Microsystem technologies : sensors, actuators, system integration ; research journal
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
Table of contents
- 1
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Design, Test, Integration and Packaging of MEMS/MOEMS, 2004Michel, Bernd et al. | 2005
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Super-fine ink-jet printing: toward the minimal manufacturing systemMurata, Kazuhiro / Matsumoto, Junichi / Tezuka, Akira et al. | 2005
- 8
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Experimental measurements and behavioral modeling of an electrostatically actuated bi-axial micromirrorParrain, Fabien / Megherbi, Souhil / Raynaud, Gilles et al. | 2005
- 15
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V-shaped micromechanical tunable capacitors for RF applicationsCruau, Aurélie / Lissorgues, Gaëlle / Nicole, Pierre et al. | 2005
- 21
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A methodology to extract dynamic compact thermal models under time-varying boundary conditions: application to a thermopile based IR sensorSalleras, M. / Palacín, J. / Moreno, M. et al. | 2005
- 30
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Fabrication and optimization of bimorph micro probes for the measurement of individual biocellsCho, Y. H. / Collard, D. / Buchaillot, L. et al. | 2005
- 38
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Behavioral VHDL-AMS model and experimental validation of a nuclear magnetic resonance sensorMegherbi, S. / Ginefri, J.-C. / Darrasse, L. et al. | 2005
- 44
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Electronic Mosquito: designing a semi-invasive Microsystem for blood sampling, analysis and drug delivery applicationsGattiker, Giorgio E. / Kaler, Karan V. I. S. / Mintchev, Martin P. et al. | 2005
- 52
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MOEMS: packaging and testingWang, Z. F. / Cao, W. / Lu, Z. et al. | 2005
- 59
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Mechanical and electrical bonding between silicon wafer and glass wafer with etched channels containing metal tracksBrida, S. / Metivet, S. / Petit, D. et al. | 2005
- 63
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Glass frit bonding: an universal technology for wafer level encapsulation and packagingKnechtel, Roy et al. | 2005
- 69
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The influence of package-induced stresses on moulded Hall sensorsFischer, Sebastian / Beyer, Harald / Janke, Ralf et al. | 2005
- 75
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Thermo-mechanical analysis of advanced electronic packages in early system designSommer, Johann-Peter / Wittler, Olaf / Manessis, Dionysios et al. | 2005
- 82
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Fabrication of microlens array with graduated sags using UV proximity printing methodYang, H. / Chao, C.-K. / Lin, T.-H. et al. | 2005
- 91
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Tunable Fabry-Perot surface micromachined interferometer-experiments and modelingMüller, Raluca / Cristea, Dana / Tibeica, C. et al. | 2005
- 98
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Fabrication of an accurately vertical sidewall for optical switch applications using deep RIE and photoresist spray coatingIkehara, T. / Maeda, R. et al. | 2005
- 104
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Simulation and fabrication for pin-to-plate microjoining by Nd:YAG laserChung, C. K. / Lin, Y. C. et al. | 2005
- 110
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Large-scale hot embossingWorgull, M. / Heckele, M. / Schomburg, W. K. et al. | 2005
- 116
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A study of integration of LIGA and M-EDM technology on the microinjection molding of ink-jet printers’ nozzle platesTseng, Shi-Chang / Chen, Yi-Chern / Kuo, Chia-Lung et al. | 2005
- 120
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Bio-MEMS fabricated artificial capillaries for tissue engineeringWang, G. J. / Chen, C. L. / Hsu, S. H. et al. | 2005
- 128
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A 3D-CAM system for quick prototyping and microfabrication using excimer laser micromachiningMutapcic, Emir / Iovenitti, Pio / Hayes, Jason P. et al. | 2005
- 137
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Feature length-scale modeling of LPCVD and PECVD MEMS fabrication processesMusson, Lawrence C. / Ho, Pauline / Plimpton, Steven J. et al. | 2005
- 143
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Preparation of ferroelectric ceramics in a film structure and their photovoltaic propertiesIchiki, M. / Morikawa, Y. / Mabune, Y. et al. | 2005
- 149
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Reliability study of AlTi/TiW on polysilicon contacts for high temperature sensorsAndrei, A. / Malhaire, C. / Brida, S. et al. | 2005
- 154
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Transient thermal characterisation of hot platesBognár, Gy. / Fürjes, P. / Székely, V. et al. | 2005
- 160
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SOI-CMOS compatible low-power gas sensor using sputtered and drop-coated metal-oxide active layersIvanov, P. / Laconte, J. / Raskin, J. P. et al. | 2005
- 169
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Stable SOI micromachined electrostatic AC voltage referenceKärkkäinen, Anu / Pekko, Panu / Dekker, James et al. | 2005
- 173
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Integrated electromagnetic microactuators with a large driving forcePan, C.-T. / Yang, H. / Chou, M.-C. et al. | 2005
- 180
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Development of a low cost hybrid Si/PDMS multi-layered pneumatic microvalveThuillier, Gaël / Malek, Chantal Khan et al. | 2005