IEEE International 3D Systems Integration Conference (3DIC), 2010 : 16 - 18 Nov. 2010, Munich, Germany (English)
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- New search for: Institute of Electrical and Electronics Engineers
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- http://d-nb.info/gnd/1692-5
2010
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ISBN:
- Conference Proceedings / Electronic Resource
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Title:IEEE International 3D Systems Integration Conference (3DIC), 2010 : 16 - 18 Nov. 2010, Munich, Germany
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Contributors:
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Conference:IEEE International 3D Systems Integration Conference ; 2 ; 2010 ; Munich
3DIC ; 2 ; 2010 ; Munich
IEEE International 3D System Integration Conference ; 2 ; 2010 ; Munich
IEEE 3DIC Conference ; 2 ; 2010 ; Munich -
Publisher:
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Place of publication:Piscataway, NJ
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Publication date:2010
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Size:Online-Ressource
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Remarks:Parallel als Druckausg. erschienen
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ISBN:
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Type of media:Conference Proceedings
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Type of material:Electronic Resource
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Language:English
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Keywords:
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Classification:
BKL: 53.56 Halbleitertechnologie -
Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Content| 2010
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Welcome to the IEEE International: 3D system integration conference (3DIC)| 2010
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Thermal isolation in 3D chip stacks using vacuum gaps and capacitive or inductive communicationsFranzon, Paul / Wilson, John / Li, Ming et al. | 2010
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Evaluation of alignment accuracy on chip-to-wafer self-assembly and mechanism on the direct chip bonding at room temperatureFukushima, T / Iwata, E / Bea, J / Murugesan, M / Lee, K / Tanaka, T / Koyanagi, M et al. | 2010