Through-substrate via and redistribution layer with metal paste (English)
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- New search for: Roozeboom, F.
- New search for: Grunsven, van, E.C.E.
- New search for: Sanders, F.H.M.
- New search for: Burghoorn, M.M.A.
- New search for: Roozeboom, F.
- New search for: Grunsven, van, E.C.E.
- New search for: Sanders, F.H.M.
- New search for: Burghoorn, M.M.A.
2013
- Patent / Electronic Resource
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Title:Through-substrate via and redistribution layer with metal paste
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Contributors:Roozeboom, F. ( author ) / Grunsven, van, E.C.E. ( author ) / Sanders, F.H.M. ( author ) / Burghoorn, M.M.A. ( author )
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Publication date:2013-03-12
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Remarks:Roozeboom , F , Grunsven, van , E C E , Sanders , F H M & Burghoorn , M M A Mar. 12 2013 , Through-substrate via and redistribution layer with metal paste , Patent No. US8395267 .
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Type of media:Patent
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Type of material:Electronic Resource
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Language:English
- New search for: 500
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Classification:
DDC: 500 -
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