Professional program proceedings : Electro 98, June 9-11, 1998, Bayside Exposition Center, Boston, MA, USA (English)
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- New search for: Electronics Representatives Association (U.S.)
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- New search for: Electro 98
- New search for: Central New England Regional Council
- New search for: Electronics Representatives Association (U.S.)
- New search for: Institute of Electrical and Electronics Engineers
1998
- Conference Proceedings / Electronic Resource
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Title:Professional program proceedings : Electro 98, June 9-11, 1998, Bayside Exposition Center, Boston, MA, USA
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Contributors:
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Conference:Electro 98
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Publisher:
- New search for: Institute of Electrical and Electronics Engineers
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Place of publication:[New York]
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Publication date:1998
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Size:1 Online-Ressource (273 pages)
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Remarks:illustrations
"IEEE catalog number: 98CH36240"--Title page verso
Includes bibliographical references and index -
ISBN:
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Type of media:Conference Proceedings
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Type of material:Electronic Resource
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Language:English
- New search for: 621.38224
- Further information on Dewey Decimal Classification
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Keywords:
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Classification:
DDC: 621.38224 -
Source:
Table of contents conference proceedings
The tables of contents are generated automatically and are based on the data records of the individual contributions available in the index of the TIB portal. The display of the Tables of Contents may therefore be incomplete.
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Professional Program Proceedings. Electro 98 (Cat. No.98CH36240)| 1998
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Solder Paste in SMT: A Training PerspectivePeck, D. / IEEE / Electronics Representatives Association et al. | 1998
- 15
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Bonding and handling procedure for (TM)GMIC flip-chip devicesSanteusanio, D. et al. | 1998
- 15
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Bonding and Handling Procedures for GMIC Flip-Chip DevicesSanteusanio, D. / IEEE / Electronics Representatives Association et al. | 1998
- 21
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PQFP Moisture Bake-out Process OptimizationAtlas, G. / IEEE / Electronics Representatives Association et al. | 1998
- 37
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Ball Grid Array (BGA) Solder Joint Integrity EnhancementLee, S. / IEEE / Electronics Representatives Association et al. | 1998
- 45
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High Density SMT Assemblies Based on Flex SubstratesKeating, J. / IEEE / Electronics Representatives Association et al. | 1998
- 53
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Microvia PWB's: Do They Cost More?Singer, A. T. / IEEE / Electronics Representatives Association et al. | 1998
- 65
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Noise Filtering on CablesHill, L. / IEEE / Electronics Representatives Association et al. | 1998
- 83
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Follow These 18 Rules for Better EMC DesignCurtis, J. / IEEE / Electronics Representatives Association et al. | 1998
- 97
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EMC Testing: For Some, It's Mandatory-Why Not Do it the Most Cost Effective Way and Get Some Added Benefits as Well?Hopkins, M. / IEEE / Electronics Representatives Association et al. | 1998
- 159
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Measurement of Potential Magnetic Field Interference with Implanted Cardioverter Defibrillators or PacemakersAshley, J. R. / IEEE / Electronics Representatives Association et al. | 1998
- 171
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Power Lines, Cancer, and Erroneous PhysicsAshley, J. R. / IEEE / Electronics Representatives Association et al. | 1998
- 181
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The European Union Machinery Directive 89/392/EEC: Removing the MysteryGeppert, J. / IEEE / Electronics Representatives Association et al. | 1998
- 221
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Dual Mode CDMA Networks: Capacity, Planning and OptimizationGanesh, R. / IEEE / Electronics Representatives Association et al. | 1998
- 241
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Receiver Structures for Signals with Unknown Frequency and Time-of ArrivalSchonhoff, T. / IEEE / Electronics Representatives Association et al. | 1998
- 257
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Test and Measurement for Fiber Optic CommunicationsHayes, J. / IEEE / Electronics Representatives Association et al. | 1998