Challenges and Solutions of Extremely Thin SOI (ETSOI) for CMOS Scaling to 22nm Node and Beyond (English)
- New search for: Cheng, K.
- New search for: Khakifirooz, A.
- New search for: Kulkarni, P.
- New search for: Edge, L.F.
- New search for: Reznicek, A.
- New search for: Adam, T.
- New search for: He, H.
- New search for: Seo, S.
- New search for: Kanakasabapathy, S.
- New search for: Schmitz, S.
- New search for: Cheng, K.
- New search for: Khakifirooz, A.
- New search for: Kulkarni, P.
- New search for: Edge, L.F.
- New search for: Reznicek, A.
- New search for: Adam, T.
- New search for: He, H.
- New search for: Seo, S.
- New search for: Kanakasabapathy, S.
- New search for: Schmitz, S.
- New search for: Wu, H.
In:
China semiconductor technology
1
;
951-958
;
2010
-
ISBN:
-
ISSN:
- Conference paper / Print
-
Title:Challenges and Solutions of Extremely Thin SOI (ETSOI) for CMOS Scaling to 22nm Node and Beyond
-
Contributors:Cheng, K. ( author ) / Khakifirooz, A. ( author ) / Kulkarni, P. ( author ) / Edge, L.F. ( author ) / Reznicek, A. ( author ) / Adam, T. ( author ) / He, H. ( author ) / Seo, S. ( author ) / Kanakasabapathy, S. ( author ) / Schmitz, S. ( author )
-
Conference:International conference, China semiconductor technology ; 2010 ; Shanghai, China
-
Published in:China semiconductor technology , 1 ; 951-958ECS TRANSACTIONS ; 27, 1 ; 951-958
-
Publisher:
- New search for: Electrochemical Society
-
Place of publication:Pennington, N.J.
-
Publication date:2010-01-01
-
Size:8 pages
-
Remarks:Includes bibliographical references and author index
-
ISBN:
-
ISSN:
-
Type of media:Conference paper
-
Type of material:Print
-
Language:English
-
Keywords:
-
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 3
-
Forming-Less Unipolar TaO~x-Based RRAM with Large CC-Independence Range for High Density Memory ApplicationsZhang, L. / Zhu, M. / Huang, R. / Gao, D. / Kuang, Y. / Shi, C. / Wang, Y. et al. | 2010
- 9
-
Process Simulation and Experimental Study of Stress Memorization in Strained Silicon nMOSFETsWong, T. / Gong, Y. et al. | 2010
- 15
-
Investigation of Different Strain Configurations in Gate-All-Around Silicon Nanowire TransistorYun, Q. / Zhuge, J. / Huang, R. / Wang, R. / An, X. / Zhang, L. / Zhang, X. / Wang, Y. et al. | 2010
- 21
-
Review on Methods for Trench MOSFET Gate Oxide Reliability and Switching Speed ImprovementNg, H. et al. | 2010
- 27
-
CMOS Technology Toward GreenChi, M. / Wu, H. et al. | 2010
- 33
-
Threshold Voltage Increasing Induced by Poly Silicon Gate Counter Pre-Doping in NMOSFETLiu, J. / Zhou, A. / Zheng, K. / Wu, J. / Gan, Z. / Chen, S. / Guo, H. / Wang, G. / Ju, J. / Ho, H. et al. | 2010
- 39
-
Impact of Radiation on the Operation and Reliability of Deep Submicron CMOS TechnologiesClaeys, C. / Put, S. / Griffoni, A. / Cester, A. / Gerardin, S. / Meneghesso, G. / Paccagnella, A. / Simoen, E. et al. | 2010
- 47
-
Junction Technology for 2D and 3D Devices: Self Regulation Plasma Doping SRPDMizuno, B. et al. | 2010
- 55
-
NMOS Narrow Width Devices Drive Current Improvements through STI Processes and Channel Implantation OptimizationShen, Z. / Ju, J. / Wang, B. / Zhou, A. / Liu, J. / Ho, H. / Ning, X. et al. | 2010
- 61
-
The Combined Impact of Total Ionizing Dose Effect and Negative Bias Temperature Stress on Deep Sub-Micron pMOSFETsWang, J. / Wang, W. / Huang, D. / Xue, S. / Wang, S. / Liu, W. / Huang, R. et al. | 2010
- 67
-
Fluorine IMP Effect on Negative Bias Temperature Instability and Process Induced DefectsZhou, A. / Liu, J. / Zheng, K. / Ju, J. / Zhang, J. / Gan, Z. / Ho, H. / Ning, X. et al. | 2010
- 73
-
Low Voltage and High Speed SONOS Flash Memory Technology: The Strategies and the ReliabilitiesChung, S. et al. | 2010
- 79
-
Heterostructure HEMT Electronic Device Simulation with Density Functional TheoryHu, Y. / Wang, J. / Wen, C. / Yu, M. / Mao, L. / Hao, Y. et al. | 2010
- 85
-
Fabrication and Characterization of Polycrystalline SiC Comb ResonatorsNing, J. / Zhao, Y. / Sun, G. / Han, G. / Si, C. / Yang, F. et al. | 2010
- 91
-
Fabrication and Characterization of Polysilicon-Based Clamped-Clamped FilterZhao, Y. / Ning, J. / Han, G. / Si, C. / Yang, F. et al. | 2010
- 97
-
Design and Fabrication Using Hot Embossing Lithography of a Microfluidic Chip for Microsphere Single-Pass ApplicationsQu, H. / Yang, R. / Yao, S. / Gao, P. et al. | 2010
- 103
-
Comparison of High Voltage (200-300 Volts) Lateral Power MOSFETs for Power Integrated CircuitsSheu, G. / Lin, Y. / Tseng, W. / Yang, S. / Chen, C. / Guo, Y. et al. | 2010
- 109
-
Effect of the Dummy Gate on the Capacitance Characteristics of the LDMOSFETsZhu, C. / Fu, J. / Wang, Y. / Liu, Z. / Wu, Z. / Xu, P. / Cui, J. / Jiang, Z. / Zhao, Y. / Zhang, Z. et al. | 2010
- 115
-
Reduction of Kink Effect in SOI LDMOS Structure with Linear Drift Region ThicknessSheu, G. / Wu, C. / Yang, S. / Guo, Y. et al. | 2010
- 121
-
Analysis and Optimization of High-Voltage Devices in a BCD ProcessFu, C. / Xu, F. / Cheng, Y. et al. | 2010
- 125
-
Combining 2D and 3D Device Simulations for Optimizing LDMOS DesignLin, C. / Sheu, G. / Yang, S. / Guo, Y. et al. | 2010
- 131
-
A Voltage-Type Sense Amplifier for Low-Power Nonvolatile MemoriesLi, M. / Yang, L. / Kang, J. et al. | 2010
- 139
-
Characterization of Oxidation Induced Substrate LossCunnane, L. / Moore, D. / Waldfried, C. / Luo, S. / Kiermasz, A. / Ditmer, G.A. et al. | 2010
- 145
-
Outlier Detection to Assure Good Quality for Metrology Bias Acceptance TestYang, S.F. / Chien, W.K. et al. | 2010
- 151
-
Nanoscale Non-Destructive Semiconductor Dopant Characterization and Failure AnalysisTanbakuchi, H. et al. | 2010
- 157
-
Modeling of Variability in Geometric Parameters of MOSFETs for DFM ApplicationsLiu, D. / Jiang, L. / Qin, X. / Cheng, Y. et al. | 2010
- 163
-
Wafer-Area-Saving Test Structures and Measurement Method for the Characterization of Interconnect Resistance and Capacitance in Nanometer TechnologiesQin, X. / Jiang, L. / Cheng, Y. et al. | 2010
- 169
-
Design and Optimization of Power Devices in a BCD ProcessXu, F. / Fu, C. / Cheng, Y. et al. | 2010
- 173
-
Development of a MEMS/IC Design Environment for RFIC ApplicationsXin, S. / Fu, Z. / Cheng, Y. et al. | 2010
- 179
-
MOP-DDPG: Multiple Observation Points Oriented Deterministic Diagnostic Pattern Generation for Compound FaultsWang, F. / Hu, Y. / Ye, J. / Huang, Y. / Li, X. / Yang, H. et al. | 2010
- 185
-
A Case Study of Hierarchical Diagnosis for Core-Based SoCWang, E. / Huang, Y. / Cheng, W. / Yang, W. / Fu, J. et al. | 2010
- 191
-
Address RF Multi-Site Test Efficiency ChallengeGe, L. et al. | 2010
- 197
-
CAT (Critical-Area-Targeted): A New Paradigm for Reducing Yield Loss Risk in At-Speed Scan TestingWen, X. / Enokimoto, K. / Miyase, K. / Kajihara, S. / Aso, M. / Furukawa, H. et al. | 2010
- 203
-
High Precision Defect Inspection & BinningChang, E. / Park, A. et al. | 2010
- 209
-
Advanced In-Line Monitoring BrightField Inspection Tool for E-Test Correlation and Yield Analysis on 45nm Test ChipsKwon, Y. / Yoon, H. / Kang, H. / Kim, K. / Kim, M. / Oh, Y. / Lee, J. / Gunda, V. / Choi, H. / Shoji, G. et al. | 2010
- 215
-
A Mathematics Model to Estimate ATE Performance Impacts on EVM Testing of RF 2G and 3G DevicesChen, Z. / Zhang, Z. / Phong, P. et al. | 2010
- 221
-
Effectiveness Indices for Statistical Process Control Chart PerformanceYang, S.F. / Chien, W.K. et al. | 2010
- 227
-
Effects of Moisture Content on Dielectric Constant and Dissipation Factor of Printed Circuit Board MaterialsMa, L. / Sood, B. / Pecht, M. et al. | 2010
- 237
-
Reverse-Bias Electroluminescence Observation for Reliability Investigations of the InGaN LEDChen, H. / Lu, T. et al. | 2010
- 243
-
Relating Extrinsic Breakdown Statistics to the Initial Current Leakage Distribution in Gate OxidesSune, J. / Tous, S. / Wu, E.Y. et al. | 2010
- 249
-
Breakdown Statistics of Gate Dielectric StacksSune, J. / Tous, S. / Wu, E.Y. et al. | 2010
- 255
-
Effect of Oxidation Enhanced Diffusion on Hot Carrier Injection Induced Degradation in N-Type High-Voltage DDDMOSFETDeng, Z. / Li, X. / Zhang, R.H. / Yun, Y. / Huang, A. / Cao, G. / Shi, Y. et al. | 2010
- 261
-
The Impact of Different Stress Condition Combinations on Parameters Estimations in Electromigration TestsMa, J.J. / Wang, X.J. / Gong, E.B. / Chang, V. et al. | 2010
- 269
-
Ag Migration Induced Reliability Concern on Micro-Electro-Mechanical StructureZheng, P. / Dong, W. / Chang, V. / Liu, Y. / Li, G. / Ji, C. / Li, M. et al. | 2010
- 275
-
A New BSIM3v3 SPICE Model for Reliability of Hot Carrier Injection Effect in MOSFETYu, Y.Y. / Li, X. / Ren, Z. / Shi, L.Y. / Deng, Z. / Hu, S. / Tang, Y. / Zhou, W. et al. | 2010
- 281
-
Failure Analysis of Cracked DieMa, L. / Bao, S. et al. | 2010
- 289
-
UVision Solution for High Detection Sensitivity at the StitchesXiang, Y. / Luo, X. / Li, W. et al. | 2010
- 295
-
Challenges of Smart System IntegrationGessner, T. / Vogel, M. / Hiller, K. / Otto, T. / Bertz, A. / Billep, D. et al. | 2010
- 301
-
Optimization of Film Uniformity by Electrochemical Copper Deposition Chamber DesignWang, X. / He, C. / Ma, Y. et al. | 2010
- 309
-
Different Interface Role in CuOx Based RRAMWu, J. / Zhou, P. / Lin, Y. / Huang, R. / Song, S. / Zou, Q. / Wu, H. / Chi, M. et al. | 2010
- 315
-
Anomalous Off-Leakage Currents in CMOS Devices and Its CountermeasuresHe, Y. / Kuo, J. / Chen, Y. / Zhou, D. / Ju, J. / Tang, J. / Zhao, Z. / Yin, M. / Lu, J. et al. | 2010
- 321
-
Method to Reduce Crystal Defects in AlCu Bond PadLuo, V. / Ding, J. / Zhan, W. / Peng, L. / Wang, A. / Liu, B. / Song, Y. / Yin, D.D. et al. | 2010
- 327
-
Thin Wafer Stencil Print CoatingSchake, J. / Whitmore, M. / Foggie, D. / Brown, M. et al. | 2010
- 339
-
STI Liner Evolution as the CMOS Scaling DownZhao, Z. / Tang, J. / Fang, Z. / Zhao, G. et al. | 2010
- 345
-
Improvement of Characteristic Ramped Voltage Breakdown in Multi-Level Cu/SiOC Low k IntegrationChen, Y. / Zou, J. / Chen, S. / Bei, E. / Wang, J. et al. | 2010
- 351
-
Growth Control of GaAs Epilayers with Specular Surface on Nonmisoriented (111)B Substrates by MBEYang, R. / Wu, Y. / Niu, C. / Yang, F. et al. | 2010
- 359
-
Mechanism Analysis of Plasma Charging Damage on Gate Oxide for HDP FSG ProcessLi, X. / Wang, P. / Bu, J. / Liu, Y. / Cao, G. / Shi, Y. / Liu, C. / Li, F. / Sun, L. et al. | 2010
- 365
-
WCVD Seam Hole Improvement to Prevent BEOL Copper DiffusionLi, X. / Ji, J. / Ou-Yang, D. / Jiang, R. / Zhang, J. / Chiu, R. / Lin, P. / Xing, C. et al. | 2010
- 371
-
Mechanism and Solution of Isb Failure on Deep Trench DRAMLi, Z. / Mo, T. / Lin, Y. / Sun, P. / Zhang, J. / Chiu, W. / Lin, P. / Xing, C. et al. | 2010
- 377
-
Crown Defect Reduction and Cp Yield Improvement for High Voltage Power Management IC ProductZhang, G. / Gu, A. / Lin, Y. / Sun, P. / Zhang, J. / Chiu, W. / Lin, P. / Xing, C. et al. | 2010
- 383
-
GOI Improvement in 65nm Sacrificial Oxide Free Process IntegrationDeng, D.Y. / Ren, H. / Fan, Q. / Ho, H. / Xu, Q. / Zhang, Z. / Zheng, K. / Wu, Y. / Gan, Z. / Ning, X. et al. | 2010
- 389
-
Physical and Electrical Characteristics of the High-K Er~2O~3 Polyoxide Deposited on Polycrystalline SiliconKao, C. / Chen, H. / Chiu, J. et al. | 2010
- 395
-
Simultaneous Double Side Grinding of Silicon Wafers: A Further Investigation into Grinding Marks PatternLi, Z. / Lin, B. / Sun, W. / Zhang, X. et al. | 2010
- 401
-
Achieving Fast Yield Improvement by Defect to Bit Failure Overlay MethodChen, C. / Zhao, J.W. / Qian, G. / Fan, J. / Li, X. et al. | 2010
- 407
-
A New Survey of Routing Algorithms in Ad hoc NetworksGhazani, S.H.N. / Lotf, J.J. / Alguliev, R. et al. | 2010
- 415
-
Mask and Wafer Topography Effects in Optical and EUV-LithographyErdmann, A. / Shao, F. / Evanschitzky, P. / Fuhner, T. et al. | 2010
- 421
-
From 2-Dimensional Lithography To 3-Dimensional StructuresVan Zeijl, H. / Wei, J. / Shen, C. / Verhaar, T.M. / Maury, P. / Sarro, L.M. et al. | 2010
- 427
-
Regularization in Inverse Lithography: Enhancing Manufacturability and Robustness to Process VariationsLam, E. et al. | 2010
- 433
-
From Computational Lithography to Computational Inspection: Inverse Lithography Technology (ILT) and Inverse Inspection Technology (IIT)Pang, L. / Peng, D. / Hu, P. / Chen, D. / Cecil, T. / He, L. / Xiao, G. / Tolani, V. / Dam, T. / Baik, K. et al. | 2010
- 443
-
ArF Scanning Exposure Tool Using High NA Projection LensCheng, J. et al. | 2010
- 449
-
Litho/Design Co-Optimization and Area Scaling for the 22-nm Logic NodeBlatchford, J.W. / Prins, S.L. / Jessen, S.W. / Dam, T. / Baik, K. / Pang, L. / Gleason, B. et al. | 2010
- 455
-
Atomic Scale Overlay ControlSmith, N.P. / Dasari, P. / Li, J. et al. | 2010
- 461
-
HVM LPP EUV Source System Development StatusLin, B. / Brandt, D. / Farrar, N. et al. | 2010
- 467
-
Mask Cleaning in EUV and Nano-Imprint LithographyZhang, Y. / Singh, S. / Chen, S. / Dress, P. / Dietze, U. et al. | 2010
- 473
-
Simulation and Experimental Study on Multilayer Double-Patterning ProcessesGuerrero, D.J. / Sullivan, D.M. / Zhu, Z. / Mercado, R.L. et al. | 2010
- 479
-
Bottom-Anti-Reflective Coatings (BARC) for LFLE Double Patterning ProcessSakamoto, R. / Endo, T. / Ho, B. / Kimura, S. / Ishida, T. / Kato, M. / Fujitani, N. / Onishi, R. / Hiroi, Y. / Maruyama, D. et al. | 2010
- 489
-
Polymer-Bound PAGs for EUV LithographyThackeray, J.W. / Aqad, E. / Kang, S. / Spear-Alfonso, K. et al. | 2010
- 497
-
Study on Circle Defect Induced by TARC (Top Anti-Reflective Coating) BubblesWang, E. / An, P. / Shu, A. / Lv, D. / Chen, Z. / Gao, J. / Lin, A. / Seo, J. et al. | 2010
- 503
-
Comparative Study of Photosensitive Versus Non-Photosensitive Developer-Soluble Bottom Anti-Reflective Coating SystemsLowes, J.A. / Stroud, C. / Guerrero, A. / Washburn, C. / Raj, P. et al. | 2010
- 509
-
Lithographic Significance of Wafer Back Surface NanotopographyVeeraraghavan, S. / Sinha, J.K. et al. | 2010
- 515
-
Effective Poly Gate CDU Control by Applying DoseMapper to 65nm and Sub-65nm Technology NodesTian, P. / Qin, L. / Shu, A. / Gu, Y. et al. | 2010
- 523
-
Source and Mask Co-Optimization Using a Gradient Based Method in Optical LithographyPeng, Y. / Zhang, J. / Wang, Y. / Yu, Z. et al. | 2010
- 533
-
CMP Process Technology in TSV ApplicationWang, Y. / Gage, M. / Xia, S. / Tu, W. / Karuppiah, L. et al. | 2010
- 539
-
Application and Advantage of CMP in Silicon Wafer ReclaimTan, C. / Xiong, S. / Zhao, R. / Xu, Y. / Wang, X. / Zhang, W. / Wang, S. et al. | 2010
- 545
-
Novel Approach for W Loss Defect Prevention on WCMP Re-Clean ProcessZhang, J. / Wang, Z. / Wen, J. / Wu, D. / Lin, P. / Xing, C. et al. | 2010
- 551
-
A Novel Si/Cu Slurry for TSV ApplicationsLee, K. / Dai, G. / Liu, V. / Wu, K. et al. | 2010
- 557
-
Study on Effects of Slurry Key Factors on Advanced Oxide CMP PerformanceSong, P. / Yao, D. / Lee, L. / Yuan, G. / Yu, C. / Xing, C. / Lin, P. / Sun, T. / Ma, Z. / Zhu, Y. et al. | 2010
- 563
-
Influence of Abrasive on CMP Quality for NiP Substrate of Computer Hard-DiskTan, B. / Niu, X. / Bian, N. / Chen, H. / Liu, Y. et al. | 2010
- 569
-
Integrated Product and Process For Copper and Barrier CMPSpiro, C.L. / Wu, K.C. / Yeh, M. / Dysard, J. / Nam, C.W. / Sun, F. et al. | 2010
- 575
-
Mosaic Diamond Pad Conditioners for Improved CMP PerformanceSung, J.C. / Tsai, M. / Pai, Y. / Chou, C. / Yang, Z. / Chen, Y. / Sung, M. et al. | 2010
- 581
-
The Black Pad with Graphite Impregnation for CMPSung, J.C. / Tsai, M. / Sung, M. et al. | 2010
- 587
-
Tribological and Kinetic Characterization of 300-mm Copper Chemical Mechanical Planarization ProcessHan, Z. / Zhuang, Y. / Sampurno, Y. / Meled, A. / Jiao, Y. / Wei, X. / Cheng, J. / Moinpour, M. / Hooper, D. / Philipossian, A. et al. | 2010
- 593
-
Investigation of Mechanical Effects on Advanced Copper CMPJing, J. / Ma, Z. / Lin, P. / Li, P. / Xing, C. / Gu, Y. / Cai, X. / Yang, X. / Shiao, D. / Yu, C. et al. | 2010
- 599
-
Effect of Pad Micro-Texture on Frictional Force, Removal Rate, and Wafer Topography during Copper CMP ProcessZhuang, Y. / Liao, X. / Borucki, L.J. / Theng, S. / Wei, X. / Ashizawa, T. / Philipossian, A. et al. | 2010
- 605
-
Effect of pH and Abrasive Concentration on Chemical Mechanical Polishing of Ge~2Sb~2Te~5Zhang, Z. / Liu, W. / Song, Z. et al. | 2010
- 613
-
High Productivity Combinatorial Analysis of Cu Post-CMP Cleans: Corrosion Protection and Queue TimeBarnes, J. / Liu, J. / Medd, S. / Tran, C. / Yin, D.D. / Zhang, P. et al. | 2010
- 619
-
Novel Post Cleaning Solutions for Next Generation Cu CMP ApplicationKo, L. / Chen, J. / Liu, V. / Wu, K. et al. | 2010
- 625
-
Copper Seed Process Optimization for Pits Defect ImprovementChen, T. / Kang, J. / Hu, A. / Xu, J. / Gong, S. / Yi, W. et al. | 2010
- 631
-
A Novel Post-CMP Electrochemical Cleaning Process Using the BDD Film Anode Combined with Special Chemical AgentsGao, B. / Zhu, Y. / Liu, Y. / Wang, S. / Zhou, Q. / Liu, X. et al. | 2010
- 639
-
The Pad Dressing Phenomena of Multiple Diamond Grits: Implications for the Design of CMP Pad ConditionersSung, J.C. / Chen, N. / Pai, Y. / Chou, C. / Hu, S. / Sung, M. et al. | 2010
- 645
-
Novel Diamond Disc Diagnostic Method Based on `Dry' Coefficient of Friction MeasurementsSampurno, Y. / Sudargho, F. / Meled, A. / Zhuang, Y. / Philipossian, A. et al. | 2010
- 651
-
Influence of Surfactant on Improving Cleanliness of Silicon WaferWeiwei, L. et al. | 2010
- 655
-
Application of Chemical Mechanical Polishing in the Infrared Focal Plane Arrays Manufacturing ProcessLiu, X. / Liu, Y. / Zhao, Z. / Hu, Y. / Gao, B. / Wang, J. et al. | 2010
- 661
-
The Cleaning of the Surface of Silicon after CMPHu, Y. / Liu, Y. / Liu, X. / Li, Y. et al. | 2010
- 667
-
Study on Surface State Control Technique of InSb Material Ultraprecision MachiningNiu, X. / Tan, B. / Xu, W. / Zhao, H. / Liu, Y. et al. | 2010
- 675
-
Characterization of PECVD UV-Transparent Silicon Oxynitride for Passivation of Non-Flash Memory DevicesHu, Z. / Chen, S. et al. | 2010
- 679
-
Advanced HDP STI Gap-Fill Development in 65nm Logic DeviceChen, Y. / Yuan, H. / Zhang, Z. / Li, N. / Chan, D. / Chen, J.C. / Li, X. / Zhao, G. et al. | 2010
- 685
-
Ta(N) Barrier Film Effect on Via RC in Advanced Cu InterconnectionLiechao, L. / Hu, A. / Kang, J. / Gong, S. / Cao, Z. et al. | 2010
- 693
-
On the Process and Material Sensitivities for High-k Based DielectricsVan Elshocht, S. / Adelmann, C. / Popovici, M. / Swerts, J. / Delabie, A. / Nyns, L. / Shi, X. / Tielens, H. / Pourtois, G. / Menou, N. et al. | 2010
- 699
-
Development of ALD HfZrO~x with TDEAH, TDEAZ and H~2OShi, X. / Tielens, H. / Takeoka, S. / Nakabayashi, T. / Nyns, L. / Adelmann, C. / Delabie, A. / Schram, T. / Ragnarsson, L. / Schaekers, M. et al. | 2010
- 705
-
High Doping HDP PSG Process DevelopmentCheng, X. / Sun, H. / Li, X. / Zhao, G. et al. | 2010
- 711
-
A Study of 65nm Silicon EtchZhao, L. / Huang, Y. / Han, B. / Zhang, H. / Han, Q. / Chang, S. et al. | 2010
- 717
-
Synchronous Pulsed Plasma for Silicon Etch ApplicationsDarnon, M. / Petit-Etienne, C. / Pargon, E. / Cunge, G. / Vallier, L. / Bodart, P. / Haas, M. / Banna, S. / Lill, T. / Joubert, O. et al. | 2010
- 725
-
Study of Alternative Plasma Strip Techniques for Advanced Photoresist RemovalLuo, S. / Escorcia, O. / Waldfried, C. / Roh, D. / Berry, I. et al. | 2010
- 731
-
Influence of the Top Chamber Window Temperature on the STI Etch ProcessShamiryan, D. / Danilkin, E. / Tinck, S. / Klick, M. / Milenin, A. / Baklanov, M.M. / Boullart, W. et al. | 2010
- 737
-
Impact of Etching Chemistry and Sidewall Profile on Contact CD and Open performance in Advanced Logic Contact EtchWang, X. / Zhang, H. / Chang, S. / Lee, K. / Sun, W. / Huang, Y. et al. | 2010
- 743
-
The Mechanism of Over-Etch in Poly-Gate EtchingZhang, Q. / Xing, T. / Yang, W. / Wang, B. / Li, B. / Yang, X. et al. | 2010
- 749
-
300mm Cu BEOL Top Trench Etch Process Development for 65nm Logic TechnologyRen, W. / Song, J. / Liu, A. / Zhao, G. / Huang, Y. / Hsieh, P. / Gu, B. / Wang, J. et al. | 2010
- 753
-
Pattern Density Effect in 65nm Logic BEOL Al-Pad EtchFu, Y. / Zhang, H. / Chang, S. / Wang, X. / Sun, W. / Huang, Y. / Yin, X. / Han, B. et al. | 2010
- 759
-
Modulation and Extraction of Schottky Barrier Height for Advanced Source/Drain ContactJiang, Y. / Li, B. et al. | 2010
- 767
-
Use of Neural Network to Model the Refractive Property of PECVD Silicon Nitride Films used to Prevent Water Permeability of Piezoresistive Pressure SensorThongvigitmanee, T. / Srihapat, A. / Khompatraporn, C. / Jiraprayuklert, A. / Titiroongruang, W. et al. | 2010
- 773
-
Study of Crater Defect Reduction in Cu Plating ProcessChen, L. / Wu, K. / He, P. / Bian, Y.J. / Zhang, J. / Lin, P. / Chiu, W. / Xing, C. et al. | 2010
- 779
-
Wafer Sticking Reduction and MTBF Improvement in AlCu Sputtering ProcessWang, X. / Li, X. / Wu, Y. / Peng, C. / Zhang, J. / Yang, H. / Lin, P. / Chiu, W. et al. | 2010
- 785
-
Investigation on Stress and Voids in Ultra-Thick Metal (UTM) Films with Electrochemical Plating ProcessesNie, J. / Yang, R. / Kang, Y. / He, W. / Liu, S. / Kong, X. et al. | 2010
- 793
-
Effect of Plating and Anneal Processes on Properties of Electroplated Copper FilmsLiu, S. / Yang, R. / Nie, J. / He, W. / Kong, X. / Kang, Y. et al. | 2010
- 801
-
Thin Wafer Handling Challenges and Emerging SolutionsFarrens, S.N. / Bisson, P. / Sood, S. / Hermanowski, J. et al. | 2010
- 807
-
3D IC Designs: Myth vs. RealityTang, J. / Wu, J. et al. | 2010
- 813
-
Cu-Cu Thermo-Compression Bonding for TSV IntegrationKim, B. / Matthias, T. / Burgstaller, D. / Zhu, S. / Kettner, P. / Jang, E. / Kim, J. / Park, Y. et al. | 2010
- 819
-
Interconnect Technologies and Advanced Packaging for High Performance ComputingShi, J. / Sze, T. / Song, D. / Huang, D. / Cunningham, J.E. et al. | 2010
- 825
-
Flip Chip Assembly Using Carbon Nanotube Bumps and Anisotropic Conductive Adhesive FilmZhang, X. / Wang, T. / Berggren, P. / Chen, S. / Liu, J. et al. | 2010
- 831
-
Advancements in Packaging Technology Driven by Global Market ReturnTodd, M. et al. | 2010
- 839
-
Studies on Cure Kinetics of a Novel Imidazole Derivative Curing Agent for Epoxy ResinLiu, L. / Li, M. / Gao, T. et al. | 2010
- 845
-
UV Curable Adhesives for Making Image Sensor PackagesKenmochi, T. et al. | 2010
- 851
-
Porosity Analysis on the Performance of Heatsink with MicrochannelsJang, J. / Chiu, H. / Yeh, H. / Wu, M. et al. | 2010
- 857
-
Improving Cost of Ownership for Underfill ApplicationsAshley, D. et al. | 2010
- 865
-
Power SO-8: An Interconnect Case StudyWong, G. et al. | 2010
- 877
-
PBGA Cost Reduction by Reducing Plated Au Thickness of Substrate PadsWang, R.Q. et al. | 2010
- 883
-
Bond Ball Optimization on UCP Die for Chip Card ModuleShen, J. / Shan, K. et al. | 2010
- 891
-
First Multi Beam Full Cut Laser Dicing of Thin Low K WafersBorkulo, J.V. / Hendriks, R. et al. | 2010
- 897
-
Electrostatic Control and the Need of Feedback Control Ionization in Critical Environment of MEMS Manufacturing ProcessChakkaew, A. / Titiroongruang, W. et al. | 2010
- 903
-
Solutions for Extending Capillary Life Correlated to Build-Up during Wire BondingLevinson, T. / Billert, O. et al. | 2010
- 909
-
Packaging of High-Temperature Power Semiconductor ModulesAng, S.S. / Rowden, B.L. / Blada, J.C. / Mantooth, H.A. et al. | 2010
- 915
-
Packaging Challenges on Shrink Chip TechnologyYang, X. / Soh, Y. / Wu, H. et al. | 2010
- 923
-
DDR2/DDR3 Interface Signal Integrity Analysis Based on IBM Generic Package ModelYin, W. / Pang, Z. / Han, H. et al. | 2010
- 929
-
Chip Card Globe Top Module Robustness StudyTan, C. / Zhang, Y. / Juan, S. / Haimerl, A. / Gisela, W. et al. | 2010
- 937
-
RF, Microwave, and Optoelectronic Packaging Die and Wire Bonding Case StudiesEvans, D.D. et al. | 2010
- 945
-
Large Graphite Films Exolved from Molten Metal CatalystChang, K. / Hsu, K. / Hu, S. / Lin, I. / Yu, C. / Sung, M. / Sung, J.C. et al. | 2010
- 951
-
Challenges and Solutions of Extremely Thin SOI (ETSOI) for CMOS Scaling to 22nm Node and BeyondCheng, K. / Khakifirooz, A. / Kulkarni, P. / Edge, L.F. / Reznicek, A. / Adam, T. / He, H. / Seo, S. / Kanakasabapathy, S. / Schmitz, S. et al. | 2010
- 959
-
Selective Epitaxial Growth of InP in STI Trenches on Off-Axis Si (001) SubstratesWang, G. / Nguyen, D. / Leys, M. / Loo, R. / Brammertz, G. / Richard, O. / Bender, H. / Dekoster, J. / Meuris, M. / Heyns, M. et al. | 2010
- 965
-
Amorphous Diamond Solar Cells with Nanodiamond Quantum WellsSung, J.C. / Kan, M. / Sung, M. et al. | 2010
- 971
-
Diamond Islands Wafer for Super LED ManufactureSung, J.C. / Kan, M. / Hu, S. / Yuan, J.C. / Sung, M. et al. | 2010
- 977
-
Moisture and Oxygen Control in Wafer Microenvironments: Challenges and System SolutionsWang, H. / Liu, Y. / Lee, P. et al. | 2010
- 985
-
Multivariate Statistical Process Control in Etching ProcessXie, K. et al. | 2010
- 995
-
Recent Advances in Thermal Processing for c-Si Solar Cell ManufacturingBao, T. / Guo, Y. / Li, L. / Zheng, X. / Bottari, F. et al. | 2010
- 1001
-
Polysilicon Materials FBR Technology for Solar and Semiconductor SiliconFisher, G.R. / Kulkarni, M. et al. | 2010
- 1007
-
Best in Class Polysilicon TechnologyHamilton, J.R. / Rami, A.C. et al. | 2010
- 1015
-
Numerical Analysis of Oxygen and Carbon Transport in a Unidirectional Solidification FurnaceGao, B. / Kakimoto, K. / Nakano, S. et al. | 2010
- 1021
-
Modeling the Early Stages of Oxygen AgglomerationKissinger, G.Z. / Dabrowski, J. / Kot, D. / Akhmetov, V. / Sattler, A. / Von Ammon, W. et al. | 2010
- 1027
-
Oxygen Precipitate Nucleation in Heavily Antimony-Doped Czochralski SiliconZhu, W. / Ma, X. / Chen, J. / Zeng, Y. / Yang, D. et al. | 2010
- 1035
-
Modeling of the 3D Unsteady Melt Flow in an Industrial-Scale Cz-Si Crystal Growth Using LES MethodLiu, X. / Liu, L. / Wang, Y. / Kakimoto, K. et al. | 2010
- 1041
-
Germanium Doping of Si Substrates for Improved Device Characteristics and YieldVanhellemont, J. / Chen, J. / Xu, W. / Yang, D. / Rafi, J. / Ohyama, H. / Simoen, E. et al. | 2010
- 1047
-
Development and Application of a Structured/Unstructured Combined Mesh Scheme for Global Modeling of a Directional Solidification Process of SiliconLi, Z. / Liu, L. / Kakimoto, K. et al. | 2010
- 1053
-
Optimization on Junction Formation by Three-Stack Furnace POCl~3 Diffusion and Analysis on Solar Cell PerformanceCheow, S. / Salwa, A. / Khairy, M. / Shahrul, A.W. / Amin, N. / Sopian, K. / Zaidi, S.H. et al. | 2010
- 1061
-
Wet Etching Technology for Semiconductor and Solar Silicon Manufacturing: Part 1 - FundamentalsErk, H.F. et al. | 2010
- 1073
-
Wet Etching Technology for Semiconductor and Solar Silicon Manufacturing: Part 2 - Process, Equipment and ImplementationErk, H.F. et al. | 2010
- 1081
-
Polishing of Semiconductor MaterialsRhoades, R.L. et al. | 2010
- 1087
-
An Overview of Current Research on Simultaneous Double Side Grinding of Silicon WafersLin, B. / Li, Z. / Sun, W. / Zhang, X. et al. | 2010
- 1093
-
The Application of Reactive Ion Etching (RIE) in Texturing of Multicrystalline Silicon Wafers for Solar CellsHu, L. / Zhao, L. / Tan, Z. et al. | 2010
- 1099
-
An Extraction Method of Solar Cell Parameters with Improved Particle Swarm OptimizationYe, M. / Zeng, S. / Xu, Y. et al. | 2010
- 1105
-
Fabrication of SB-MOSFETs on SOI Substrate Using Ni Silicide Containing Er InterlayerHosoda, W. / Ozawa, K. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. / Iwai, H. et al. | 2010
- 1111
-
Performance of Silicon Ballistic Nanowire MOSFET with Diverse Orientations and DiametersAbudukelimu, A. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. / Iwai, H. et al. | 2010
- 1117
-
The Optimization Aspect of Screen Printed Si Solar CellShahrul, A.W. / Cheow, S. / Khairy, M. / Salwa, A. / Amin, N. / Sopian, K. et al. | 2010
- 1123
-
Novel Mechanically Stacked Multi-Junction Solar Cells Applying Ultra-Thin III-V Cells and Wafer Based Germanium CellZhao, L. / Flamand, G. / Mols, Y. / Van der Heide, J. / Poortmans, J. et al. | 2010
- 1129
-
Electrical Characteristics of Rare Earth (La, Ce, Pr and Tm) Oxides/Silicates Gate DielectricMatano, K. / Funamizu, K. / Kouda, M. / Kakushima, K. / Ahmet, P. / Tsutsui, K. / Nishiyama, A. / Sugii, N. / Natori, K. / Hattori, T. et al. | 2010
- 1135
-
Copper Precipitates in Multicrystalline Silicon for Solar CellsLi, X. / Yang, D. / Yu, X. / Que, D. et al. | 2010
- 1141
-
Analysis of Elemental Impurities in Photovoltaic Silicon by Inductively Coupled Plasma Mass SpectrometryChen, J. / You, W. / Du, J. / Pan, H. et al. | 2010
- 1147
-
Laser Annealing and Local Heating Effects during Raman Measurement of Hydrogenated Amorphous Silicon FilmsYang, Y. / Peng, C. / Liu, C. et al. | 2010
- 1153
-
A Research on Thick PIN Detector with High Breakdown VoltageWu, D. / Yu, M. / Ma, S. / Zhang, L. / Wei, C. / Zhang, X. / Li, Q. / Li, G. / Wang, H. / Wang, J. et al. | 2010
- 1159
-
A Comparison of Avalanche Injection of Holes and Total Dose Radiation Effects in RadFETsTang, H. / Wang, Y. / Wang, J. / Zheng, Y. / Jin, Y. et al. | 2010