duration regime| 1982
- 44
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On the physics and modeling of small semiconductor devices - II. The very small device| 1982