The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Volume 30,
Issue 5
Volume 30,
Issue 4
Volume 30,
Issue 3
Volume 30,
Issue 1
Volume 29,
Issue 12
Volume 29,
Issue 11
Volume 29,
Issue 10
Volume 29,
Issue 9
Volume 29,
Issue 8
Volume 29,
Issue 7
Volume 29,
Issue 6
Volume 29,
Issue 5
Volume 29,
Issue 4
Volume 29,
Issue 3
Volume 29,
Issue 2
Volume 29,
Issue 1
Volume 28,
Issue 12
Volume 28,
Issue 11
Volume 28,
Issue 10
Volume 28,
Issue 9
Volume 28,
Issue 8
Volume 28,
Issue 7
Volume 28,
Issue 6
Volume 28,
Issue 5
Volume 28,
Issue 4
Volume 28,
Issue 3
Volume 28,
Issue 2
Volume 28,
Issue 1
Volume 27,
Issue 12
Volume 27,
Issue 11
Volume 27,
Issue 10
Volume 27,
Issue 9
Volume 27,
Issue 8
Volume 27,
Issue 7
Volume 27,
Issue 6
Volume 27,
Issue 5
Volume 27,
Issue 4
Volume 27,
Issue 3
Volume 27,
Issue 2
Volume 27,
Issue 1
Volume 26,
Issue 12
Volume 26,
Issue 11
Volume 26,
Issue 10
Volume 26,
Issue 9
Volume 26,
Issue 8
Volume 26,
Issue 7
Volume 26,
Issue 6
Volume 26,
Issue 5
Volume 26,
Issue 4
Volume 26,
Issue 3
Volume 26,
Issue 2
Volume 26,
Issue 1
Volume 25,
Issue 12
Volume 25,
Issue 11
Volume 25,
Issue 10
Volume 25,
Issue 9
Volume 25,
Issue 8
Volume 25,
Issue 7
Volume 25,
Issue 6
Volume 25,
Issue 5
Volume 25,
Issue 4
Volume 25,
Issue 3
Volume 25,
Issue 2
Volume 25,
Issue 1
Volume 24,
Issue 12
Volume 24,
Issue 11
Volume 24,
Issue 10
Volume 24,
Issue 9
Volume 24,
Issue 8
Volume 24,
Issue 7
Volume 24,
Issue 6
Volume 24,
Issue 5
Volume 24,
Issue 4
Volume 24,
Issue 3
Volume 24,
Issue 2
Volume 24,
Issue 1
Volume 23,
Issue 12
Volume 23,
Issue 11
Volume 23,
Issue 10
Volume 23,
Issue 9
Volume 23,
Issue 8
Volume 23,
Issue 7
Volume 23,
Issue 6
Volume 23,
Issue 5
Volume 23,
Issue 4
Volume 23,
Issue 3
Volume 23,
Issue 2
Volume 23,
Issue 1
Volume 22,
Issue 12
Volume 22,
Issue 11
Volume 22,
Issue 10
Volume 22,
Issue 9
Volume 22,
Issue 8
Volume 22,
Issue 7
Volume 22,
Issue 6
Volume 22,
Issue 5
Volume 22,
Issue 4
Volume 22,
Issue 3
Volume 22,
Issue 2
Volume 22,
Issue 1
Volume 21,
Issue 12
Volume 21,
Issue 11
Volume 21,
Issue 10
Volume 21,
Issue 9
Volume 21,
Issue 8
Volume 21,
Issue 7
Volume 21,
Issue 6
Volume 21,
Issue 5
Volume 21,
Issue 4
Volume 21,
Issue 3
Volume 21,
Issue 2
Volume 21,
Issue 1
Volume 20,
Issue 12
Volume 20,
Issue 11
Volume 20,
Issue 10
Volume 20,
Issue 9
Volume 20,
Issue 8
Volume 20,
Issue 7
Volume 20,
Issue 6
Volume 20,
Issue 5
Volume 20,
Issue 4
Volume 20,
Issue 3
Volume 20,
Issue 2
Volume 20,
Issue 1
Volume 19,
Issue 12
Volume 19,
Issue 11
Volume 19,
Issue 10
Volume 19,
Issue 9
Volume 19,
Issue 8
Volume 19,
Issue 7
Volume 19,
Issue 6
Volume 19,
Issue 5
Volume 19,
Issue 4
Volume 19,
Issue 3
Volume 19,
Issue 2
Volume 19,
Issue 1
Volume 18,
Issue 12
Volume 18,
Issue 11
Volume 18,
Issue 10
Volume 18,
Issue 9
Volume 18,
Issue 8
Volume 18,
Issue 7
Volume 18,
Issue 6
Volume 18,
Issue 5
Volume 18,
Issue 4
Volume 18,
Issue 3
Volume 18,
Issue 2
Volume 18,
Issue 1
Volume 17,
Issue 12
Volume 17,
Issue 11
Volume 17,
Issue 10
Volume 17,
Issue 9
Volume 17,
Issue 8
Volume 17,
Issue 7
Volume 17,
Issue 5
Volume 17,
Issue 4
Volume 17,
Issue 3
Volume 17,
Issue 2
Volume 17,
Issue 1
Volume 16,
Issue 12
Volume 16,
Issue 11
Volume 16,
Issue 10
Volume 16,
Issue 9
Volume 16,
Issue 8
Volume 16,
Issue 7
Volume 16,
Issue 6
Volume 16,
Issue 5
Volume 16,
Issue 4
Volume 16,
Issue 3
Volume 16,
Issue 2
Volume 16,
Issue 1
Volume 15,
Issue 12
Volume 15,
Issue 11
Volume 15,
Issue 10
Volume 15,
Issue 9
Volume 15,
Issue 8
Volume 15,
Issue 7
Volume 15,
Issue 6
Volume 15,
Issue 5
Volume 15,
Issue 4
Volume 15,
Issue 3
Volume 15,
Issue 2
Volume 15,
Issue 1
Volume 14,
Issue 12
Volume 14,
Issue 11
Volume 14,
Issue 9
Volume 14,
Issue 8
Volume 14,
Issue 7
Volume 14,
Issue 6
Volume 14,
Issue 5
Volume 14,
Issue 4
Volume 14,
Issue 3
Volume 14,
Issue 2
Volume 14,
Issue 1
Volume 13,
Issue 12
Volume 13,
Issue 11
Volume 13,
Issue 10
Volume 13,
Issue 8
Volume 13,
Issue 7
Volume 13,
Issue 6
Volume 13,
Issue 5
Volume 13,
Issue 4
Volume 13,
Issue 3
Volume 13,
Issue 2
Volume 13,
Issue 1
Volume 12,
Issue 12
Volume 12,
Issue 11
Volume 12,
Issue 10
Volume 12,
Issue 9
Volume 12,
Issue 8
Volume 12,
Issue 7
Volume 12,
Issue 6
Volume 12,
Issue 5
Volume 12,
Issue 4
Volume 12,
Issue 3
Volume 12,
Issue 2
Volume 12,
Issue 1
Volume 11,
Issue 12
Volume 11,
Issue 11
Volume 11,
Issue 10
Volume 11,
Issue 8
Volume 11,
Issue 7
Volume 11,
Issue 6
Volume 11,
Issue 4
Volume 11,
Issue 2
Volume 11,
Issue 1
Volume 10,
Issue 10
Volume 10,
Issue 8
Volume 10,
Issue 6
Volume 10,
Issue 5
Volume 10,
Issue 4
Volume 10,
Issue 3
Volume 10,
Issue 2
Volume 10,
Issue 1
Volume 9,
Issue 8
Volume 9,
Issue 6
Volume 9,
Issue 5
Volume 9,
Issue 4
Volume 9,
Issue 3
Volume 9,
Issue 1
Volume 8,
Issue 6
Volume 8,
Issue 4
Volume 8,
Issue 2
Volume 8,
Issue 1
Volume 7,
Issue 5
Volume 7,
Issue 4
Volume 7,
Issue 3
Volume 7,
Issue 2
Volume 7,
Issue 1
Volume 6,
Issue 6
Volume 6,
Issue 5
Volume 6,
Issue 4
Volume 6,
Issue 3
Volume 6,
Issue 2
Volume 6,
Issue 1
Volume 5,
Issue 4
Volume 5,
Issue 3
Volume 5,
Issue 2
Volume 5,
Issue 1
Volume 4,
Issue 4
Volume 4,
Issue 3
Volume 4,
Issue 2
Volume 4,
Issue 1
Volume 3,
Issue 4
Volume 3,
Issue 3
Volume 3,
Issue 2
Volume 3,
Issue 1
Volume 2,
Issue 4
Volume 2,
Issue 3
Volume 2,
Issue 2
Volume 2,
Issue 1
Volume 1,
Issue 4
Volume 1,
Issue 3
Volume 1,
Issue 2
Volume 1,
Issue 1
>
Table of contents
951
Special issue WaferBond’13
Knechtel, Roy
/ Niklaus, Frank
/ Michel, Bernd
et al.
| 2015
953
Direct wafer bonding of amorphous or densified atomic layer deposited alumina thin films
Beche, E.
/ Fournel, F.
/ Larrey, V.
et al.
| 2015
961
Mechanism involved in direct hydrophobic Si(100)-2×1:H bonding
Rauer, C.
/ Moriceau, H.
/ Rieutord, F.
et al.
| 2015
969
Modelling of the direct bonding wave
Radisson, Damien
/ Fournel, Frank
/ Charlaix, Elisabeth
et al.
| 2015
973
Mechanical understanding of 100 mm InP and GaAs direct bonded heterostructure
Imbert, B.
/ Blot, X.
/ Tauzin, A.
et al.
| 2015
979
Conductivity of high-temperature annealed silicon direct wafer bonds
Schjølberg-Henriksen, Kari
/ Tvedt, Lars Geir Whist
/ Gjelstad, Stein Are
et al.
| 2015
987
Origin of the TTV of thin films obtained by temporary bonding $ ZoneBond^{®} $ technology
Montméat, P.
/ Enot, T.
/ Pellat, M.
et al.
| 2015
995
Kinetics of low temperature direct copper–copper bonding
Gondcharton, P.
/ Imbert, B.
/ Benaissa, L.
et al.
| 2015
1003
Analytical methods used for low temperature Cu–Cu wafer bonding process evaluation
Rebhan, B.
/ Tollabimazraehno, S.
/ Hesser, G.
et al.
| 2015
1015
UV/$ O_{3} $ assisted InP/$ Al_{2} $$ O_{3} $–$ Al_{2} $$ O_{3} $/Si low temperature die to wafer bonding
Anantha, P.
/ Tan, C. S.
et al.
| 2015
1021
Wafer level vacuum packaging of micro-mirrors with buried signal lines
Langa, S.
/ Drabe, C.
/ Herrmann, A.
et al.
| 2015
1029
Silicon–ceramic–silicon-wafercompound fabricated by using nanostructured silicon surfaces and a ceramic with adapted thermal expansion coefficient
Günschmann, S.
/ Fischer, M.
/ Mannebach, H.
et al.
| 2015
1035
Laser welding of sapphire wafers using a thin-film fresnoite glass solder
de Pablos-Martín, Araceli
/ Ebert, M.
/ Patzig, C.
et al.
| 2014
1047
Design of compact and wide bandwidth SPDT with anti-stiction torsional RF MEMS series capacitive switch
Bansal, Deepak
/ Kumar, Amit
/ Sharma, Akshdeep
et al.
| 2014
1053
Fabrication and characterization of MEMS piezoelectric synthetic jet actuators with bulk-micromachined PZT thick film
Wang, Shushan
/ Ma, Binghe
/ Deng, Jinjun
et al.
| 2014
1061
The on-chip temperature compensation and temperature control research for the silicon micro-gyroscope
Yang, Bo
/ Dai, Bo
/ Liu, Xiaojun
et al.
| 2014
1073
A complete analytical model for circular diaphragm pressure sensor with freely supported edge
Jindal, Sumit Kumar
/ Raghuwanshi, Sanjeev Kumar
et al.
| 2014
1081
Small modified printed planar ultrawide band disc antennas with etched ground plane
Sasibhushana Rao, G.
/ Srinivasa Kumar, S.
/ Pillalamarri, Ramu
et al.
| 2014
1087
Wide-band millimetre-wave antenna based on Si and suspended BCB membrane
Seok, Seonho
/ Kim, Janggil
/ Salti, Hassan
et al.
| 2014
1093
Fabrication and characterization of a dry electrode integrated Gecko-inspired dry adhesive medical patch for long-term ECG measurement
Wang, Long-Fei
/ Liu, Jing-Quan
/ Yang, Bin
et al.
| 2014
1101
Local thermal-assisted ultrasonic embossing for the fabrication of polymer microstructures
Qi, Na
/ Luo, Yi
/ Wang, Xiao-dong
et al.
| 2014
1111
The plastic and creep characteristics of silicon microstructure at elevated temperature
Yao, Shaokang
/ Xu, Dehui
/ Xiong, Bin
et al.
| 2014
1121
Development of a novel microviscosity model based on molecular chain length
Lou, Yan
/ Pei, Jiulong
/ He, Peiqian
et al.
| 2014
1131
Fabrication of miniature parts using nano-sized powders and an environmentally friendly binder through micro powder injection molding
Rajabi, Javad
/ Zakaria, Hafizawati
/ Muhamad, Norhamidi
et al.
| 2014
1137
Governance, policy, and legislation of nanotechnology: a perspective
Bhushan, Bharat
et al.
| 2015