Zn-Al-Mg-Ga Alloys as Pb-Free Solder for Die-Attaching Use (English)
- New search for: Shimizu, T.
- New search for: Ishikawa, H.
- New search for: Ohnuma, I.
- New search for: Ishida, K.
- New search for: Shimizu, T.
- New search for: Ishikawa, H.
- New search for: Ohnuma, I.
- New search for: Ishida, K.
In:
JOURNAL OF ELECTRONIC MATERIALS
;
28
, 11
;
1172-1175
;
1999
-
ISSN:
- Article (Journal) / Print
-
Title:Zn-Al-Mg-Ga Alloys as Pb-Free Solder for Die-Attaching Use
-
Contributors:
-
Published in:JOURNAL OF ELECTRONIC MATERIALS ; 28, 11 ; 1172-1175
-
Publisher:
- New search for: MINERALS METALS & MATERIALS SOCIETY
-
Publication date:1999-01-01
-
Size:4 pages
-
ISSN:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
- New search for: 621.381
- Further information on Dewey Decimal Classification
-
Classification:
DDC: 621.381 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 28, Issue 11
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 1145
-
ForewordGhosh, Gautam / Kang, Sung et al. | 1999
- 1146
-
Development of under bump metallizations for flip chip bonding to organic substratesKorhonen, T. M. / Su, P. / Hong, S. J. / Korhonen, M. A. / Li, C. -Y. et al. | 1999
- 1150
-
Reliability of a flip-chip package thermally loaded between -55 deg C and 125 deg CDrexler, E.S. et al. | 1999
- 1150
-
Reliability of a flip-chip package thermally loaded between −55°C and 125°CDrexler, Elizabeth S. et al. | 1999
- 1158
-
A novel test circuit for automatically detecting electrochemical migration and conductive anodic filament formationReady, W. Jud / Turbini, Laura J. / Nickel, Roger / Fischer, John et al. | 1999
- 1164
-
Thermodynamic database for phase diagrams in micro-soldering alloysOhnuma, I. / Liu, X. J. / Ohtani, H. / Ishida, K. et al. | 1999
- 1172
-
Zn-Al-Mg-Ga alloys as Pb-free solder for die-attaching useShimizu, T. / Ishikawa, H. / Ohnuma, I. / Ishida, K. et al. | 1999
- 1176
-
Microstructural engineering of soldersSubramanian, K. N. / Bieler, T. R. / Lucas, J. P. et al. | 1999
- 1184
-
Effect of cooling rate on microstructure and mechanical properties of eutectic Sn-Ag solder joints with and without intentionally incorporated $ Cu_{6} $$ Sn_{5} $ reinforcementsSigelko, Jeff / Choi, S. / Subramanian, K. N. / Lucas, James P. / Bieler, T. R. et al. | 1999
- 1189
-
Forming high temperature solder joints through liquid phase sintering of solder pastePalmer, Mark A. / Erdman, Nicole S. / McCall, David A. et al. | 1999
- 1194
-
An improved numerical method for predicting intermetallic layer thickness developed during the formation of solder joints on Cu substratesChada, S. / Laub, W. / Fournelle, R. A. / Shangguan, D. et al. | 1999
- 1203
-
Interfacial reactions in Ag-Sn/Cu couplesChen, Sinn-Wen / Yen, Yee-Wen et al. | 1999
- 1209
-
Characterization of the growth of intermetallic interfacial layers of Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingChoi, S. / Bieler, T. R. / Lucas, J. P. / Subramanian, K. N. et al. | 1999
- 1209
-
Characterization of the growth of intermetallic interfacial layers on Sn-Ag and Sn-Pb eutectic solders and their composite solders on Cu substrate during isothermal long-term agingChoi, S. / Bieler, T.R. / Lucas, J.P. / Subramanian, K.N. et al. | 1999
- 1216
-
Pb-free surface-finishing on electronic components’ terminals for Pb-free soldering assemblyTanaka, Hitoshi / Tanimoto, Morimasa / Matsuda, Akira / Uno, Takeo / Kurihara, Masaaki / Shiga, Shoji et al. | 1999
- 1224
-
Kinetics of Copper High Pb/High Sn Bilayered Pb-Sn Solder InteractionsZuruzi, A. S. / Chiu, C.-H. / Lahiri, S. K. / Chua, K. M. et al. | 1999
- 1224
-
Kinetics of copper and high Pb/high Sn bilayered Pb-Sn solder interactionsZuruzi, A. S. / Chiu, C. -H. / Lahiri, S. K. / Chua, K. M. et al. | 1999
- 1231
-
Reaction kinetics of solder-balls with pads in BGA packages during reflow solderingHo, C. E. / Chen, Y. M. / Kao, C. R. et al. | 1999
- 1238
-
Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Pd metallizationsGhosh, G. et al. | 1999
- 1238
-
Kinetics of interfacial reaction between eutectic Sn-Pb solder and Cu/Ni/Nd metallizationsGhosh, G. et al. | 1999
- 1251
-
Effect of Ni layer thickness and soldering time on intermetallic compound formation at the interface between molten Sn-3.5Ag and Ni/Cu substrateChoi, Won Kyoung / Lee, Hyuck Mo et al. | 1999
- 1256
-
The analysis of the withdrawal force curve of the wetting curve using 63Sn-37Pb and 96.5Sn-3.5Ag eutectic soldersPark, Jae Yong / Kang, Choon Sik / Jung, Jae Pil et al. | 1999
- 1263
-
Effect of thermal cycles on the mechanical strength of quad flat pack leads/Sn-3.5Ag-X (X=Bi and Cu) solder jointsKariya, Yoshiharu / Hirata, Yasunori / Otsuka, Masahisa et al. | 1999
- 1270
-
Creep deformation behavior in eutectic Sn-Ag solder joints using a novel mapping techniqueLucas, J. P. / Guo, F. / McDougall, J. / Bieler, T. R. / Subramanian, K. N. / Park, J. K. et al. | 1999
- 1276
-
Solder joint reliability in alternator power diode assembliesPan, Tsung-Yu / White, Steven C. / Lutz, Edwin L. / Blair, Howard D. / Nicholson, John M. et al. | 1999
- 1286
-
Effect of microalloying on the creep strength and microstructure of an eutectic Sn-Pb solder alloyWade, Noboru / Akuzawa, Tatsuo / Yamada, Seiji / Sugiyama, Daigo / Kim, Ick-Soo / Miyahara, Kazuya et al. | 1999
- 1286
-
Effect of Microalloying on the Creep Strength and Microstructure on an Eutectic Sn-Pb Solder AlloyWade, N. / Akuzawa, T. / Yamada, S. / Sugiyama, D. / Kim, I.-S. / Miyahara, K. et al. | 1999
- 1290
-
Coarsening of the Sn-Pb solder microstructure in constitutive model-based predictions of solder joint thermal mechanical fatigueVianco, P. T. / Burchett, S. N. / Neilsen, M. K. / Rejent, J. A. / Frear, D. R. et al. | 1999
- 1299
-
Characterizing the weak organic acids used in low solids fluxesSmith, Brian A. / Turbini, Laura J. et al. | 1999
- 1307
-
Z-Axis anisotropic electrical conductor films in adhesive and standalone forms for electrical interconnectionXu, Yunsheng / Chung, D. D. L. et al. | 1999
- 1314
-
Development of conducting adhesive materials for microelectronic applicationsKang, Sung K. / Purushothaman, S. et al. | 1999
- 1319
-
Transient liquid phase sintering composites: Polymer adhesives with metallurgical bondsShearer, Catherine / Shearer, Bryan / Matijasevic, Goran / Gandhi, Pradeep et al. | 1999