Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress Data (English)
- New search for: Xie, J.
- New search for: He, J.-J.
- New search for: Zhang, Y.
- New search for: Freda, M.
- New search for: Xie, J.
- New search for: He, J.-J.
- New search for: Zhang, Y.
- New search for: Freda, M.
In:
IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES
;
31
, 3
;
634-641
;
2008
-
ISSN:
- Article (Journal) / Print
-
Title:Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress Data
-
Contributors:
-
Published in:IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES ; 31, 3 ; 634-641
-
Publisher:
- New search for: IEEE PUBLICATION
-
Publication date:2008-01-01
-
Size:8 pages
-
ISSN:
-
Type of media:Article (Journal)
-
Type of material:Print
-
Language:English
- New search for: 621.3
- Further information on Dewey Decimal Classification
-
Classification:
DDC: 621.3 -
Source:
© Metadata Copyright the British Library Board and other contributors. All rights reserved.
Table of contents – Volume 31, Issue 3
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
- 525
-
Table of contents| 2008
- 527
-
The Measurement of Ion Diffusion in Epoxy Molding Compounds by Dynamic Secondary Ion Mass SpectroscopyLantz, L. / Pecht, M.G. / Wood, M. et al. | 2008
- 536
-
Modeling of Cylindrical Pin-Fin Heat Sinks for Electronic PackagingKhan, W.A. / Culham, J.R. / Yovanovich, M.M. et al. | 2008
- 546
-
Impact of Design on High-Frequency Performance of Advanced MIM Capacitors Using Si $_{3}$N $_{4}$ Dielectric LayersPiquet, J. / Bermond, C. / Thomas, M. / Farcy, A. / Lacrevaz, T. / Blampey, B. / Torres, J. / Flechet, B. / Angenieux, G. et al. | 2008
- 552
-
Enhanced Hot Spot Cooling Using Bonded Superlattice Microcoolers With a Trench StructureYan Zhang, / Gehong Zeng, / Hoffman, C. / Bar-Cohen, A. / Shakouri, A. et al. | 2008
- 559
-
Effects of Thermal Cycling on Material Properties of Nonconductive Pastes (NCPs) and the Relationship Between Material Properties and Warpage Behavior During Thermal CyclingKyung-Woon Jang, / Hyoung-Joon Kim, / Chang-Kyu Chung, / Kyung-Wook Paik, et al. | 2008
- 566
-
Displacement Measurements at a Connector Contact Interface Employing a Novel Thick Film SensorYu-Zhi Lam, / McBride, J.W. / Maul, C. / Atkinson, J.K. et al. | 2008
- 574
-
Interfacial Reaction Between Molten Sn-Bi Based Solders and Electroless Ni-P Coatings for Liquid Solder InterconnectsJianfeng Li, / Mannan, S.H. / Clode, M.P. / Liu, C. / Chen, K. / Whalley, D.C. / Hutt, D.A. / Conway, P.P. et al. | 2008
- 586
-
Comparing the Impacts of the Capillary and the Molded Underfill Process on the Reliability of the Flip-Chip BGAChen, K.M. et al. | 2008
- 592
-
The Relationship Between Surface Wear and Contact Resistance During the Fretting of In-Vivo Electrical ContactsMcBride, J.W. et al. | 2008
- 601
-
High-Frequency Transmission Lines Crosstalk Reduction Using Spacing RulesMbairi, F.D. / Siebert, W.P. / Hesselbom, H. et al. | 2008
- 611
-
An Efficient Network Model for Determining the Effective Thermal Conductivity of Particulate Thermal Interface MaterialsKanuparthi, S. / Subbarayan, G. / Siegmund, T. / Sammakia, B. et al. | 2008
- 622
-
Constitutive Behavior of Sn3.8Ag0.7Cu and Sn1.0Ag0.5Cu Alloys at Creep and Low Strain Rate RegimesBhate, D. / Chan, D. / Subbarayan, G. / Tz Cheng Chiu, / Gupta, V. / Edwards, D.R. et al. | 2008
- 634
-
Determination of Acceleration Factor in Predicting the Field Life of Plated Through Holes From Thermal Stress DataJingsong Xie, / Jing-Jing He, / Yuan Zhang, / Freda, M. et al. | 2008
- 642
-
Thermal Analysis of a Novel Compact Packaged Passively Cooled Laser Diode ArrayCong Yin, / Lei Huang, / Fahong He, / Mali Gong, et al. | 2008
- 650
-
Forced Air Cooling of CPUs With Heat Sinks: A Numerical StudyOzturk, E. / Tari, I. et al. | 2008
- 661
-
Numerical Investigation of Underfill Failure Due to Phase Change of Pb-Free Flip Chip Solders During Board-Level ReflowSoonwan Chung, / Park, S.B. et al. | 2008
- 670
-
Effects of Glue on the Bend Performance of Flip Chip PackagesMeyyappan, K. / McAllister, A. / Kochanowski, M. / Ife Hsu, et al. | 2008
- 678
-
Fabrication and Characterization of Coplanar Waveguides on Silicon Using a Combination of SiO $_{2}$ and SRO $_{20}$Leal-Romero, R. / Zuniga-Juarez, J.E. / Zaldivar-Huerta, I.E. / del Carmen Maya-Sanchez, M. / Aceves-Mijares, M. / Reynoso-Hernandez, J.A. et al. | 2008
- 683
-
Correlation Between Measurement and Simulation of Thermal Warpage in PBGA With Consideration of Molding Compound Residual StrainMing-Yi Tsai, / Chen, Y.-C. / Lee, S.W.R. et al. | 2008
- 691
-
High Heat Flux Two-Phase Cooling in Silicon MultimicrochannelsAgostini, B. / Thome, J.R. / Fabbri, M. / Michel, B. et al. | 2008
- 702
-
Reliability Study of High-Density EBGA Packages Using the Cu Metallized SiliconLiyu Yang, / Bernstein, J. et al. | 2008
- 712
-
Creep and Fatigue Behavior of SnAg Solders With Lanthanum DopingMin Pei, / Jianmin Qu, et al. | 2008
- 719
-
Fluxless Hermetic Lid Sealing Using Electroplated Sn-Rich SolderKim, J.S. / Wang, P.J. / Lee, C.C. et al. | 2008
- 726
-
A Comparison of Statistical Distribution Functions to Predict BGA Attach ReliabilityWeifeng Liu, / Lewis, R. et al. | 2008
- 734
-
Effect of Nickel Pad Metallization Thickness on Fatigue Failure of BGA Lead-Free Solder JointsOmiya, M. / Miyazaki, T. / Kishimoto, K. / Amagai, M. et al. | 2008
- 741
-
Addressing Obsolescence—The Uprating OptionPecht, M.G. / Humphrey, D. et al. | 2008
- 741
-
OPEN FORUM - Addressing Obsolescence — The Uprating OptionPecht, M.G. et al. | 2008
- C1
-
[Front cover]| 2008
- C2
-
IEEE Transactions on Components and Packaging Technologies publication information| 2008
- C3
-
IEEE Components, Packaging, and Manufacturing Technology Society Information for authors| 2008
- C4
-
IEEE Components, Packaging, and Manufacturing Technology Society Information| 2008