Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs (Unknown)
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In:
Electronics, Vol 9, Iss 9, p 1341 (2020)
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2020
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ISSN:
- Article (Journal) / Electronic Resource
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Title:Analysis of the Multi-Steps Package (MSP) for Series-Connected SiC-MOSFETs
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Contributors:Luciano F. S. Alves ( author ) / Pierre Lefranc ( author ) / Pierre-Olivier Jeannin ( author ) / Benoit Sarrazin ( author ) / Jean-Christophe Crebier ( author )
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Published in:
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Publisher:
- New search for: MDPI AG
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Publication date:2020
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ISSN:
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DOI:
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Type of media:Article (Journal)
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Type of material:Electronic Resource
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Language:Unknown
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Keywords:
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Source:
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