Solder strip and preparation method thereof (Chinese)
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2022
- Patent / Electronic Resource
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Title:Solder strip and preparation method thereof
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Additional title:焊带和焊带的制备方法
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Patent number:CN113903821
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Patent applicant:
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Patent family:
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Contributors:PU TIAN ( author ) / PENG WENXIN ( author )
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Publisher:
- New search for: Europäisches Patentamt
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Publication date:2022-01-07
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Type of media:Patent
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Type of material:Electronic Resource
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Language:Chinese
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Classification:
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