Through-silicon vias in SiGe BiCMOS and interposer technologies for sub-THz applications (English)
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- New search for: Wietstruck, Matthias
- Further information on Wietstruck, Matthias:
- http://d-nb.info/gnd/1306212898
- New search for: Wietstruck, Matthias
- Further information on Wietstruck, Matthias:
- http://d-nb.info/gnd/1306212898
2023
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ISBN:
- Theses / Electronic Resource
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Title:Through-silicon vias in SiGe BiCMOS and interposer technologies for sub-THz applications
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Contributors:Wietstruck, Matthias ( author )
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Dissertation:Dissertation, Technische Universität Chemnitz ; 2023
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Publisher:
- New search for: Universitätsverlag Chemnitz
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Place of publication:Chemnitz
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Publication date:2023
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Size:1 Online-Ressource (210 Seiten)
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Remarks:Digital preservation by Technische Universität Chemnitz
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ISBN:
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Type of media:Theses
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Type of material:Electronic Resource
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Language:English
- New search for: 620
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Keywords:
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Classification:
DDC: 620 -
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